the wire connector connecting to a bonding area protruding from the surface

Industry

CPC
H01L2224/48149

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48149the wire connector connecting to a bonding area protruding from the surface

Industries

Patents Grantslast 30 patents

Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Dynamic sense amplifier supply voltage for power and die size reduc...
- Patent number 11,978,516
- Issue date May 7, 2024
- SANDISK TECHNOLOGIES LLC
- Yanjie Wang
- G11 - INFORMATION STORAGE
Information Patent Grant
Power management
- Patent number 11,935,602
- Issue date Mar 19, 2024
- Micron Technology, Inc.
- Liang Yu
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and test method of semiconductor device
- Patent number 11,892,503
- Issue date Feb 6, 2024
- Toshiba Tec Kabushiki Kaisha
- Takuya Kusaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 11,887,970
- Issue date Jan 30, 2024
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metalization with through-wafer-via processing to allow us...
- Patent number 11,652,079
- Issue date May 16, 2023
- Skyworks Solutions, Inc.
- Bharatjeet Singh Gill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 11,373,979
- Issue date Jun 28, 2022
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolator integrated circuits with package structure cavity and fabr...
- Patent number 11,264,369
- Issue date Mar 1, 2022
- Texas Instruments Incorporated
- Barry Jon Male
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metalization with through-wafer-via processing to allow us...
- Patent number 11,171,110
- Issue date Nov 9, 2021
- Skyworks Solutions, Inc.
- Bharatjeet Singh Gill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-level packaging structures
- Patent number 10,741,499
- Issue date Aug 11, 2020
- TONGFU MICROELECTRONICS CO., LTD.
- Yujuan Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing multi-chip package
- Patent number 10,679,972
- Issue date Jun 9, 2020
- Samsung Electronics Co., Ltd.
- Won-Gil Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolator integrated circuits with package structure cavity and fabr...
- Patent number 10,636,778
- Issue date Apr 28, 2020
- Texas Instruments Incorporated
- Barry Jon Male
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multiple plated via arrays of different wire heights on same substrate
- Patent number 10,629,567
- Issue date Apr 21, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Transmission line optimization for multi-die systems
- Patent number 10,468,073
- Issue date Nov 5, 2019
- SanDisk Technologies LLC
- John Thomas Contreras
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple bond via arrays of different wire heights on a same substrate
- Patent number 10,290,613
- Issue date May 14, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor devices and packages and methods of forming semicondu...
- Patent number 10,083,937
- Issue date Sep 25, 2018
- Micron Technology, Inc.
- Anthony D. Veches
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 10,062,667
- Issue date Aug 28, 2018
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,997,499
- Issue date Jun 12, 2018
- Renesas Electronics Corporation
- Hiroshi Kuroda
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,761,510
- Issue date Sep 12, 2017
- Xintec Inc.
- Chien-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,754,919
- Issue date Sep 5, 2017
- Renesas Electronics Corporation
- Hiroshi Kuroda
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multiple bond via arrays of different wire heights on a same substrate
- Patent number 9,728,527
- Issue date Aug 8, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple bond via arrays of different wire heights on a same substrate
- Patent number 9,583,456
- Issue date Feb 28, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-level packaging methods and structures
- Patent number 9,543,269
- Issue date Jan 10, 2017
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Yujuan Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly structure for connecting multiple dies into a system-in-pa...
- Patent number 9,349,610
- Issue date May 24, 2016
- Global Unichip Corp.
- Tsung Chuan Whang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACK PACKAGES
- Publication number 20240339436
- Publication date Oct 10, 2024
- SK HYNIX INC.
- Eun Hye DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
- Publication number 20240321774
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Kitae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE AND CHIP
- Publication number 20240321828
- Publication date Sep 26, 2024
- ALi Corporation
- Liang-Cai Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THERMAL DISSIPATION AND METHOD THEREFOR
- Publication number 20240234258
- Publication date Jul 11, 2024
- NXP B.V.
- Frank.zy Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MANAGEMENT
- Publication number 20240233836
- Publication date Jul 11, 2024
- Micron Technology, Inc.
- Liang Yu
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240170456
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Seo Eun KYUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THERMAL DISSIPATION AND METHOD THEREFOR
- Publication number 20240136256
- Publication date Apr 25, 2024
- NXP B.V.
- Frank.zy Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240113074
- Publication date Apr 4, 2024
- Samsung Electronics Co., Ltd.
- Heewoo AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP STACK STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUD...
- Publication number 20240105680
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Junyoung Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230420414
- Publication date Dec 28, 2023
- Samsung Electronics Co., Ltd.
- Kiwon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SE...
- Publication number 20230411269
- Publication date Dec 21, 2023
- KIOXIA Corporation
- Keiichi NIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND TEST METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20230296669
- Publication date Sep 21, 2023
- KIOXIA Corporation
- Takuya KUSAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230207520
- Publication date Jun 29, 2023
- KIOXIA Corporation
- Masayuki MIURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230117865
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd.
- Eungchang LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING ADHESIVE MEMBERS
- Publication number 20230098993
- Publication date Mar 30, 2023
- Samsung Electronics Co., Ltd.
- Jooyoung Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20230005813
- Publication date Jan 5, 2023
- Sony Semiconductor Solutions Corporation
- YOICHIRO FUJINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230005885
- Publication date Jan 5, 2023
- Samsung Electronics Co., Ltd.
- Hyemi Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE METALIZATION WITH THROUGH-WAFER-VIA PROCESSING TO ALLOW US...
- Publication number 20210366868
- Publication date Nov 25, 2021
- Skyworks Solutions, Inc.
- Bharatjeet Singh Gill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMISSION LINE OPTIMIZATION FOR MULTI-DIE SYSTEMS
- Publication number 20190206450
- Publication date Jul 4, 2019
- SanDisk Technologies LLC
- John Thomas Contreras
- G11 - INFORMATION STORAGE
Information Patent Application
MULTIPLE PLATED VIA ARRAYS OF DIFFERENT WIRE HEIGHTS ON SAME SUBSTRATE
- Publication number 20190148344
- Publication date May 16, 2019
- Invensas Corporation
- Cyprian Emeka UZOH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING MULTI-CHIP PACKAGE
- Publication number 20190103381
- Publication date Apr 4, 2019
- Samsung Electronics Co., Ltd.
- Won-Gil HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS
- Publication number 20180358331
- Publication date Dec 13, 2018
- Micron Technology, Inc.
- Mung Suan Heng
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Multiple bond via arrays of different wire heights on a same substrate
- Publication number 20180301436
- Publication date Oct 18, 2018
- Invensas Corporation
- Cyprian Emeka UZOH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170330864
- Publication date Nov 16, 2017
- Renesas Electronics Corporation
- Hiroshi KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS
- Publication number 20170084585
- Publication date Mar 23, 2017
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-LEVEL PACKAGING STRUCTURES
- Publication number 20170077035
- Publication date Mar 16, 2017
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Yujuan Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND PACKAGES AND METHODS OF FORMING SEMICONDU...
- Publication number 20170069603
- Publication date Mar 9, 2017
- Micron Technology, Inc.
- Anthony D. Veches
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20150325552
- Publication date Nov 12, 2015
- XINTEC INC.
- Chien-Hung LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20150325551
- Publication date Nov 12, 2015
- XINTEC INC.
- Ying-Nan WEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
- Publication number 20140170814
- Publication date Jun 19, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Hayato OKUDA
- H01 - BASIC ELECTRIC ELEMENTS

the wire connector connecting to a bonding area protruding from the surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multiple plated via arrays of different wire heights on a same subs...

Dynamic sense amplifier supply voltage for power and die size reduc...

Power management

Semiconductor device and test method of semiconductor device

Stacked microfeature devices and associated methods

Backside metalization with through-wafer-via processing to allow us...

Stacked microfeature devices and associated methods

Isolator integrated circuits with package structure cavity and fabr...

Backside metalization with through-wafer-via processing to allow us...

System-level packaging structures

Method of manufacturing multi-chip package

Isolator integrated circuits with package structure cavity and fabr...

Multiple plated via arrays of different wire heights on same substrate

Transmission line optimization for multi-die systems

Multiple bond via arrays of different wire heights on a same substrate

Semiconductor devices and packages and methods of forming semicondu...

Stacked microfeature devices and associated methods

Semiconductor device and method of manufacturing the same

Chip package and method for forming the same

Semiconductor device and method of manufacturing the same

Multiple bond via arrays of different wire heights on a same substrate

Multiple bond via arrays of different wire heights on a same substrate

System-level packaging methods and structures

Assembly structure for connecting multiple dies into a system-in-pa...

Patents Applicationslast 30 patents

STACK PACKAGES

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...

INTEGRATED CIRCUIT STRUCTURE AND CHIP

SEMICONDUCTOR DEVICE WITH THERMAL DISSIPATION AND METHOD THEREFOR

POWER MANAGEMENT

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE WITH THERMAL DISSIPATION AND METHOD THEREFOR

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR CHIP STACK STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUD...

SEMICONDUCTOR PACKAGE

WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SE...

SEMICONDUCTOR DEVICE AND TEST METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES HAVING ADHESIVE MEMBERS

SEMICONDUCTOR APPARATUS

SEMICONDUCTOR PACKAGE

BACKSIDE METALIZATION WITH THROUGH-WAFER-VIA PROCESSING TO ALLOW US...

TRANSMISSION LINE OPTIMIZATION FOR MULTI-DIE SYSTEMS

MULTIPLE PLATED VIA ARRAYS OF DIFFERENT WIRE HEIGHTS ON SAME SUBSTRATE

METHOD OF MANUFACTURING MULTI-CHIP PACKAGE

STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS

Multiple bond via arrays of different wire heights on a same substrate

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS

SYSTEM-LEVEL PACKAGING STRUCTURES

SEMICONDUCTOR DEVICES AND PACKAGES AND METHODS OF FORMING SEMICONDU...

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

BALL GRID ARRAY SEMICONDUCTOR DEVICE AND ITS MANUFACTURE