Thermal management

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CPC
H01L2225/1094

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

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H01L2225/1094Thermal management

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Management of heat on a semiconductor device and methods for produc...
- Patent number 12,362,259
- Issue date Jul 15, 2025
- Micron Technology, Inc.
- James S. Rehmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,334,424
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Ming Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipating features for laser drilling process
- Patent number 12,322,716
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System packaging for cellular modem and transceiver system of heter...
- Patent number 12,315,853
- Issue date May 27, 2025
- Apple Inc.
- Sidharth S. Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 12,300,575
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including heat dissipation structure
- Patent number 12,293,996
- Issue date May 6, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Moon Hee Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection using fanout interposer chiplet
- Patent number 12,283,549
- Issue date Apr 22, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including thermal interface material layer and se...
- Patent number 12,283,576
- Issue date Apr 22, 2025
- Samsung Electronics Co., Ltd.
- Yongha Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-dissipating structures for semiconductor devices and methods o...
- Patent number 12,272,616
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an encapulant comprising conductive fi...
- Patent number 12,261,095
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna modules employing three-dimensional (3D) build-up on mold p...
- Patent number 12,255,381
- Issue date Mar 18, 2025
- QUALCOMM Incorporated
- Ranadeep Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure semiconductor integration and method for making thereof
- Patent number 12,255,189
- Issue date Mar 18, 2025
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package having a main die and a dummy die
- Patent number 12,224,247
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 12,211,821
- Issue date Jan 28, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies including vertically integrated circuits a...
- Patent number 12,199,001
- Issue date Jan 14, 2025
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device using high stress cleave plane
- Patent number 12,176,326
- Issue date Dec 24, 2024
- Silicon Genesis Corporation
- Theodore E. Fong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimension large system integration
- Patent number 12,136,612
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,119,331
- Issue date Oct 15, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation in semiconductor packages and methods of forming same
- Patent number 12,074,148
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fong-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including heat spreader layer
- Patent number 12,040,248
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Jingu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with dummy thermal features on interposer
- Patent number 12,021,068
- Issue date Jun 25, 2024
- Mediatek Inc.
- Bo-Jiun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a thermal material
- Patent number 12,021,005
- Issue date Jun 25, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Keun Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and memory device module
- Patent number 12,009,282
- Issue date Jun 11, 2024
- MEIKO ELECTRONICS CO., LTD.
- Shuzo Akejima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,002,731
- Issue date Jun 4, 2024
- Samsung Electronics Co., Ltd.
- Ae-Nee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package with top-side memory module
- Patent number 11,967,587
- Issue date Apr 23, 2024
- Marvell Israel (M.I.S.L) Ltd.
- Dan Azeroual
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package having a main die and a dummy die
- Patent number 11,967,563
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management for package on package assembly
- Patent number 11,935,877
- Issue date Mar 19, 2024
- Applied Materials, Inc.
- Itai Leshniak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging an integrated circuit (IC) package with embedd...
- Patent number 11,929,300
- Issue date Mar 12, 2024
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with integrated heat distribution and manufact...
- Patent number 11,901,343
- Issue date Feb 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,876,083
- Issue date Jan 16, 2024
- Samsung Electronics Co., Ltd.
- Dongho Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE USING HIGH STRESS CLEAVE PLANE
- Publication number 20250233117
- Publication date Jul 17, 2025
- Silicon Genesis Corporation
- Theodore E. FONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY WITH AN INTERLAYER COOLING PATHWAY
- Publication number 20250226288
- Publication date Jul 10, 2025
- STATS ChipPAC Pte Ltd.
- JiSeon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250226285
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Myungsung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULES EMPLOYING THREE-DIMENSIONAL (3D) BUILD-UP ON MOLD P...
- Publication number 20250210852
- Publication date Jun 26, 2025
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210487
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Hyeonjeong Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...
- Publication number 20250210452
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat-Dissipating Structures for Semiconductor Devices and Methods o...
- Publication number 20250201659
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250201660
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Jinwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH THERMALLY-CONDUCTIVE FILLER IN A...
- Publication number 20250191993
- Publication date Jun 12, 2025
- Micron Technology, Inc.
- Chesheng KUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Package Having a Main Die and a Dummy Die
- Publication number 20250183191
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING A BACKSIDE METAL FILM ON A SEMICONDUCTO...
- Publication number 20250183237
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
- Publication number 20250157939
- Publication date May 15, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250149444
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- SEUNGDUK BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250149515
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Kiju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132214
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250118650
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- SUNJAE KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20250118705
- Publication date Apr 10, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES INCLUDING VERTICALLY INTEGRATED CIRCUITS A...
- Publication number 20250112105
- Publication date Apr 3, 2025
- Micron Technology, Inc.
- Chan H. YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20250096060
- Publication date Mar 20, 2025
- MICROCHIP TECHNOLOGY INCORPORATED
- Mankit Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250038156
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- YOUNG-JA KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING RECESSES IN AN ENCAPSULANT MATERI...
- Publication number 20250014959
- Publication date Jan 9, 2025
- Micron Technology, Inc.
- Manish Nayini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240429214
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20240421138
- Publication date Dec 19, 2024
- STATS ChipPAC Pte Ltd.
- JiSeon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240413040
- Publication date Dec 12, 2024
- JCET GROUP CO., LTD.
- Danfeng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSION LARGE SYSTEM INTEGRATION
- Publication number 20240379637
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Dissipation in Semiconductor Packages and Methods of Forming Same
- Publication number 20240371839
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fong-yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER LAYER
- Publication number 20240347409
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Jingu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20240347411
- Publication date Oct 17, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Keun Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY REGULATED SEMICONDUCTOR DEVICE
- Publication number 20240347413
- Publication date Oct 17, 2024
- Micron Technology, Inc.
- Chen Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321839
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Kyungdon Mun
- H01 - BASIC ELECTRIC ELEMENTS

Thermal management

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Management of heat on a semiconductor device and methods for produc...

Package structure and manufacturing method thereof

Heat dissipating features for laser drilling process

System packaging for cellular modem and transceiver system of heter...

Semiconductor package and method

Semiconductor package including heat dissipation structure

High density interconnection using fanout interposer chiplet

Electronic device including thermal interface material layer and se...

Heat-dissipating structures for semiconductor devices and methods o...

Semiconductor package having an encapulant comprising conductive fi...

Antenna modules employing three-dimensional (3D) build-up on mold p...

Secure semiconductor integration and method for making thereof

Fan-out package having a main die and a dummy die

Package-on-package assembly with wire bond vias

Semiconductor assemblies including vertically integrated circuits a...

Method of forming semiconductor device using high stress cleave plane

Three-dimension large system integration

Semiconductor package

Heat dissipation in semiconductor packages and methods of forming same

Semiconductor package including heat spreader layer

Semiconductor device with dummy thermal features on interposer

Semiconductor device including a thermal material

Memory device and memory device module

Semiconductor package

IC package with top-side memory module

Fan-out package having a main die and a dummy die

Thermal management for package on package assembly

Method for packaging an integrated circuit (IC) package with embedd...

Semiconductor device with integrated heat distribution and manufact...

Semiconductor package

Patents Applicationslast 30 patents

METHOD OF FORMING SEMICONDUCTOR DEVICE USING HIGH STRESS CLEAVE PLANE

SEMICONDUCTOR PACKAGE ASSEMBLY WITH AN INTERLAYER COOLING PATHWAY

SEMICONDUCTOR PACKAGE

ANTENNA MODULES EMPLOYING THREE-DIMENSIONAL (3D) BUILD-UP ON MOLD P...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...

Heat-Dissipating Structures for Semiconductor Devices and Methods o...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE ASSEMBLY WITH THERMALLY-CONDUCTIVE FILLER IN A...

Fan-Out Package Having a Main Die and a Dummy Die

PACKAGE STRUCTURE INCLUDING A BACKSIDE METAL FILM ON A SEMICONDUCTO...

HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

SEMICONDUCTOR ASSEMBLIES INCLUDING VERTICALLY INTEGRATED CIRCUITS A...

INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR PACKAGE

MICROELECTRONIC DEVICES INCLUDING RECESSES IN AN ENCAPSULANT MATERI...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

THREE-DIMENSION LARGE SYSTEM INTEGRATION

Heat Dissipation in Semiconductor Packages and Methods of Forming Same

SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER LAYER

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

THERMALLY REGULATED SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE