the substrate comprising an insulating body on a semiconductor body

Industry

CPC
H01L27/1203

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/1203the substrate comprising an insulating body on a semiconductor body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Thin film transistor based temperature sensor
- Patent number 12,146,798
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Lien Linus Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective polysilicon growth for deep trench polysilicon isolation...
- Patent number 12,148,756
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory having both volatile and non-volatile function...
- Patent number 12,148,472
- Issue date Nov 19, 2024
- Zeno Semiconductor, Inc.
- Yuniarto Widjaja
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Front-side-type image sensor
- Patent number 12,148,755
- Issue date Nov 19, 2024
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a thermal contact and method of making
- Patent number 12,142,542
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon and silicon germanium nanowire structures
- Patent number 12,142,634
- Issue date Nov 12, 2024
- Sony Group Corporation
- Kelin J. Kuhn
- B82 - NANO-TECHNOLOGY
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 12,136,562
- Issue date Nov 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside electrical contacts to buried power rails
- Patent number 12,136,655
- Issue date Nov 5, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device with improved gate ins...
- Patent number 12,137,556
- Issue date Nov 5, 2024
- Renesas Electronics Corporation
- Yuto Omizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and memory...
- Patent number 12,125,737
- Issue date Oct 22, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Isolation region fabrication for replacement gate processing
- Patent number RE50181
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Brent A. Anderson
Information Patent Grant
Method to form a fin structure on deep trenches for a semiconductor...
- Patent number 12,125,873
- Issue date Oct 22, 2024
- HeFeChip Corporation Limited
- Liang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor and method of manufacturing the same
- Patent number 12,125,907
- Issue date Oct 22, 2024
- Electronics and Telecommunications Research Institute
- Seong Hyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced bonding between III-V material and oxide material
- Patent number 12,119,309
- Issue date Oct 15, 2024
- OpenLight Photonics, Inc.
- Avi Feshali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Symmetric FET for RF nonlinearity improvement
- Patent number 12,113,057
- Issue date Oct 8, 2024
- pSemi Corporation
- Tero Tapio Ranta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pseudo-substrate with improved efficiency of usage of single crysta...
- Patent number 12,112,976
- Issue date Oct 8, 2024
- Soitec
- Fabrice Letertre
- C30 - CRYSTAL GROWTH
Information Patent Grant
Thermal extraction of single layer transfer integrated circuits
- Patent number 12,113,069
- Issue date Oct 8, 2024
- Murata Manufacturing Co., Ltd.
- Abhijeet Paul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
S-contact for SOI
- Patent number 12,100,707
- Issue date Sep 24, 2024
- pSemi Corporation
- Befruz Tasbas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 12,100,611
- Issue date Sep 24, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,094,704
- Issue date Sep 17, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Le Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing the same
- Patent number 12,094,758
- Issue date Sep 17, 2024
- United Microelectronics Corp.
- Tien-Tsai Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor device having a thermal contact
- Patent number 12,094,799
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip
- Patent number 12,080,805
- Issue date Sep 3, 2024
- SOCIONEXT INC.
- Hiroyuki Shimbo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 12,080,716
- Issue date Sep 3, 2024
- Renesas Electronics Corporation
- Takaaki Tsunomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for trench isolation
- Patent number 12,074,169
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for use in improving linearity of MOSFETs usin...
- Patent number 12,074,217
- Issue date Aug 27, 2024
- pSemi Corporation
- Christopher N. Brindle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with bonding and DRAM memory...
- Patent number 12,068,187
- Issue date Aug 20, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor-on-insulator (SOI) substrate and method for forming
- Patent number 12,062,539
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Distributed FET back-bias network
- Patent number 12,051,701
- Issue date Jul 30, 2024
- pSemi Corporation
- Simon Edward Willard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contaminant collection on SOI
- Patent number 12,046,602
- Issue date Jul 23, 2024
- Texas Instruments Incorporated
- Honglin Guo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURE OF HIGH-RESISTIVITY SILICON-ON-INSULATOR EMBEDDED WITH CH...
- Publication number 20240387241
- Publication date Nov 21, 2024
- ZING SEMICONDUCTOR CORPORATION
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM TRANSISTOR BASED TEMPERATURE SENSOR
- Publication number 20240385056
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Lien Linus LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID INTEGRATED CIRCUIT DIES
- Publication number 20240379462
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hong-Shyang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE POLYSILICON GROWTH FOR DEEP TRENCH POLYSILICON ISOLATION...
- Publication number 20240379684
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP WITH GOOD THERMAL DISSIPATION PERFORMANCE
- Publication number 20240379486
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING RC DELAY IN SEMICONDUCTOR DEVICES
- Publication number 20240379563
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING INTERGATE SPACER AND METHODS O...
- Publication number 20240371880
- Publication date Nov 7, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- SEUNGCHAN YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING LOCALIZED SEMICONDUCTOR-ON-INSULATO...
- Publication number 20240371943
- Publication date Nov 7, 2024
- ATOMERA INCORPORATED
- DONGHUN KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC STRUCTURE FOR CONNECTED CAPACITANCES AND METHOD OF FORMING SAME
- Publication number 20240371879
- Publication date Nov 7, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Germain Bossu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ON INSULATOR HAVING A SEMICONDUCTOR LAYER WITH DIFFER...
- Publication number 20240371882
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR TRENCH ISOLATION
- Publication number 20240371881
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuan-Jung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20240363385
- Publication date Oct 31, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING FIELD EFFECT TRANSISTOR FORMED ON SO...
- Publication number 20240363750
- Publication date Oct 31, 2024
- RENESAS ELECTRONICS CORPORATION
- Kazuya UEJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE AND METHOD FOR FORMING
- Publication number 20240355618
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR SYSTEM WITH A MICROELECTROMECHANICAL SENSOR ELEMENT AND METH...
- Publication number 20240343555
- Publication date Oct 17, 2024
- Infineon Technologies Dresden GmbH & Co. KG
- Dirk MEINHOLD
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Transient Stabilized SOI FETs
- Publication number 20240347482
- Publication date Oct 17, 2024
- pSemi Corporation
- Robert Mark Englekirk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTAMINANT COLLECTION ON SOI
- Publication number 20240339457
- Publication date Oct 10, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Honglin Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUANTUM ELECTRONIC CIRCUIT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240321893
- Publication date Sep 26, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Heimanu NIEBOJEWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONSTRAINED EPITAXIAL FORMATION USING DIELECTRIC WALLS
- Publication number 20240321892
- Publication date Sep 26, 2024
- Intel Corporation
- Leonard P. Guler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BREAKDOWN VOLTAGE CAPABILITY OF HIGH VOLTAGE DEVICE
- Publication number 20240321894
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Chih CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND HIGH FREQUENCY SWITCH
- Publication number 20240321773
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Kazuya NISHIHORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Leakage Replacement Metal Gate FET
- Publication number 20240313081
- Publication date Sep 19, 2024
- MURATA MANUFACTURING CO., LTD.
- Jagar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
- Publication number 20240304617
- Publication date Sep 12, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING RADIO FREQUENCY SILICON-ON-INSULATOR (RFSOI) STRU...
- Publication number 20240304493
- Publication date Sep 12, 2024
- ATOMERA INCORPORATED
- HIDEKI TAKEUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK FOR SOI
- Publication number 20240297091
- Publication date Sep 5, 2024
- Qorvo US, Inc.
- Baker Scott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON-ON-INSULATOR SUBSTRATE INCLUDING TRAP-RICH LAYER AND METHOD...
- Publication number 20240297070
- Publication date Sep 5, 2024
- Ron Bowman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240290791
- Publication date Aug 29, 2024
- RENESAS ELECTRONICS CORPORATION
- Tetsuya YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Component Including an Electronic Component Based on...
- Publication number 20240282774
- Publication date Aug 22, 2024
- Infineon Technologies Dresden GmbH & Co. KG
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES
- Publication number 20240282773
- Publication date Aug 22, 2024
- Samsung Electronics Co., Ltd.
- Seokhyeon Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240274670
- Publication date Aug 15, 2024
- RENESAS ELECTRONICS CORPORATION
- Yoshiki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS

the substrate comprising an insulating body on a semiconductor body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thin film transistor based temperature sensor

Selective polysilicon growth for deep trench polysilicon isolation...

Semiconductor memory having both volatile and non-volatile function...

Front-side-type image sensor

Semiconductor device having a thermal contact and method of making

Silicon and silicon germanium nanowire structures

3D semiconductor device and structure with single-crystal layers

Backside electrical contacts to buried power rails

Method of manufacturing semiconductor device with improved gate ins...

3D semiconductor device and structure with metal layers and memory...

Isolation region fabrication for replacement gate processing

Method to form a fin structure on deep trenches for a semiconductor...

Semiconductor and method of manufacturing the same

Enhanced bonding between III-V material and oxide material

Symmetric FET for RF nonlinearity improvement

Pseudo-substrate with improved efficiency of usage of single crysta...

Thermal extraction of single layer transfer integrated circuits

S-contact for SOI

Methods for producing a 3D semiconductor device and structure with...

Semiconductor device and method of fabricating the same

Semiconductor structure and method for manufacturing the same

Method of making a semiconductor device having a thermal contact

Semiconductor chip

Method of manufacturing semiconductor device

Structures and methods for trench isolation

Method and apparatus for use in improving linearity of MOSFETs usin...

3D semiconductor device and structure with bonding and DRAM memory...

Semiconductor-on-insulator (SOI) substrate and method for forming

Distributed FET back-bias network

Contaminant collection on SOI

Patents Applicationslast 30 patents

STRUCTURE OF HIGH-RESISTIVITY SILICON-ON-INSULATOR EMBEDDED WITH CH...

THIN FILM TRANSISTOR BASED TEMPERATURE SENSOR

HYBRID INTEGRATED CIRCUIT DIES

SELECTIVE POLYSILICON GROWTH FOR DEEP TRENCH POLYSILICON ISOLATION...

INTEGRATED CHIP WITH GOOD THERMAL DISSIPATION PERFORMANCE

REDUCING RC DELAY IN SEMICONDUCTOR DEVICES

INTEGRATED CIRCUIT DEVICES INCLUDING INTERGATE SPACER AND METHODS O...

SEMICONDUCTOR DEVICES INCLUDING LOCALIZED SEMICONDUCTOR-ON-INSULATO...

IC STRUCTURE FOR CONNECTED CAPACITANCES AND METHOD OF FORMING SAME

SEMICONDUCTOR ON INSULATOR HAVING A SEMICONDUCTOR LAYER WITH DIFFER...

STRUCTURES AND METHODS FOR TRENCH ISOLATION

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

SEMICONDUCTOR DEVICE INCLUDING FIELD EFFECT TRANSISTOR FORMED ON SO...

SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE AND METHOD FOR FORMING

SENSOR SYSTEM WITH A MICROELECTROMECHANICAL SENSOR ELEMENT AND METH...

Transient Stabilized SOI FETs

CONTAMINANT COLLECTION ON SOI

QUANTUM ELECTRONIC CIRCUIT AND METHOD FOR MANUFACTURING THE SAME

CONSTRAINED EPITAXIAL FORMATION USING DIELECTRIC WALLS

BREAKDOWN VOLTAGE CAPABILITY OF HIGH VOLTAGE DEVICE

SEMICONDUCTOR DEVICE AND HIGH FREQUENCY SWITCH

Low Leakage Replacement Metal Gate FET

3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS

METHOD FOR MAKING RADIO FREQUENCY SILICON-ON-INSULATOR (RFSOI) STRU...

HEAT SINK FOR SOI

SILICON-ON-INSULATOR SUBSTRATE INCLUDING TRAP-RICH LAYER AND METHOD...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Component Including an Electronic Component Based on...

INTEGRATED CIRCUIT DEVICES

SEMICONDUCTOR DEVICE