Thermal bonding

Industry

CPC
B81C2203/033

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C2203/00Forming micro-structural systems

Current Industry

B81C2203/033Thermal bonding

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Hybrid ultrasonic transducer and method of forming the same
- Patent number 11,508,902
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yi Heng Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hybrid ultrasonic transducer and method of forming the same
- Patent number 10,944,041
- Issue date Mar 9, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yi Heng Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing optical components using functional elements
- Patent number 10,752,500
- Issue date Aug 25, 2020
- FRAUNHOFER-GESELLSCAFT ZUR FÖRDERUNG ANGEWANDTEN FORSCHUNG E.V.
- Hans Joachim Quenzer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for bonding wafers
- Patent number 10,118,247
- Issue date Nov 6, 2018
- MURATA MANUFACTURING CO., LTD.
- Masakazu Fukumitsu
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Microelectronic packages having stacked accelerometer and magnetome...
- Patent number 9,108,841
- Issue date Aug 18, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SENSING ELEMENT AND RELATED METHODS
- Publication number 20250076135
- Publication date Mar 6, 2025
- GENERAL ELECTRIC COMPANY
- Robert James MacDonald
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Support Device for One or More MEMS Components
- Publication number 20240101412
- Publication date Mar 28, 2024
- ROBERT BOSCH GmbH
- Joachim Friedl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSING ELEMENT AND RELATED METHODS
- Publication number 20230304879
- Publication date Sep 28, 2023
- GENERAL ELECTRIC COMPANY
- Robert James MacDonald
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING AT LEAST ONE FIRST AND ONE SECOND MICROMIRROR...
- Publication number 20230066345
- Publication date Mar 2, 2023
- ROBERT BOSCH GmbH
- Heiko Stahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MODULE AND METHOD OF MANUFACTURING MEMS MODULE
- Publication number 20230016416
- Publication date Jan 19, 2023
- Rohm Co., Ltd.
- Toru HIGUCHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HYBRID ULTRASONIC TRANSDUCER AND METHOD OF FORMING THE SAME
- Publication number 20210193904
- Publication date Jun 24, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- YI HENG TSAI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HYBRID ULTRASONIC TRANSDUCER AND METHOD OF FORMING THE SAME
- Publication number 20210078857
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- YI HENG TSAI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING OPTICAL COMPONENTS USING FUNCTIONAL ELEMENTS
- Publication number 20190135619
- Publication date May 9, 2019
- FRAUNHOFFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
- Hans, Joachim QUENZER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE FOR MEMS DEVICE
- Publication number 20170369308
- Publication date Dec 28, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Chia Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONIC PACKAGES HAVING STACKED ACCELEROMETER AND MAGNETOME...
- Publication number 20150251903
- Publication date Sep 10, 2015
- PHILIP H. BOWLES
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Thermal bonding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Hybrid ultrasonic transducer and method of forming the same

Hybrid ultrasonic transducer and method of forming the same

Method for producing optical components using functional elements

Method for bonding wafers

Microelectronic packages having stacked accelerometer and magnetome...

Patents Applicationslast 30 patents

SENSING ELEMENT AND RELATED METHODS

Support Device for One or More MEMS Components

SENSING ELEMENT AND RELATED METHODS

METHOD FOR PRODUCING AT LEAST ONE FIRST AND ONE SECOND MICROMIRROR...

MEMS MODULE AND METHOD OF MANUFACTURING MEMS MODULE

HYBRID ULTRASONIC TRANSDUCER AND METHOD OF FORMING THE SAME

HYBRID ULTRASONIC TRANSDUCER AND METHOD OF FORMING THE SAME

METHOD FOR PRODUCING OPTICAL COMPONENTS USING FUNCTIONAL ELEMENTS

SEMICONDUCTOR STRUCTURE FOR MEMS DEVICE

MICROELECTRONIC PACKAGES HAVING STACKED ACCELEROMETER AND MAGNETOME...