Thermal treatments

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H01L2224/81048

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/81048Thermal treatments

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Hybrid bonding interconnection using laser and thermal compression
- Patent number 11,749,637
- Issue date Sep 5, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Min Ho Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication process and structure of fine pitch traces for a solid...
- Patent number 11,594,509
- Issue date Feb 28, 2023
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for temporarily fastening a semiconductor chip to a surface,...
- Patent number 11,521,946
- Issue date Dec 6, 2022
- OSRAM OLED GmbH
- Klaus Müller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for bonding a chip to a substrate
- Patent number 11,476,228
- Issue date Oct 18, 2022
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Gari Arutinov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 11,476,229
- Issue date Oct 18, 2022
- Kioxia Corporation
- Chikara Miyazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder reflow apparatus and method of manufacturing an electronic d...
- Patent number 11,166,351
- Issue date Nov 2, 2021
- Samsung Electronics Co., Ltd.
- Sin-Yeob Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,063,009
- Issue date Jul 13, 2021
- Renesas Electronics Corporation
- Kenji Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication process and structure of fine pitch traces for a solid...
- Patent number 10,923,449
- Issue date Feb 16, 2021
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method for the same
- Patent number 10,847,492
- Issue date Nov 24, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jyun-Lin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-porous copper to copper interconnect
- Patent number 10,804,241
- Issue date Oct 13, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic package
- Patent number 10,763,237
- Issue date Sep 1, 2020
- Siliconware Precision Industries Co., Ltd.
- Yu-Min Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photodetector-arrays and methods of fabrication thereof
- Patent number 10,644,061
- Issue date May 5, 2020
- Semi-Conductor Devices-An Elbit Systems-Rafael Partnership
- Yoram Karni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic-component mounting apparatus
- Patent number 10,568,245
- Issue date Feb 18, 2020
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-porous copper to copper interconnect
- Patent number 10,553,555
- Issue date Feb 4, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor chip
- Patent number 10,354,973
- Issue date Jul 16, 2019
- TDK Corporation
- Makoto Orikasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu core ball, solder paste, formed solder, Cu core column, and sold...
- Patent number 10,322,472
- Issue date Jun 18, 2019
- Senju Metal Industry Co., Ltd.
- Takahiro Hattori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for producing semiconductor package
- Patent number 10,163,847
- Issue date Dec 25, 2018
- TDK Corporation
- Makoto Orikasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounted substrate, mounted-substrate production method, and mounted...
- Patent number 10,136,570
- Issue date Nov 20, 2018
- Sharp Kabushiki Kaisha
- Katsuhiro Yamaguchi
- G02 - OPTICS
Information Patent Grant
Apparatus and method for manufacturing semiconductor device
- Patent number 10,090,273
- Issue date Oct 2, 2018
- TOSHIBA MEMORY CORPORATION
- Naoyuki Komuta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 10,037,966
- Issue date Jul 31, 2018
- Renesas Electronics Corporation
- Toshihiro Iwasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding with liquid phase solder
- Patent number 10,014,272
- Issue date Jul 3, 2018
- ASM Technology Singapore Pte. Ltd.
- Dewen Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic-component mounting apparatus
- Patent number 9,968,020
- Issue date May 8, 2018
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding systems and methods of operating the same
- Patent number 9,780,066
- Issue date Oct 3, 2017
- Kulicke and Soffa Industries, Inc.
- Matthew B. Wasserman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized sealing of interconnect structures in small gaps
- Patent number 9,685,420
- Issue date Jun 20, 2017
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding systems and methods of operating the same
- Patent number 9,659,902
- Issue date May 23, 2017
- Kulicke and Soffa Industries, Inc.
- Matthew B. Wasserman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding head and die bonding apparatus having the same
- Patent number 9,620,476
- Issue date Apr 11, 2017
- Semes Co., Ltd.
- Hang Lim Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable-size solder bump structures for integrated circuit packaging
- Patent number 9,385,098
- Issue date Jul 5, 2016
- NVIDIA Corporation
- Leilei Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 9,129,840
- Issue date Sep 8, 2015
- Fuji Electric Co., Ltd.
- Norihiro Nashida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for device packaging
- Patent number 9,120,169
- Issue date Sep 1, 2015
- ORION SYSTEMS INTEGRATION PTE LTD
- Hwee Seng Chew
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and encapsulant for flip-chip assembly
- Patent number 9,064,820
- Issue date Jun 23, 2015
- MEKIEC MANUFACTURING CORPORATION (THAILAND) LTD
- Sathid Jitjongruck
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HYBRID BONDING INTERCONNECTION USING LASER AND THERMAL COMPRESSION
- Publication number 20210398940
- Publication date Dec 23, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Min Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Temporarily Fastening a Semiconductor Chip to a Surface,...
- Publication number 20210183800
- Publication date Jun 17, 2021
- OSRAM OLED GmbH
- Klaus Müller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication Process and Structure of Fine Pitch Traces for a Solid...
- Publication number 20210159203
- Publication date May 27, 2021
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20200294960
- Publication date Sep 17, 2020
- Toshiba Memory Corporation
- Chikara MIYAZAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-POROUS COPPER TO COPPER INTERCONNECT
- Publication number 20200098723
- Publication date Mar 26, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC PACKAGE
- Publication number 20200091109
- Publication date Mar 19, 2020
- Siliconware Precision Industries Co., Ltd.
- Yu-Min Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20190393186
- Publication date Dec 26, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- Jyun-Lin WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR BONDING A CHIP TO A SUBSTRATE
- Publication number 20190229085
- Publication date Jul 25, 2019
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Gari Arutinov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-POROUS COPPER TO COPPER INTERCONNECT
- Publication number 20190067239
- Publication date Feb 28, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication Process and Structure of Fine Pitch Traces for a Solid...
- Publication number 20190043821
- Publication date Feb 7, 2019
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR CHIP
- Publication number 20190013293
- Publication date Jan 10, 2019
- TDK Corporation
- Makoto ORIKASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE
- Publication number 20180254255
- Publication date Sep 6, 2018
- TDK Corporation
- Makoto ORIKASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD AND BONDED BODY
- Publication number 20180082973
- Publication date Mar 22, 2018
- Mitsubishi Heavy Industries, Ltd.
- Masahiro KATO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC-COMPONENT MOUNTING APPARATUS AND ELECTRONIC-COMPONENT MO...
- Publication number 20170347504
- Publication date Nov 30, 2017
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BONDING SYSTEMS AND METHODS OF OPERATING THE SAME
- Publication number 20170221854
- Publication date Aug 3, 2017
- Kulicke and Soffa Industries, Inc.
- Matthew Wasserman
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20170092614
- Publication date Mar 30, 2017
- RENESAS ELECTRONICS CORPORATION
- Toshihiro IWASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING WITH LIQUID PHASE SOLDER
- Publication number 20160336292
- Publication date Nov 17, 2016
- ASM Technology Singapore Pte Ltd
- Dewen TIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Localized sealing of interconnect structures in small gaps
- Publication number 20160247778
- Publication date Aug 25, 2016
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BONDING SYSTEMS AND METHODS OF OPERATING THE SAME
- Publication number 20150249027
- Publication date Sep 3, 2015
- KULICKE AND SOFFA INDUSTRIES, INC.
- Matthew B. Wasserman
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD AND ENCAPSULANT FOR FLIP-CHIP ASSEMBLY
- Publication number 20150054154
- Publication date Feb 26, 2015
- MEKTEC MANUFACTURING CORPORATION (THAILAND) LTD
- Sathid Jitjongruck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20140361445
- Publication date Dec 11, 2014
- Norihiro NASHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20140306339
- Publication date Oct 16, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Hikaru Ohira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE PROCESS AND STRUCTURE THEREOF
- Publication number 20140217578
- Publication date Aug 7, 2014
- Chipbond Technology Corporation
- Lung-Hua Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT ASSEMBLIES AND METHODS OF MAKING AND USING SAME
- Publication number 20140145328
- Publication date May 29, 2014
- Georgia Tech Research Corporation
- Rao Tummala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIABLE-SIZE SOLDER BUMP STRUCTURES FOR INTEGRATED CIRCUIT PACKAGING
- Publication number 20140138823
- Publication date May 22, 2014
- NVIDIA Corporation
- Leilei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD-FREE SOLDER BUMP BONDING STRUCTURE
- Publication number 20140054766
- Publication date Feb 27, 2014
- NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
- Eiji HASHINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING STRUCTURE OF ELECTRONIC COMPONENT AND METHOD OF MANUFACTUR...
- Publication number 20130307146
- Publication date Nov 21, 2013
- PANASONIC CORPORATION
- Takatoshi OSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL COMPRESSION BONDING OF SEMICONDUCTOR CHIPS
- Publication number 20130270230
- Publication date Oct 17, 2013
- Yiu Ming CHEUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL COMPRESSION BONDING WITH SEPARATE BOND HEADS
- Publication number 20130032270
- Publication date Feb 7, 2013
- TEXAS INSTRUMENTS INCORPORATED
- KAZUAKI MAWATARI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20120247664
- Publication date Oct 4, 2012
- Kazuhiko KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS

Thermal treatments

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Hybrid bonding interconnection using laser and thermal compression

Fabrication process and structure of fine pitch traces for a solid...

Method for temporarily fastening a semiconductor chip to a surface,...

Method and system for bonding a chip to a substrate

Semiconductor device manufacturing method

Solder reflow apparatus and method of manufacturing an electronic d...

Semiconductor device

Fabrication process and structure of fine pitch traces for a solid...

Semiconductor structure and manufacturing method for the same

Non-porous copper to copper interconnect

Method for manufacturing electronic package

Photodetector-arrays and methods of fabrication thereof

Electronic-component mounting apparatus

Non-porous copper to copper interconnect

Method for producing semiconductor chip

Cu core ball, solder paste, formed solder, Cu core column, and sold...

Method for producing semiconductor package

Mounted substrate, mounted-substrate production method, and mounted...

Apparatus and method for manufacturing semiconductor device

Semiconductor device and manufacturing method therefor

Die bonding with liquid phase solder

Electronic-component mounting apparatus

Thermocompression bonding systems and methods of operating the same

Localized sealing of interconnect structures in small gaps

Thermocompression bonding systems and methods of operating the same

Bonding head and die bonding apparatus having the same

Variable-size solder bump structures for integrated circuit packaging

Semiconductor device and method for manufacturing same

Method for device packaging

Method and encapsulant for flip-chip assembly

Patents Applicationslast 30 patents

HYBRID BONDING INTERCONNECTION USING LASER AND THERMAL COMPRESSION

Method for Temporarily Fastening a Semiconductor Chip to a Surface,...

Fabrication Process and Structure of Fine Pitch Traces for a Solid...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

NON-POROUS COPPER TO COPPER INTERCONNECT

METHOD FOR MANUFACTURING ELECTRONIC PACKAGE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

METHOD AND SYSTEM FOR BONDING A CHIP TO A SUBSTRATE

NON-POROUS COPPER TO COPPER INTERCONNECT

Fabrication Process and Structure of Fine Pitch Traces for a Solid...

METHOD FOR PRODUCING SEMICONDUCTOR CHIP

METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE

BONDING METHOD AND BONDED BODY

ELECTRONIC-COMPONENT MOUNTING APPARATUS AND ELECTRONIC-COMPONENT MO...

THERMOCOMPRESSION BONDING SYSTEMS AND METHODS OF OPERATING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

DIE BONDING WITH LIQUID PHASE SOLDER

Localized sealing of interconnect structures in small gaps

THERMOCOMPRESSION BONDING SYSTEMS AND METHODS OF OPERATING THE SAME

METHOD AND ENCAPSULANT FOR FLIP-CHIP ASSEMBLY

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE PROCESS AND STRUCTURE THEREOF

INTERCONNECT ASSEMBLIES AND METHODS OF MAKING AND USING SAME

VARIABLE-SIZE SOLDER BUMP STRUCTURES FOR INTEGRATED CIRCUIT PACKAGING

LEAD-FREE SOLDER BUMP BONDING STRUCTURE

MOUNTING STRUCTURE OF ELECTRONIC COMPONENT AND METHOD OF MANUFACTUR...

THERMAL COMPRESSION BONDING OF SEMICONDUCTOR CHIPS

THERMAL COMPRESSION BONDING WITH SEPARATE BOND HEADS

BONDING APPARATUS AND BONDING METHOD