Thermal stress

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H01L2924/351

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/351Thermal stress

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die connection system and method
- Patent number 12,218,093
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,218,044
- Issue date Feb 4, 2025
- Renesas Electronics Corporation
- Nobuhiro Kinoshita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,218,075
- Issue date Feb 4, 2025
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with reinforced element
- Patent number 12,218,080
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip package structure with molding layer
- Patent number 12,218,104
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,211,776
- Issue date Jan 28, 2025
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 12,211,821
- Issue date Jan 28, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structures with conductive elements, and...
- Patent number 12,211,814
- Issue date Jan 28, 2025
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Submodule semiconductor package
- Patent number 12,205,918
- Issue date Jan 21, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- JooYang Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,205,875
- Issue date Jan 21, 2025
- Kioxia Corporation
- Satoshi Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,205,913
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Gayoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous nested interposer package for IC chips
- Patent number 12,199,048
- Issue date Jan 14, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging stacked substrates and an integrated circuit die using a...
- Patent number 12,199,003
- Issue date Jan 14, 2025
- MARVELL ASIA PTE. LTD.
- Luke England
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor apparatus and fabrication method for the same
- Patent number 12,191,275
- Issue date Jan 7, 2025
- Rohm Co., Ltd.
- Takukazu Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal performance improvement and stress reduction in semiconduct...
- Patent number 12,191,264
- Issue date Jan 7, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,651
- Issue date Dec 31, 2024
- Amkor Technology Japan, Inc.
- Masao Hirobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,183,690
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 12,183,596
- Issue date Dec 31, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for manufacturing a semiconductor package structure
- Patent number 12,183,712
- Issue date Dec 31, 2024
- Advanced Semiconductor Engineering, Inc.
- Che-Ting Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process control for package formation
- Patent number 12,183,728
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC module and method of manufacturing IC module
- Patent number 12,183,706
- Issue date Dec 31, 2024
- Murata Manufacturing Co., Ltd.
- Noboru Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out packages with warpage resistance
- Patent number 12,183,675
- Issue date Dec 31, 2024
- Advanced Micro Devices, Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflow method and system
- Patent number 12,176,319
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Shiuan Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure and method for forming the same
- Patent number 12,176,301
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing die attach film, and semiconductor package using the same an...
- Patent number 12,176,314
- Issue date Dec 24, 2024
- Furukawa Electric Co., Ltd.
- Minoru Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and semiconductor package including the same
- Patent number 12,176,308
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Youngkyu Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,170,253
- Issue date Dec 17, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,170,259
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Ju Bin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods of forming the same
- Patent number 12,170,264
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,165,991
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND HEAT DISSIPATION STRUCTURE THEREOF
- Publication number 20250046670
- Publication date Feb 6, 2025
- Siliconware Precision Industries Co., Ltd.
- Wei-Jhen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250046758
- Publication date Feb 6, 2025
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Takashi OHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED WCSP WITH THERMAL PAD FOR EFFICIENT HEAT DISSIPATION
- Publication number 20250046668
- Publication date Feb 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Gail Edselle S. REYES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20250046671
- Publication date Feb 6, 2025
- Fuji Electric Co., Ltd.
- Koji OSAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER MATERIAL
- Publication number 20250041977
- Publication date Feb 6, 2025
- Fuji Electric Co., Ltd.
- Kohei MITSUI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250046759
- Publication date Feb 6, 2025
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Takeshi IMAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250038057
- Publication date Jan 30, 2025
- Kabushiki Kaisha Toshiba
- Eitaro Miyake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF, AND SUBSTRATE...
- Publication number 20250038097
- Publication date Jan 30, 2025
- Siliconware Precision Industries Co., Ltd.
- Chia-Wen TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250038146
- Publication date Jan 30, 2025
- Fuji Electric Co., Ltd.
- Yushi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250038084
- Publication date Jan 30, 2025
- Advanced Semiconductor Engineering, Inc.
- Chiung-Ying KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250029951
- Publication date Jan 23, 2025
- Advanced Semiconductor Engineering, Inc.
- Kay Stefan ESSIG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250029937
- Publication date Jan 23, 2025
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20250029883
- Publication date Jan 23, 2025
- Fuji Electric Co., Ltd.
- Shohei KASAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reducing warpage in a package of stacked integrated circuit dies
- Publication number 20250029948
- Publication date Jan 23, 2025
- Marvell Asia Pte Ltd.
- Runzi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GUARD RING DESIGN ENABLING IN-LINE TESTING OF SILICON BRIDGES FOR S...
- Publication number 20250029908
- Publication date Jan 23, 2025
- Intel Corporation
- Arnab SARKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID EPOXY RESIN COMPOSITION FOR USE AS MOLD UNDERFILL MATERIAL F...
- Publication number 20250026920
- Publication date Jan 23, 2025
- SK HYNIX INC.
- Minsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Methods of Manufacture
- Publication number 20250022763
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Han Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE STRUCTURE
- Publication number 20250022770
- Publication date Jan 16, 2025
- Delta Electronics, Inc.
- Fu-Yuan SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
- Publication number 20250022822
- Publication date Jan 16, 2025
- ROHM CO., LTD.
- Hirofumi TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE
- Publication number 20250022833
- Publication date Jan 16, 2025
- Fuji Electric Co., Ltd.
- Yoko NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
- Publication number 20250022821
- Publication date Jan 16, 2025
- ROHM CO., LTD.
- Hirofumi TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL MATERIAL
- Publication number 20250022829
- Publication date Jan 16, 2025
- AJINOMOTO CO., INC.
- Ichiro OGURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING RECESSES IN AN ENCAPSULANT MATERI...
- Publication number 20250014959
- Publication date Jan 9, 2025
- Micron Technology, Inc.
- Manish Nayini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
- Publication number 20250015015
- Publication date Jan 9, 2025
- Yangtze Memory Technologies Co., Ltd.
- He CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250015062
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250015014
- Publication date Jan 9, 2025
- Sony Semiconductor Solutions Corporation
- TAKUSHI SHIGETOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D-INTERCONNECT
- Publication number 20250015031
- Publication date Jan 9, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Chok J. Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUMMY DIES AND METHOD OF FORMING THE SAME
- Publication number 20250015050
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsing-Yuan HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND SERVER
- Publication number 20250014966
- Publication date Jan 9, 2025
- xFusion Digital Technologies Co., Ltd
- Shuimu JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20250006698
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- CHULWOO KIM
- H01 - BASIC ELECTRIC ELEMENTS

Thermal stress

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor die connection system and method

Semiconductor device

Package structure

Package structure with reinforced element

Method for forming chip package structure with molding layer

Electronic package and manufacturing method thereof

Package-on-package assembly with wire bond vias

Semiconductor interconnect structures with conductive elements, and...

Submodule semiconductor package

Semiconductor device and manufacturing method thereof

Semiconductor package

Heterogeneous nested interposer package for IC chips

Packaging stacked substrates and an integrated circuit die using a...

Power semiconductor apparatus and fabrication method for the same

Thermal performance improvement and stress reduction in semiconduct...

Semiconductor device

Semiconductor package

Low cost package warpage solution

Method and system for manufacturing a semiconductor package structure

Process control for package formation

IC module and method of manufacturing IC module

Fan-out packages with warpage resistance

Reflow method and system

Package structure and method for forming the same

Dicing die attach film, and semiconductor package using the same an...

Package substrate and semiconductor package including the same

Metal-free frame design for silicon bridges for semiconductor packages

Semiconductor package and method of fabricating the same

Integrated circuit packages and methods of forming the same

Semiconductor package

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND HEAT DISSIPATION STRUCTURE THEREOF

SEMICONDUCTOR DEVICE

ENCAPSULATED WCSP WITH THERMAL PAD FOR EFFICIENT HEAT DISSIPATION

SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

SOLDER MATERIAL

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF, AND SUBSTRATE...

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE

ELECTRONIC DEVICE

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE

Reducing warpage in a package of stacked integrated circuit dies

GUARD RING DESIGN ENABLING IN-LINE TESTING OF SILICON BRIDGES FOR S...

LIQUID EPOXY RESIN COMPOSITION FOR USE AS MOLD UNDERFILL MATERIAL F...

Semiconductor Device and Methods of Manufacture

POWER MODULE STRUCTURE

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE

UNDERFILL MATERIAL

MICROELECTRONIC DEVICES INCLUDING RECESSES IN AN ENCAPSULANT MATERI...

THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

3D-INTERCONNECT

DUMMY DIES AND METHOD OF FORMING THE SAME

ELECTRONIC DEVICE AND SERVER

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...