the whole external layer protruding from the surface

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05568the whole external layer protruding from the surface

Industries

Patents Grantslast 30 patents

Information Patent Grant
Localized high density substrate routing
- Patent number 12,107,042
- Issue date Oct 1, 2024
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thick-silver layer interface
- Patent number 12,094,801
- Issue date Sep 17, 2024
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with surface-mount die support struct...
- Patent number 12,087,720
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach surface copper layer with protective layer for microelec...
- Patent number 12,074,096
- Issue date Aug 27, 2024
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,057,362
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and display device
- Patent number 12,021,049
- Issue date Jun 25, 2024
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- Shuya Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including through-silicon-vias and methods of...
- Patent number 12,014,972
- Issue date Jun 18, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced device assembly structures and methods
- Patent number 11,999,001
- Issue date Jun 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid bonding with uniform pattern density
- Patent number 11,996,399
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Semiconductor packaging method and semiconductor package device
- Patent number 11,990,432
- Issue date May 21, 2024
- TONGFU MICROELECTRONICS CO., LTD.
- Guoqing Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized high density substrate routing
- Patent number 11,984,396
- Issue date May 14, 2024
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing a semiconductor device including a joint a...
- Patent number 11,894,330
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
- Patent number 11,881,476
- Issue date Jan 23, 2024
- Semtech Corporation
- Changjun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device
- Patent number 11,862,235
- Issue date Jan 2, 2024
- RAMBUS INC.
- Frederick A. Ware
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
- Patent number 11,842,972
- Issue date Dec 12, 2023
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Industrial chip scale package for microelectronic device
- Patent number 11,749,616
- Issue date Sep 5, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting apparatus and method for producing the same
- Patent number 11,735,699
- Issue date Aug 22, 2023
- Nichia Corporation
- Shunsuke Minato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, semiconductor packages, and methods of manuf...
- Patent number 11,728,297
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metalization with through-wafer-via processing to allow us...
- Patent number 11,652,079
- Issue date May 16, 2023
- Skyworks Solutions, Inc.
- Bharatjeet Singh Gill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages including an inductor and a capacitor
- Patent number 11,637,172
- Issue date Apr 25, 2023
- Advanced Semiconductor Engineering, Inc.
- Chien-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar-last methods for forming semiconductor devices
- Patent number 11,631,630
- Issue date Apr 18, 2023
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,569,190
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,557,641
- Issue date Jan 17, 2023
- Samsung Display Co., Ltd.
- Byeong Beom Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite semiconductor component having projecting elements projec...
- Patent number 11,527,521
- Issue date Dec 13, 2022
- OSRAM OLED GmbH
- Lutz Hoeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized high density substrate routing
- Patent number 11,515,248
- Issue date Nov 29, 2022
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having counductive bump with tapered portio...
- Patent number 11,495,556
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging mechanisms for dies with different sizes of connectors
- Patent number 11,488,878
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with through-package interconnect and...
- Patent number 11,456,286
- Issue date Sep 27, 2022
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,431,378
- Issue date Aug 30, 2022
- Renesas Electronics Corporation
- Ryuichi Oikawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCT...
- Publication number 20240429191
- Publication date Dec 26, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH SURFACE COPPER LAYER WITH PROTECTIVE LAYER FOR MICROELEC...
- Publication number 20240421045
- Publication date Dec 19, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED HIGH DENSITY SUBSTRATE ROUTING
- Publication number 20240421073
- Publication date Dec 19, 2024
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICK-SILVER LAYER INTERFACE
- Publication number 20240404914
- Publication date Dec 5, 2024
- NXP USA, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240363566
- Publication date Oct 31, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Wang Gu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20240312934
- Publication date Sep 19, 2024
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- Shuya DONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH DELAMINATION REDUCTION MECHANISM AND METH...
- Publication number 20240282733
- Publication date Aug 22, 2024
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING WITH UNIFORM PATTERN DENSITY
- Publication number 20240266341
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240243039
- Publication date Jul 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Ying-Chung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE
- Publication number 20240203483
- Publication date Jun 20, 2024
- Rambus Inc.
- Frederick A. Ware
- G11 - INFORMATION STORAGE
Information Patent Application
INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE
- Publication number 20240162163
- Publication date May 16, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240162184
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Sang-Sick Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240128217
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER COMPOSITE, SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING...
- Publication number 20240112956
- Publication date Apr 4, 2024
- INFINEON TECHNOLOGIES AUSTRIA AG
- Hermann Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20240071964
- Publication date Feb 29, 2024
- WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Shuya Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...
- Publication number 20240055384
- Publication date Feb 15, 2024
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING SUBSTRATE, MANUFACTURING METHOD THEREOF, AND DISPLAY...
- Publication number 20230420431
- Publication date Dec 28, 2023
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Peihai WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND DRIVER
- Publication number 20230411324
- Publication date Dec 21, 2023
- Sharp Display Technology Corporation
- Shinzoh MURAKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230369319
- Publication date Nov 16, 2023
- WAVEPIA CO., LTD.
- Sang Hun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THE SAME,...
- Publication number 20230178506
- Publication date Jun 8, 2023
- Mitsubishi Electric Corporation
- Tatsushi MORISADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...
- Publication number 20230020689
- Publication date Jan 19, 2023
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUILD-UP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS OF MAK...
- Publication number 20230005802
- Publication date Jan 5, 2023
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING ELEMENTS, AND MET...
- Publication number 20220406982
- Publication date Dec 22, 2022
- LG ELECTRONICS INC.
- Hwanjoon CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220399319
- Publication date Dec 15, 2022
- Japan Display Inc.
- Masanobu IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20220285323
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE
- Publication number 20220278088
- Publication date Sep 1, 2022
- SAMSUNG DISPLAY CO., LTD.
- Chan Jae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding with Uniform Pattern Density
- Publication number 20220173092
- Publication date Jun 2, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE
- Publication number 20220139445
- Publication date May 5, 2022
- Rambus Inc.
- Frederick A. Ware
- G11 - INFORMATION STORAGE
Information Patent Application
LIGHT EMITTING APPARATUS AND METHOD FOR PRODUCING THE SAME
- Publication number 20220140212
- Publication date May 5, 2022
- Nichia Corporation.
- Shunsuke Minato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20220097166
- Publication date Mar 31, 2022
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

the whole external layer protruding from the surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Localized high density substrate routing

Thick-silver layer interface

Semiconductor device assembly with surface-mount die support struct...

Die attach surface copper layer with protective layer for microelec...

Semiconductor device and method for manufacturing semiconductor device

Display panel and display device

Semiconductor devices including through-silicon-vias and methods of...

Advanced device assembly structures and methods

Hybrid bonding with uniform pattern density

Multiple plated via arrays of different wire heights on a same subs...

Semiconductor packaging method and semiconductor package device

Localized high density substrate routing

Methods of manufacturing a semiconductor device including a joint a...

Semiconductor device and method of stacking semiconductor die for s...

Stacked semiconductor device

Semiconductor device with a semiconductor chip connected in a flip...

Industrial chip scale package for microelectronic device

Light emitting apparatus and method for producing the same

Semiconductor devices, semiconductor packages, and methods of manuf...

Backside metalization with through-wafer-via processing to allow us...

Semiconductor device packages including an inductor and a capacitor

Pillar-last methods for forming semiconductor devices

Semiconductor structure and manufacturing method thereof

Display device

Composite semiconductor component having projecting elements projec...

Localized high density substrate routing

Semiconductor structure having counductive bump with tapered portio...

Packaging mechanisms for dies with different sizes of connectors

Semiconductor device assembly with through-package interconnect and...

Semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCT...

DIE ATTACH SURFACE COPPER LAYER WITH PROTECTIVE LAYER FOR MICROELEC...

LOCALIZED HIGH DENSITY SUBSTRATE ROUTING

THICK-SILVER LAYER INTERFACE

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

DISPLAY PANEL AND DISPLAY DEVICE

SEMICONDUCTOR DEVICE WITH DELAMINATION REDUCTION MECHANISM AND METH...

HYBRID BONDING WITH UNIFORM PATTERN DENSITY

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

STACKED SEMICONDUCTOR DEVICE

INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

WAFER COMPOSITE, SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING...

DISPLAY PANEL AND DISPLAY DEVICE

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...

LIGHT-EMITTING SUBSTRATE, MANUFACTURING METHOD THEREOF, AND DISPLAY...

DISPLAY DEVICE AND DRIVER

SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THE SAME,...

SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...

BUILD-UP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS OF MAK...

DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING ELEMENTS, AND MET...

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor Packages and Methods of Forming Same

DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE

Hybrid Bonding with Uniform Pattern Density

STACKED SEMICONDUCTOR DEVICE

LIGHT EMITTING APPARATUS AND METHOD FOR PRODUCING THE SAME

Advanced Device Assembly Structures And Methods