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H01L2224/85048
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/85048
Thermal treatments
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People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Method of forming nanowire connects on (photovoltiac) PV cells
Patent number
11,527,611
Issue date
Dec 13, 2022
The Aerospace Corporation
Eric Joseph Nemanick
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire bonding apparatus
Patent number
10,896,892
Issue date
Jan 19, 2021
Fuji Electric Co., Ltd.
Fumihiko Momose
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor manufacturing for forming bond pads and seal rings
Patent number
9,601,354
Issue date
Mar 21, 2017
NXP USA, INC.
Douglas M. Reber
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
9,337,134
Issue date
May 10, 2016
Renesas Electronics Corporation
Kenji Oyachi
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Copper wire receiving pad
Patent number
9,337,160
Issue date
May 10, 2016
STMicroelectronics (Grenoble 2) SAS
Damien Veychard
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding wire for semiconductor device
Patent number
9,112,059
Issue date
Aug 18, 2015
Nippon Steel & Sumikin Materials Co., Ltd.
Tomohiro Uno
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus and methods for forming wire bonds
Patent number
8,444,044
Issue date
May 21, 2013
Micron Technology, Inc.
Low Peng Wang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wire bonding apparatus and method using the same
Patent number
8,245,902
Issue date
Aug 21, 2012
Samsung Electronics Co., Ltd.
Yong-Je Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device bonding wire and wire bonding method
Patent number
8,102,061
Issue date
Jan 24, 2012
Nippon Steel Materials Co., Ltd.
Tomohiro Uno
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for attaching a workpiece to a workpiece support
Patent number
7,153,788
Issue date
Dec 26, 2006
Micron Technology, Inc.
Ed Schrock
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire-bonding method for chips with copper interconnects by introduc...
Patent number
6,962,864
Issue date
Nov 8, 2005
National Chung Cheng University
Yeau-Ren Jeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heat transfer of solid-state devices
Patent number
6,750,538
Issue date
Jun 15, 2004
Spectra-Physics Semiconductor Lasers, Inc.
Steven Henry Macomber
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for attaching a workpiece to a workpiece support
Patent number
6,562,277
Issue date
May 13, 2003
Micron Technology, Inc.
Ed Schrock
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire bonding apparatus and method
Patent number
6,491,202
Issue date
Dec 10, 2002
Kabushiki Kaisha Shinkawa
Ryuichi Kyomasu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wire bonding method
Patent number
6,467,679
Issue date
Oct 22, 2002
Kabushiki Kaisha Shinkawa
Ryuichi Kyomasu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Top infrared heating for bonding operations
Patent number
6,384,366
Issue date
May 7, 2002
Advanced Micro Devices, Inc.
Pak C. Wong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for attaching a workpiece to a workpiece support
Patent number
6,110,805
Issue date
Aug 29, 2000
Micron Technology, Inc.
Ed Schrock
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Rapid and selective heating method in integrated circuit package as...
Patent number
6,041,994
Issue date
Mar 28, 2000
Texas Instruments Incorporated
Ming Hwang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire bonder system
Patent number
5,377,894
Issue date
Jan 3, 1995
Kan Electronics Co., Ltd.
Kiyoshi Mizoguchi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Capillary tip for bonding a wire
Patent number
4,886,200
Issue date
Dec 12, 1989
Mitsubishi Denki Kabushiki Kaisha
Kiyoaki Tsumura
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
NANOWIRE INTERCONNECTS
Publication number
20220149154
Publication date
May 12, 2022
The Aerospace Corporation
Eric Joseph NEMANICK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20140353822
Publication date
Dec 4, 2014
RENESAS ELECTRONICS CORPORATION
Kenji OYACHI
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
COPPER WIRE RECEIVING PAD
Publication number
20130001777
Publication date
Jan 3, 2013
STMicroelectronics (Grenoble 2) SAS
Damien Veychard
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HEATER BLOCK FOR WIRE BONDING SYSTEM
Publication number
20120318853
Publication date
Dec 20, 2012
FREESCALE SEMICONDUCTOR, INC.
Wai Keong Wong
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRE BONDING APPARATUS AND METHOD USING THE SAME
Publication number
20120111923
Publication date
May 10, 2012
Yong-Je Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
Publication number
20120104613
Publication date
May 3, 2012
NIPPON MICROMETAL CORPORATION
Tomohiro Uno
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HEAT RESISTANT MASKING TAPE AND USAGE THEREOF
Publication number
20110045638
Publication date
Feb 24, 2011
Yorinobu Takamatsu
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
SEMICONDUCTOR DEVICE BONDING WIRE AND WIRE BONDING METHOD
Publication number
20100327450
Publication date
Dec 30, 2010
Nippon Steel Materials Co., Ltd.
Tomohiro Uno
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
AU ALLOY WIRE FOR BALL BONDING
Publication number
20100314156
Publication date
Dec 16, 2010
TANAKA DENSHI KOGYO K.K.
Mitsuo Takada
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
APPARATUS AND METHODS FOR FORMING WIRE BONDS
Publication number
20090223937
Publication date
Sep 10, 2009
Micron Technology, Inc.
Low Peng Wang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method and apparatus for attaching a workpiece to a workpiece support
Publication number
20070095280
Publication date
May 3, 2007
Ed Schrock
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
WIRE-BONDING METHOD FOR CHIPS WITH COPPER INTERCONNECTS BY INTRODUC...
Publication number
20050266672
Publication date
Dec 1, 2005
Yeau-Ren Jeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HEAT TRANSFER OF SOLID STATE DEVICES
Publication number
20040080042
Publication date
Apr 29, 2004
Steven Henry Macomber
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method and apparatus for attaching a workpiece to a workpiece support
Publication number
20030178475
Publication date
Sep 25, 2003
Ed Schrock
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
Wire bonding method
Publication number
20010042777
Publication date
Nov 22, 2001
KABUSHIKI KAISHA SHINKAWA
Ryuichi Kyomasu
H01 - BASIC ELECTRIC ELEMENTS