Thermal management

Industry

CPC
H01L2225/1094

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/1094Thermal management

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of forming semiconductor device using high stress cleave plane
- Patent number 12,176,326
- Issue date Dec 24, 2024
- Silicon Genesis Corporation
- Theodore E. Fong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimension large system integration
- Patent number 12,136,612
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,119,331
- Issue date Oct 15, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation in semiconductor packages and methods of forming same
- Patent number 12,074,148
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fong-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including heat spreader layer
- Patent number 12,040,248
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Jingu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with dummy thermal features on interposer
- Patent number 12,021,068
- Issue date Jun 25, 2024
- Mediatek Inc.
- Bo-Jiun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a thermal material
- Patent number 12,021,005
- Issue date Jun 25, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Keun Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and memory device module
- Patent number 12,009,282
- Issue date Jun 11, 2024
- MEIKO ELECTRONICS CO., LTD.
- Shuzo Akejima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,002,731
- Issue date Jun 4, 2024
- Samsung Electronics Co., Ltd.
- Ae-Nee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package with top-side memory module
- Patent number 11,967,587
- Issue date Apr 23, 2024
- Marvell Israel (M.I.S.L) Ltd.
- Dan Azeroual
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package having a main die and a dummy die
- Patent number 11,967,563
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management for package on package assembly
- Patent number 11,935,877
- Issue date Mar 19, 2024
- Applied Materials, Inc.
- Itai Leshniak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging an integrated circuit (IC) package with embedd...
- Patent number 11,929,300
- Issue date Mar 12, 2024
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with integrated heat distribution and manufact...
- Patent number 11,901,343
- Issue date Feb 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,876,083
- Issue date Jan 16, 2024
- Samsung Electronics Co., Ltd.
- Dongho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Management of heat on a semiconductor device and methods for produc...
- Patent number 11,869,826
- Issue date Jan 9, 2024
- Micron Technology, Inc.
- James S. Rehmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,862,469
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Semiconductor package having an encapsulant comprising conductive f...
- Patent number 11,842,946
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including heat dissipation structure
- Patent number 11,804,444
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Yongjin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staggered dual-side multi-chip interconnect
- Patent number 11,798,923
- Issue date Oct 24, 2023
- NVIDIA Corp.
- Shuo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structure including a thermal isolation material
- Patent number 11,776,945
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive material in the recess of an encapsulant and s...
- Patent number 11,756,802
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,735,563
- Issue date Aug 22, 2023
- Invensas LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and imaging apparatus
- Patent number 11,728,447
- Issue date Aug 15, 2023
- Sony Group Corporation
- Makoto Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 11,721,560
- Issue date Aug 8, 2023
- Innolux Corporation
- Chia-Chieh Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,670,623
- Issue date Jun 6, 2023
- Samsung Electronics Co., Ltd.
- Myung Sam Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies including vertically integrated circuits a...
- Patent number 11,664,291
- Issue date May 30, 2023
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) package with embedded heat spreader in a re...
- Patent number 11,626,340
- Issue date Apr 11, 2023
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device using range compensating mat...
- Patent number 11,626,392
- Issue date Apr 11, 2023
- Silicon Genesis Corporation
- Theodore E. Fong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
- Patent number 11,605,609
- Issue date Mar 14, 2023
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240429214
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20240421138
- Publication date Dec 19, 2024
- STATS ChipPAC Pte Ltd.
- JiSeon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240413040
- Publication date Dec 12, 2024
- JCET GROUP CO., LTD.
- Danfeng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSION LARGE SYSTEM INTEGRATION
- Publication number 20240379637
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Dissipation in Semiconductor Packages and Methods of Forming Same
- Publication number 20240371839
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fong-yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER LAYER
- Publication number 20240347409
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Jingu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20240347411
- Publication date Oct 17, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Keun Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY REGULATED SEMICONDUCTOR DEVICE
- Publication number 20240347413
- Publication date Oct 17, 2024
- Micron Technology, Inc.
- Chen Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321839
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Kyungdon Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321841
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Hwanjoo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING LOWER MOLDED STRUCTURE INCLUDING A SUBS...
- Publication number 20240321759
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240304606
- Publication date Sep 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Wei-Hao CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACT...
- Publication number 20240290761
- Publication date Aug 29, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240274499
- Publication date Aug 15, 2024
- Samsung Electronics Co., Ltd.
- Ae-Nee JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Package Having a Main Die and a Dummy Die
- Publication number 20240266298
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Dissipation Structures and Methods for Forming Same
- Publication number 20240266334
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ke-Gang Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A RE-DISTRIBUTION LAYER (...
- Publication number 20240243056
- Publication date Jul 18, 2024
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULE
- Publication number 20240237188
- Publication date Jul 11, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240178122
- Publication date May 30, 2024
- Samsung Electronics Co., Ltd.
- Kyung Don MUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240153860
- Publication date May 9, 2024
- InnoLux Corporation
- Te-Hsun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANAGEMENT OF HEAT ON A SEMICONDUCTOR DEVICE AND METHODS FOR PRODUC...
- Publication number 20240145341
- Publication date May 2, 2024
- Micron Technology, Inc.
- James S. Rehmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULE
- Publication number 20240138052
- Publication date Apr 25, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240128179
- Publication date Apr 18, 2024
- Unimicron Technology Corp.
- Jyun-Hong CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME
- Publication number 20240128145
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- HYEONSEOK LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRAT...
- Publication number 20240113087
- Publication date Apr 4, 2024
- Intel Corporation
- Brandon Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FIXTURE AND METHODS OF MANUFACTURING
- Publication number 20240096732
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240087983
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Daewoong HEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240087903
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...
- Publication number 20240071865
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240072005
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Kyung Don MUN
- H01 - BASIC ELECTRIC ELEMENTS

Thermal management

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming semiconductor device using high stress cleave plane

Three-dimension large system integration

Semiconductor package

Heat dissipation in semiconductor packages and methods of forming same

Semiconductor package including heat spreader layer

Semiconductor device with dummy thermal features on interposer

Semiconductor device including a thermal material

Memory device and memory device module

Semiconductor package

IC package with top-side memory module

Fan-out package having a main die and a dummy die

Thermal management for package on package assembly

Method for packaging an integrated circuit (IC) package with embedd...

Semiconductor device with integrated heat distribution and manufact...

Semiconductor package

Management of heat on a semiconductor device and methods for produc...

Package structure and method of manufacturing the same

Semiconductor package having an encapsulant comprising conductive f...

Semiconductor package including heat dissipation structure

Staggered dual-side multi-chip interconnect

Package-on-package structure including a thermal isolation material

Thermally conductive material in the recess of an encapsulant and s...

Package-on-package assembly with wire bond vias

Semiconductor device and imaging apparatus

Manufacturing method of semiconductor device

Semiconductor package

Semiconductor assemblies including vertically integrated circuits a...

Integrated circuit (IC) package with embedded heat spreader in a re...

Method of forming semiconductor device using range compensating mat...

Ultra-thin embedded semiconductor device package and method of manu...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

THREE-DIMENSION LARGE SYSTEM INTEGRATION

Heat Dissipation in Semiconductor Packages and Methods of Forming Same

SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER LAYER

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

THERMALLY REGULATED SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE INCLUDING LOWER MOLDED STRUCTURE INCLUDING A SUBS...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACT...

SEMICONDUCTOR PACKAGE

Fan-Out Package Having a Main Die and a Dummy Die

Thermal Dissipation Structures and Methods for Forming Same

INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A RE-DISTRIBUTION LAYER (...

CIRCUIT MODULE

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE

MANAGEMENT OF HEAT ON A SEMICONDUCTOR DEVICE AND METHODS FOR PRODUC...

CIRCUIT MODULE

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME

HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRAT...

SEMICONDUCTOR PACKAGE FIXTURE AND METHODS OF MANUFACTURING

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...

SEMICONDUCTOR PACKAGE