the wire connector connecting to a bonding area disposed in a recess of the surface

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H01L2224/48148

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48148the wire connector connecting to a bonding area disposed in a recess of the surface

Industries

Patents Grantslast 30 patents

Information Patent Grant
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Information Patent Grant
Semiconductor package including semiconductor chips
- Patent number 11,569,193
- Issue date Jan 31, 2023
- Samsung Electronics Co., Ltd.
- Hyungu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems, methods, and apparatuses for implementing reduced height s...
- Patent number 11,469,213
- Issue date Oct 11, 2022
- Intel Corporation
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack packages including a hybrid wire bonding structure
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- Issue date Apr 19, 2022
- SK hynix Inc.
- Nam Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing multi-chip package
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- Issue date Jun 9, 2020
- Samsung Electronics Co., Ltd.
- Won-Gil Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus with a data driving chip and a gate driving chip...
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- Issue date Sep 24, 2019
- Samsung Display Co., Ltd.
- Sang-Chul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor laser structure
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- Issue date May 16, 2017
- Industrial Technology Research Institute
- Jui-Ying Lin
- G02 - OPTICS
Information Patent Grant
Optical coupling module
- Patent number 9,613,886
- Issue date Apr 4, 2017
- Industrial Technology Research Institute
- Jui-Ying Lin
- G02 - OPTICS
Information Patent Grant
Connection pads for a fingerprint sensing device
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- Issue date Feb 28, 2017
- FINGERPRINT CARDS AB
- Pontus Jägemalm
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Contact arrangements for stackable microelectronic package structur...
- Patent number 9,349,707
- Issue date May 24, 2016
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate, method of fabricating the same, and application the same
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- Issue date Feb 2, 2016
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- Yao-Jun Tsai
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Information Patent Grant
Semiconductor stacked package
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- Issue date Dec 8, 2015
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- Ki Yong Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package and method for fabricating the same
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- Issue date Jun 9, 2015
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- Keun-Ho Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and substrate bonding method
- Patent number 8,916,449
- Issue date Dec 23, 2014
- Asia Pacific Microsystems, Inc.
- Hung-Lin Yin
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MECHANICAL SUPPORT FOR A TALL OFFSET DIE STACK
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- Publication date Dec 7, 2023
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- Yangming Liu
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Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SELECT DIES OF KNOWN THICKNESSES
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Information Patent Application
SEMICONDUCTOR DIE ASSEMBLIES WITH MOLDED SEMICONDUCTOR DIES AND ASS...
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- See Hiong Leow
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Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIPS
- Publication number 20230154886
- Publication date May 18, 2023
- Samsung Electronics Co., Ltd.
- Hyungu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20230139378
- Publication date May 4, 2023
- SK HYNIX INC.
- Jong Joo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230087607
- Publication date Mar 23, 2023
- Samsung Electronics Co., Ltd.
- Seunghyun Baik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGES INCLUDING A HYBRID WIRE BONDING STRUCTURE
- Publication number 20220208737
- Publication date Jun 30, 2022
- SK HYNIX INC.
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Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIPS
- Publication number 20220130793
- Publication date Apr 28, 2022
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- Hyungu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGES INCLUDING A HYBRID WIRE BONDING STRUCTURE
- Publication number 20200286860
- Publication date Sep 10, 2020
- SK HYNIX INC.
- Nam Jae LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MULTI-CHIP PACKAGE
- Publication number 20190103381
- Publication date Apr 4, 2019
- Samsung Electronics Co., Ltd.
- Won-Gil HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20180165495
- Publication date Jun 14, 2018
- Fingerprint Cards AB
- Martin GRIP
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONNECTION PADS FOR A FINGERPRINT SENSING DEVICE
- Publication number 20160210495
- Publication date Jul 21, 2016
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- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR STACKED PACKAGE
- Publication number 20150302900
- Publication date Oct 22, 2015
- SK HYNIX INC.
- Ki Yong LEE
- G11 - INFORMATION STORAGE
Information Patent Application
BALL GRID ARRAY SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
- Publication number 20140170814
- Publication date Jun 19, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Hayato OKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20140008796
- Publication date Jan 9, 2014
- Keun-Ho CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure and Substrate Bonding Method
- Publication number 20130285248
- Publication date Oct 31, 2013
- ASIA PACIFIC MICROSYSTEMS, INC.
- Hung-Lin Yin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BALL GRID ARRAY SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
- Publication number 20120104606
- Publication date May 3, 2012
- FUJITSU SEMICONDUCTOR LIMITED
- Hayato OKUDA
- H01 - BASIC ELECTRIC ELEMENTS

the wire connector connecting to a bonding area disposed in a recess of the surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package including semiconductor chips

Semiconductor package including semiconductor chips

Systems, methods, and apparatuses for implementing reduced height s...

Stack packages including a hybrid wire bonding structure

Method of manufacturing multi-chip package

Display apparatus with a data driving chip and a gate driving chip...

Semiconductor laser structure

Optical coupling module

Connection pads for a fingerprint sensing device

Contact arrangements for stackable microelectronic package structur...

Substrate, method of fabricating the same, and application the same

Semiconductor stacked package

Semiconductor package and method for fabricating the same

Package structure and substrate bonding method

Patents Applicationslast 30 patents

MECHANICAL SUPPORT FOR A TALL OFFSET DIE STACK

SEMICONDUCTOR DEVICE INCLUDING SELECT DIES OF KNOWN THICKNESSES

SEMICONDUCTOR DIE ASSEMBLIES WITH MOLDED SEMICONDUCTOR DIES AND ASS...

SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIPS

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS

SEMICONDUCTOR PACKAGE

STACK PACKAGES INCLUDING A HYBRID WIRE BONDING STRUCTURE

SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIPS

STACK PACKAGES INCLUDING A HYBRID WIRE BONDING STRUCTURE

METHOD OF MANUFACTURING MULTI-CHIP PACKAGE

ELECTRONIC DEVICE

CONNECTION PADS FOR A FINGERPRINT SENSING DEVICE

SEMICONDUCTOR STACKED PACKAGE

BALL GRID ARRAY SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

Package Structure and Substrate Bonding Method

BALL GRID ARRAY SEMICONDUCTOR DEVICE AND ITS MANUFACTURE