the terminals being coated on the capacitive element

Industry

CPC
H01G4/252

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Parent Industries

HELECTRICITY H01Electric elements H01GCAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE H01G4/00Fixed capacitors Processes of their manufacture

Current Industry

H01G4/252the terminals being coated on the capacitive element

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic component
- Patent number 11,894,195
- Issue date Feb 6, 2024
- TDK Corporation
- Yoji Tozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic device and manufacturing method of ceramic elect...
- Patent number 11,749,458
- Issue date Sep 5, 2023
- Taiyo Yuden Co., Ltd.
- Mikio Tahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip component
- Patent number 11,705,285
- Issue date Jul 18, 2023
- Rohm Co., Ltd.
- Keisuke Fukae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip electronic component
- Patent number 11,688,555
- Issue date Jun 27, 2023
- Murata Manufacturing Co., Ltd.
- Yukihiro Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor and circuit board containing the same
- Patent number 11,636,978
- Issue date Apr 25, 2023
- KYOCERA AVX Components Corporation
- Jeffrey Cain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a multilayer ceramic electronic component
- Patent number 11,600,445
- Issue date Mar 7, 2023
- Murata Manufacturing Co., Ltd.
- Yusuke Yokota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with baked electrodes and having a continuousl...
- Patent number 11,450,483
- Issue date Sep 20, 2022
- Murata Manufacturing Co., Ltd.
- Toru Yaso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and manufacturing method for the same
- Patent number 11,398,342
- Issue date Jul 26, 2022
- Murata Manufacturing Co., Ltd.
- Jun Adachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip component
- Patent number 11,342,125
- Issue date May 24, 2022
- Rohm Co., Ltd.
- Keisuke Fukae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 11,227,722
- Issue date Jan 18, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Taek Jung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 11,227,721
- Issue date Jan 18, 2022
- TDK Corporation
- Yoji Tozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal paths for glass substrates
- Patent number 11,177,065
- Issue date Nov 16, 2021
- QUALCOMM Incorporated
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for electronic component including electrode f...
- Patent number 11,170,935
- Issue date Nov 9, 2021
- Murata Manufacturing Co., Ltd.
- Eiji Iso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing ceramic electronic component
- Patent number 11,120,943
- Issue date Sep 14, 2021
- Murata Manufacturing Co., Ltd.
- Yosuke Terashita
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Thin-film capacitor
- Patent number 11,114,249
- Issue date Sep 7, 2021
- TDK Corporation
- Koichi Tsunoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip electronic component
- Patent number 10,971,301
- Issue date Apr 6, 2021
- Murata Manufacturing Co., Ltd.
- Yukihiro Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor component
- Patent number 10,903,003
- Issue date Jan 26, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chang Soo Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method of manufacturing same
- Patent number 10,879,005
- Issue date Dec 29, 2020
- Murata Manufacturing Co., Ltd.
- Yoshifumi Maki
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Thin film capacitor having an outer layer including a second conduc...
- Patent number 10,840,025
- Issue date Nov 17, 2020
- TDK Corporation
- Hitoshi Saita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing electronic component
- Patent number 10,770,205
- Issue date Sep 8, 2020
- Murata Manufacturing Co., Ltd.
- Haruhiko Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 10,763,042
- Issue date Sep 1, 2020
- TDK Corporation
- Shinya Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor and method for manufacturing capacitor
- Patent number 10,734,164
- Issue date Aug 4, 2020
- MURATA MANUFACTURING CO., LTD.
- Yoshifumi Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor and board having the same
- Patent number 10,665,393
- Issue date May 26, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Jeong Hoon Ryou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer component having internal electrodes alternatingly conne...
- Patent number 10,608,163
- Issue date Mar 31, 2020
- EPCOS AG
- Dieter Somitsch
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
High-density metal-insulator-metal capacitors
- Patent number 10,580,581
- Issue date Mar 3, 2020
- GLOBALFOUNDRIES Inc.
- Robert J. Fox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor and method of manufacturing the same
- Patent number 10,580,579
- Issue date Mar 3, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Seung Woo Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and substrate including electronic component
- Patent number 10,438,749
- Issue date Oct 8, 2019
- Murata Manufacturing Co., Ltd.
- Yoshinao Nishioka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component
- Patent number 10,395,827
- Issue date Aug 27, 2019
- Murata Manufacturing Co., Ltd.
- Shuichi Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low inductance capacitor
- Patent number 10,388,460
- Issue date Aug 20, 2019
- Ford Global Technologies, LLC
- Guangyin Lei
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method for producing a multilayer component
- Patent number 10,217,927
- Issue date Feb 26, 2019
- EPCOS AG
- Dieter Somitsch
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
Single Layer Capacitor
- Publication number 20240136123
- Publication date Apr 25, 2024
- KYOCERA AVX Components Corporation
- Ronald S. Demcko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240087809
- Publication date Mar 14, 2024
- Murata Manufacturing Co., Ltd.
- Toshiyuki Nakaiso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240087813
- Publication date Mar 14, 2024
- MURATA MANUFACTURING CO., LTD.
- Hirofumi OIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-DRILLED VIAS TO CAPTURE DOUBLE SIDED CAPACITANCE
- Publication number 20240021372
- Publication date Jan 18, 2024
- SARAS MICRO DEVICES, INC.
- Courtney Timms
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC MATERIAL FOR CAPACITOR
- Publication number 20230268126
- Publication date Aug 24, 2023
- TDK Electronics AG
- Thorsten Bayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT, ELECTRONIC COMPONENT MANUFACTURING METHOD, CA...
- Publication number 20230223194
- Publication date Jul 13, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- HIROKI TAKEOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20220415578
- Publication date Dec 29, 2022
- Creative Coatings Co., Ltd.
- Eiji SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer Capacitor and Circuit Board Containing the Same
- Publication number 20220392705
- Publication date Dec 8, 2022
- KYOCERA AVX Components Corporation
- Jeffrey Cain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR
- Publication number 20220384113
- Publication date Dec 1, 2022
- Taiyo Yuden Co., Ltd.
- Yoshinari TAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANO-INKS OF CARBON NANOMATERIALS FOR PRINTING AND COATING
- Publication number 20220363931
- Publication date Nov 17, 2022
- Kansas State University Research Foundation
- Suprem R. Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CAPACITANCE DEVICE
- Publication number 20220336155
- Publication date Oct 20, 2022
- Murata Manufacturing Co., Ltd.
- Takeshi Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP COMPONENT
- Publication number 20220254572
- Publication date Aug 11, 2022
- Rohm Co., Ltd.
- Keisuke FUKAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20220068565
- Publication date Mar 3, 2022
- TDK Corporation
- Yoji TOZAWA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
THERMAL PATHS FOR GLASS SUBSTRATES
- Publication number 20210304944
- Publication date Sep 30, 2021
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP COMPONENT
- Publication number 20210043387
- Publication date Feb 11, 2021
- Rohm Co., Ltd.
- Keisuke FUKAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20210005386
- Publication date Jan 7, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Taek Jung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20200082986
- Publication date Mar 12, 2020
- Murata Manufacturing Co., Ltd.
- Toru Yaso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM CAPACITOR
- Publication number 20200013554
- Publication date Jan 9, 2020
- TDK CORPORATION
- Koichi TSUNODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR COMPONENT
- Publication number 20190237251
- Publication date Aug 1, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Chang Soo JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED ELECTRONIC COMPONENT AND MOUNTING STRUCTURE THEREOF
- Publication number 20190206628
- Publication date Jul 4, 2019
- Kyocera Corporation
- Michiaki NISHIMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer Component
- Publication number 20190189895
- Publication date Jun 20, 2019
- EPCOS AG
- Dieter Somitsch
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
HIGH-DENSITY METAL-INSULATOR-METAL CAPACITORS
- Publication number 20190148072
- Publication date May 16, 2019
- GLOBALFOUNDRIES INC.
- Robert J. Fox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20190131072
- Publication date May 2, 2019
- TDK Corporation
- Shinya ONODERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190074138
- Publication date Mar 7, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Seung Woo SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20190066909
- Publication date Feb 28, 2019
- MURATA MANUFACTURING CO., LTD.
- Shinji OTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20180337001
- Publication date Nov 22, 2018
- TDK Corporation
- Yoji TOZAWA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
CAPACITOR AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180330883
- Publication date Nov 15, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- MASAHITO SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CAPACITOR AND CIRCUIT BOARD CONTAINING THE SAME
- Publication number 20180330880
- Publication date Nov 15, 2018
- AVX CORPORATION
- Jeffrey Cain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND BOARD HAVING THE SAME
- Publication number 20180315550
- Publication date Nov 1, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Jeong Hoon RYOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND SUBSTRATE INCLUDING ELECTRONIC COMPONENT
- Publication number 20180211785
- Publication date Jul 26, 2018
- Murata Manufacturing Co., Ltd.
- Yoshinao NISHIOKA
- H01 - BASIC ELECTRIC ELEMENTS

the terminals being coated on the capacitive element

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic component

Ceramic electronic device and manufacturing method of ceramic elect...

Chip component

Chip electronic component

Multilayer capacitor and circuit board containing the same

Method for manufacturing a multilayer ceramic electronic component

Electronic component with baked electrodes and having a continuousl...

Electronic component and manufacturing method for the same

Chip component

Multilayer ceramic capacitor

Electronic component

Thermal paths for glass substrates

Manufacturing method for electronic component including electrode f...

Method for manufacturing ceramic electronic component

Thin-film capacitor

Chip electronic component

Capacitor component

Electronic component and method of manufacturing same

Thin film capacitor having an outer layer including a second conduc...

Method for manufacturing electronic component

Electronic component

Capacitor and method for manufacturing capacitor

Capacitor and board having the same

Multilayer component having internal electrodes alternatingly conne...

High-density metal-insulator-metal capacitors

Multilayer ceramic capacitor and method of manufacturing the same

Electronic component and substrate including electronic component

Electronic component

Low inductance capacitor

Method for producing a multilayer component

Patents Applicationslast 30 patents

Single Layer Capacitor

ELECTRONIC COMPONENT

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

PRE-DRILLED VIAS TO CAPTURE DOUBLE SIDED CAPACITANCE

CERAMIC MATERIAL FOR CAPACITOR

ELECTRONIC COMPONENT, ELECTRONIC COMPONENT MANUFACTURING METHOD, CA...

METHOD AND APPARATUS FOR MANUFACTURING ELECTRONIC COMPONENT

Multilayer Capacitor and Circuit Board Containing the Same

CAPACITOR

NANO-INKS OF CARBON NANOMATERIALS FOR PRINTING AND COATING

SEMICONDUCTOR DEVICE AND CAPACITANCE DEVICE

CHIP COMPONENT

ELECTRONIC COMPONENT

THERMAL PATHS FOR GLASS SUBSTRATES

CHIP COMPONENT

MULTILAYER CERAMIC CAPACITOR

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

THIN-FILM CAPACITOR

CAPACITOR COMPONENT

LAMINATED ELECTRONIC COMPONENT AND MOUNTING STRUCTURE THEREOF

Multilayer Component

HIGH-DENSITY METAL-INSULATOR-METAL CAPACITORS

ELECTRONIC COMPONENT

MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT

ELECTRONIC COMPONENT

CAPACITOR AND METHOD FOR MANUFACTURING THE SAME

MULTILAYER CAPACITOR AND CIRCUIT BOARD CONTAINING THE SAME

CAPACITOR AND BOARD HAVING THE SAME

ELECTRONIC COMPONENT AND SUBSTRATE INCLUDING ELECTRONIC COMPONENT