Thermal treatments

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H01L2224/85048

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/85048Thermal treatments

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming nanowire connects on (photovoltiac) PV cells
- Patent number 11,527,611
- Issue date Dec 13, 2022
- The Aerospace Corporation
- Eric Joseph Nemanick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus
- Patent number 10,896,892
- Issue date Jan 19, 2021
- Fuji Electric Co., Ltd.
- Fumihiko Momose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor manufacturing for forming bond pads and seal rings
- Patent number 9,601,354
- Issue date Mar 21, 2017
- NXP USA, INC.
- Douglas M. Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,337,134
- Issue date May 10, 2016
- Renesas Electronics Corporation
- Kenji Oyachi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Copper wire receiving pad
- Patent number 9,337,160
- Issue date May 10, 2016
- STMicroelectronics (Grenoble 2) SAS
- Damien Veychard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 9,112,059
- Issue date Aug 18, 2015
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for forming wire bonds
- Patent number 8,444,044
- Issue date May 21, 2013
- Micron Technology, Inc.
- Low Peng Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus and method using the same
- Patent number 8,245,902
- Issue date Aug 21, 2012
- Samsung Electronics Co., Ltd.
- Yong-Je Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device bonding wire and wire bonding method
- Patent number 8,102,061
- Issue date Jan 24, 2012
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for attaching a workpiece to a workpiece support
- Patent number 7,153,788
- Issue date Dec 26, 2006
- Micron Technology, Inc.
- Ed Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire-bonding method for chips with copper interconnects by introduc...
- Patent number 6,962,864
- Issue date Nov 8, 2005
- National Chung Cheng University
- Yeau-Ren Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat transfer of solid-state devices
- Patent number 6,750,538
- Issue date Jun 15, 2004
- Spectra-Physics Semiconductor Lasers, Inc.
- Steven Henry Macomber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for attaching a workpiece to a workpiece support
- Patent number 6,562,277
- Issue date May 13, 2003
- Micron Technology, Inc.
- Ed Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus and method
- Patent number 6,491,202
- Issue date Dec 10, 2002
- Kabushiki Kaisha Shinkawa
- Ryuichi Kyomasu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding method
- Patent number 6,467,679
- Issue date Oct 22, 2002
- Kabushiki Kaisha Shinkawa
- Ryuichi Kyomasu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Top infrared heating for bonding operations
- Patent number 6,384,366
- Issue date May 7, 2002
- Advanced Micro Devices, Inc.
- Pak C. Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for attaching a workpiece to a workpiece support
- Patent number 6,110,805
- Issue date Aug 29, 2000
- Micron Technology, Inc.
- Ed Schrock
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Rapid and selective heating method in integrated circuit package as...
- Patent number 6,041,994
- Issue date Mar 28, 2000
- Texas Instruments Incorporated
- Ming Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonder system
- Patent number 5,377,894
- Issue date Jan 3, 1995
- Kan Electronics Co., Ltd.
- Kiyoshi Mizoguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capillary tip for bonding a wire
- Patent number 4,886,200
- Issue date Dec 12, 1989
- Mitsubishi Denki Kabushiki Kaisha
- Kiyoaki Tsumura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
NANOWIRE INTERCONNECTS
- Publication number 20220149154
- Publication date May 12, 2022
- The Aerospace Corporation
- Eric Joseph NEMANICK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140353822
- Publication date Dec 4, 2014
- RENESAS ELECTRONICS CORPORATION
- Kenji OYACHI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COPPER WIRE RECEIVING PAD
- Publication number 20130001777
- Publication date Jan 3, 2013
- STMicroelectronics (Grenoble 2) SAS
- Damien Veychard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATER BLOCK FOR WIRE BONDING SYSTEM
- Publication number 20120318853
- Publication date Dec 20, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Wai Keong Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS AND METHOD USING THE SAME
- Publication number 20120111923
- Publication date May 10, 2012
- Yong-Je Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20120104613
- Publication date May 3, 2012
- NIPPON MICROMETAL CORPORATION
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT RESISTANT MASKING TAPE AND USAGE THEREOF
- Publication number 20110045638
- Publication date Feb 24, 2011
- Yorinobu Takamatsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE BONDING WIRE AND WIRE BONDING METHOD
- Publication number 20100327450
- Publication date Dec 30, 2010
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AU ALLOY WIRE FOR BALL BONDING
- Publication number 20100314156
- Publication date Dec 16, 2010
- TANAKA DENSHI KOGYO K.K.
- Mitsuo Takada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
APPARATUS AND METHODS FOR FORMING WIRE BONDS
- Publication number 20090223937
- Publication date Sep 10, 2009
- Micron Technology, Inc.
- Low Peng Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for attaching a workpiece to a workpiece support
- Publication number 20070095280
- Publication date May 3, 2007
- Ed Schrock
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WIRE-BONDING METHOD FOR CHIPS WITH COPPER INTERCONNECTS BY INTRODUC...
- Publication number 20050266672
- Publication date Dec 1, 2005
- Yeau-Ren Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT TRANSFER OF SOLID STATE DEVICES
- Publication number 20040080042
- Publication date Apr 29, 2004
- Steven Henry Macomber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for attaching a workpiece to a workpiece support
- Publication number 20030178475
- Publication date Sep 25, 2003
- Ed Schrock
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Wire bonding method
- Publication number 20010042777
- Publication date Nov 22, 2001
- KABUSHIKI KAISHA SHINKAWA
- Ryuichi Kyomasu
- H01 - BASIC ELECTRIC ELEMENTS

Thermal treatments

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming nanowire connects on (photovoltiac) PV cells

Wire bonding apparatus

Semiconductor manufacturing for forming bond pads and seal rings

Semiconductor device

Copper wire receiving pad

Bonding wire for semiconductor device

Apparatus and methods for forming wire bonds

Wire bonding apparatus and method using the same

Semiconductor device bonding wire and wire bonding method

Method and apparatus for attaching a workpiece to a workpiece support

Wire-bonding method for chips with copper interconnects by introduc...

Heat transfer of solid-state devices

Method and apparatus for attaching a workpiece to a workpiece support

Wire bonding apparatus and method

Wire bonding method

Top infrared heating for bonding operations

Method and apparatus for attaching a workpiece to a workpiece support

Rapid and selective heating method in integrated circuit package as...

Wire bonder system

Capillary tip for bonding a wire

Patents Applicationslast 30 patents

NANOWIRE INTERCONNECTS

SEMICONDUCTOR DEVICE

COPPER WIRE RECEIVING PAD

HEATER BLOCK FOR WIRE BONDING SYSTEM

WIRE BONDING APPARATUS AND METHOD USING THE SAME

BONDING WIRE FOR SEMICONDUCTOR DEVICE

HEAT RESISTANT MASKING TAPE AND USAGE THEREOF

SEMICONDUCTOR DEVICE BONDING WIRE AND WIRE BONDING METHOD

AU ALLOY WIRE FOR BALL BONDING

APPARATUS AND METHODS FOR FORMING WIRE BONDS

Method and apparatus for attaching a workpiece to a workpiece support

WIRE-BONDING METHOD FOR CHIPS WITH COPPER INTERCONNECTS BY INTRODUC...

HEAT TRANSFER OF SOLID STATE DEVICES

Method and apparatus for attaching a workpiece to a workpiece support

Wire bonding method