the terminals being coated on the capacitive element

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    MULTILAYER CERAMIC CAPACITOR

    • Publication number 20240355546
    • Publication date Oct 24, 2024
    • Murata Manufacturing Co., Ltd.
    • Shinobu CHIKUMA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER CERAMIC CAPACITOR

    • Publication number 20240355543
    • Publication date Oct 24, 2024
    • Murata Manufacturing Co., Ltd.
    • Tatsunori YASUDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Single Layer Capacitor

    • Publication number 20240234038
    • Publication date Jul 11, 2024
    • KYOCERA AVX Components Corporation
    • Ronald S. Demcko
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYERED CAPACITOR

    • Publication number 20240222027
    • Publication date Jul 4, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Jihye Han
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE SUBSTRATE EMBEDDED MULTI-LAYERED IN VIA CAPACITORS

    • Publication number 20240222035
    • Publication date Jul 4, 2024
    • Intel Corporation
    • Suddhasattwa Nad
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER ELECTRONIC COMPONENT

    • Publication number 20240212935
    • Publication date Jun 27, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Hiroki OKADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Single Layer Capacitor

    • Publication number 20240136123
    • Publication date Apr 25, 2024
    • KYOCERA AVX Components Corporation
    • Ronald S. Demcko
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT

    • Publication number 20240087809
    • Publication date Mar 14, 2024
    • Murata Manufacturing Co., Ltd.
    • Toshiyuki Nakaiso
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

    • Publication number 20240087813
    • Publication date Mar 14, 2024
    • MURATA MANUFACTURING CO., LTD.
    • Hirofumi OIE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRE-DRILLED VIAS TO CAPTURE DOUBLE SIDED CAPACITANCE

    • Publication number 20240021372
    • Publication date Jan 18, 2024
    • SARAS MICRO DEVICES, INC.
    • Courtney Timms
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CERAMIC MATERIAL FOR CAPACITOR

    • Publication number 20230268126
    • Publication date Aug 24, 2023
    • TDK Electronics AG
    • Thorsten Bayer
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT, ELECTRONIC COMPONENT MANUFACTURING METHOD, CA...

    • Publication number 20230223194
    • Publication date Jul 13, 2023
    • Panasonic Intellectual Property Management Co., Ltd.
    • HIROKI TAKEOKA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD AND APPARATUS FOR MANUFACTURING ELECTRONIC COMPONENT

    • Publication number 20220415578
    • Publication date Dec 29, 2022
    • Creative Coatings Co., Ltd.
    • Eiji SATO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Multilayer Capacitor and Circuit Board Containing the Same

    • Publication number 20220392705
    • Publication date Dec 8, 2022
    • KYOCERA AVX Components Corporation
    • Jeffrey Cain
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CAPACITOR

    • Publication number 20220384113
    • Publication date Dec 1, 2022
    • Taiyo Yuden Co., Ltd.
    • Yoshinari TAKE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    NANO-INKS OF CARBON NANOMATERIALS FOR PRINTING AND COATING

    • Publication number 20220363931
    • Publication date Nov 17, 2022
    • Kansas State University Research Foundation
    • Suprem R. Das
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND CAPACITANCE DEVICE

    • Publication number 20220336155
    • Publication date Oct 20, 2022
    • Murata Manufacturing Co., Ltd.
    • Takeshi Kagawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP COMPONENT

    • Publication number 20220254572
    • Publication date Aug 11, 2022
    • Rohm Co., Ltd.
    • Keisuke FUKAE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT

    • Publication number 20220068565
    • Publication date Mar 3, 2022
    • TDK Corporation
    • Yoji TOZAWA
    • H03 - BASIC ELECTRONIC CIRCUITRY
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    THERMAL PATHS FOR GLASS SUBSTRATES

    • Publication number 20210304944
    • Publication date Sep 30, 2021
    • QUALCOMM Incorporated
    • Kai LIU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP COMPONENT

    • Publication number 20210043387
    • Publication date Feb 11, 2021
    • Rohm Co., Ltd.
    • Keisuke FUKAE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER CERAMIC CAPACITOR

    • Publication number 20210005386
    • Publication date Jan 7, 2021
    • Samsung Electro-Mechanics Co., Ltd.
    • Taek Jung LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

    • Publication number 20200082986
    • Publication date Mar 12, 2020
    • Murata Manufacturing Co., Ltd.
    • Toru Yaso
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    THIN-FILM CAPACITOR

    • Publication number 20200013554
    • Publication date Jan 9, 2020
    • TDK CORPORATION
    • Koichi TSUNODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CAPACITOR COMPONENT

    • Publication number 20190237251
    • Publication date Aug 1, 2019
    • Samsung Electro-Mechanics Co., Ltd.
    • Chang Soo JANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LAMINATED ELECTRONIC COMPONENT AND MOUNTING STRUCTURE THEREOF

    • Publication number 20190206628
    • Publication date Jul 4, 2019
    • Kyocera Corporation
    • Michiaki NISHIMURA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Multilayer Component

    • Publication number 20190189895
    • Publication date Jun 20, 2019
    • EPCOS AG
    • Dieter Somitsch
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
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    HIGH-DENSITY METAL-INSULATOR-METAL CAPACITORS

    • Publication number 20190148072
    • Publication date May 16, 2019
    • GLOBALFOUNDRIES INC.
    • Robert J. Fox
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT

    • Publication number 20190131072
    • Publication date May 2, 2019
    • TDK Corporation
    • Shinya ONODERA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME

    • Publication number 20190074138
    • Publication date Mar 7, 2019
    • Samsung Electro-Mechanics Co., Ltd.
    • Seung Woo SONG
    • H01 - BASIC ELECTRIC ELEMENTS