Thermal treatments

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CPC
H01L2224/81948

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81948Thermal treatments

Industries

Patents Grantslast 30 patents

Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 11,476,291
- Issue date Oct 18, 2022
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Module and method of manufacturing module
- Patent number 11,276,631
- Issue date Mar 15, 2022
- Murata Manufacturing Co., Ltd.
- Yoshitaka Matsukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrated circuit (3DIC) structure
- Patent number 11,239,201
- Issue date Feb 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder reflow apparatus and method of manufacturing an electronic d...
- Patent number 11,166,351
- Issue date Nov 2, 2021
- Samsung Electronics Co., Ltd.
- Sin-Yeob Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage-compensated bonded structure including a support chip and a...
- Patent number 11,114,406
- Issue date Sep 7, 2021
- SanDisk Technologies LLC
- Senaka Kanakamedala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,043,462
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 10,998,284
- Issue date May 4, 2021
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Copper electroplating compositions and methods of electroplating co...
- Patent number 10,927,468
- Issue date Feb 23, 2021
- Rohm and Haas Electronic Materials LLC
- Ravi Pokhrel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic package
- Patent number 10,763,237
- Issue date Sep 1, 2020
- Siliconware Precision Industries Co., Ltd.
- Yu-Min Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photodetector-arrays and methods of fabrication thereof
- Patent number 10,644,061
- Issue date May 5, 2020
- Semi-Conductor Devices-An Elbit Systems-Rafael Partnership
- Yoram Karni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced cleaning for water-soluble flux soldering
- Patent number 10,636,763
- Issue date Apr 28, 2020
- International Business Machines Corporation
- Charles C. Bureau
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 10,600,838
- Issue date Mar 24, 2020
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper electroplating compositions and methods of electroplating co...
- Patent number 10,533,259
- Issue date Jan 14, 2020
- Rohm and Haas Electronic Materials LLC
- Ravi Pokhrel
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
3D packaging method for semiconductor components
- Patent number 10,418,339
- Issue date Sep 17, 2019
- Imec VZW
- Fabrice Duval
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 10,319,691
- Issue date Jun 11, 2019
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded 3D integrated circuit (3DIC) structure
- Patent number 10,319,701
- Issue date Jun 11, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for manufacturing semiconductor device
- Patent number 10,090,273
- Issue date Oct 2, 2018
- TOSHIBA MEMORY CORPORATION
- Naoyuki Komuta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-strike process for bonding packages and the packages thereof
- Patent number 10,068,868
- Issue date Sep 4, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang Shao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced cleaning for water-soluble flux soldering
- Patent number 9,818,717
- Issue date Nov 14, 2017
- International Business Machines Corporation
- Charles C. Bureau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus and method for fabricating the same
- Patent number 9,812,418
- Issue date Nov 7, 2017
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression bonding systems and methods of operating the same
- Patent number 9,780,066
- Issue date Oct 3, 2017
- Kulicke and Soffa Industries, Inc.
- Matthew B. Wasserman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus and method for fabricating the same
- Patent number 9,761,552
- Issue date Sep 12, 2017
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal compression bonding process cooling manifold
- Patent number 9,748,199
- Issue date Aug 29, 2017
- Intel Corporation
- Hemanth Dhavaleswarapu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bumps formed on wafers using preformed solder balls with dif...
- Patent number 9,721,919
- Issue date Aug 1, 2017
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interfacial alloy layer for improving electromigration (EM) resista...
- Patent number 9,698,119
- Issue date Jul 4, 2017
- International Business Machines Corporation
- Hirokazu Noma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding systems and methods of operating the same
- Patent number 9,659,902
- Issue date May 23, 2017
- Kulicke and Soffa Industries, Inc.
- Matthew B. Wasserman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method, bonding apparatus, and method for manufacturing sub...
- Patent number 9,640,507
- Issue date May 2, 2017
- Samsung Electronics Co., Ltd.
- Ilyoung Han
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOW PRESSURE SINTERING POWDER
- Publication number 20240413117
- Publication date Dec 12, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SUBSTRATE BONDING METHOD
- Publication number 20240038705
- Publication date Feb 1, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yunzhi LING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT (3DIC) STRUCTURE
- Publication number 20230230962
- Publication date Jul 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE INCLUDING A WIRING PAD AND METHOD FOR MANUFACTURING...
- Publication number 20230207573
- Publication date Jun 29, 2023
- SAMSUNG DISPLAY CO., LTD.
- JI WOONG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20230005979
- Publication date Jan 5, 2023
- SONY GROUP CORPORATION
- Satoru WAKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT (3DIC) STRUCTURE
- Publication number 20220157785
- Publication date May 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE AND METHOD OF MANUFACTURING MODULE
- Publication number 20200118913
- Publication date Apr 16, 2020
- MURATA MANUFACTURING CO., LTD.
- Yoshitaka MATSUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC PACKAGE
- Publication number 20200091109
- Publication date Mar 19, 2020
- Siliconware Precision Industries Co., Ltd.
- Yu-Min Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20190326344
- Publication date Oct 24, 2019
- SONY CORPORATION
- Satoru WAKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Interconnection Structure and Method of Forming Same
- Publication number 20190295971
- Publication date Sep 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT (3DIC) STRUCTURE AND METHOD OF MAKING SAME
- Publication number 20190295989
- Publication date Sep 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Packaging Method for Semiconductor Components
- Publication number 20190006301
- Publication date Jan 3, 2019
- IMEC vzw
- Fabrice Duval
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED CLEANING FOR WATER-SOLUBLE FLUX SOLDERING
- Publication number 20180005975
- Publication date Jan 4, 2018
- International Business Machines Corporation
- Charles C. Bureau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED CLEANING FOR WATER-SOLUBLE FLUX SOLDERING
- Publication number 20170243852
- Publication date Aug 24, 2017
- International Business Machines Corporation
- Charles C. Bureau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BONDING SYSTEMS AND METHODS OF OPERATING THE SAME
- Publication number 20170221854
- Publication date Aug 3, 2017
- Kulicke and Soffa Industries, Inc.
- Matthew Wasserman
- B32 - LAYERED PRODUCTS
Information Patent Application
Multi-Strike Process for Bonding
- Publication number 20170194278
- Publication date Jul 6, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMPS FORMED ON WAFERS USING PREFORMED SOLDER BALLS WITH DIF...
- Publication number 20170170140
- Publication date Jun 15, 2017
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnection Structure and Method of Forming Same
- Publication number 20170117245
- Publication date Apr 27, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE DEVICE AND CAVITY FORMATION BY SOLDER REMOVAL FO...
- Publication number 20160351522
- Publication date Dec 1, 2016
- FREESCALE SEMICONDUCTOR, INC.
- MICHAEL B. VINCENT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT (3DIC) STRUCTURE AND METHOD OF MAKING SAME
- Publication number 20160197055
- Publication date Jul 7, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160079200
- Publication date Mar 17, 2016
- Kabushiki Kaisha Toshiba
- Naoyuki KOMUTA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP BONDER AND FLIP CHIP BONDING METHOD
- Publication number 20150380381
- Publication date Dec 31, 2015
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BONDING SYSTEMS AND METHODS OF OPERATING THE SAME
- Publication number 20150249027
- Publication date Sep 3, 2015
- KULICKE AND SOFFA INDUSTRIES, INC.
- Matthew B. Wasserman
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICES AND PACKAGES INCLUDING CONDUCTIVE UNDERFILL M...
- Publication number 20140291834
- Publication date Oct 2, 2014
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D ASSEMBLY FOR INTERPOSER BOW
- Publication number 20140209666
- Publication date Jul 31, 2014
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING SEMICONDUCTOR SUBSTRATES AND DEVICES OBTAINED TH...
- Publication number 20140170813
- Publication date Jun 19, 2014
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTING ELEMENT HAVING NANO-TWINNED COPPER, METHOD OF...
- Publication number 20140090880
- Publication date Apr 3, 2014
- NATIONAL CHIAO-TUNG UNIVERSITY
- Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERFACIAL ALLOY LAYER FOR IMPROVING ELECTROMIGRATION (EM) RESISTA...
- Publication number 20140061889
- Publication date Mar 6, 2014
- International Business Machines Corporation
- Hirokazu Noma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD-FREE SOLDER BUMP BONDING STRUCTURE
- Publication number 20140054766
- Publication date Feb 27, 2014
- NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
- Eiji HASHINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package Structure and Substrate Bonding Method
- Publication number 20130285248
- Publication date Oct 31, 2013
- ASIA PACIFIC MICROSYSTEMS, INC.
- Hung-Lin Yin
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Thermal treatments

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low pressure sintering powder

Solderless interconnection structure and method of forming same

Semiconductor device and method of manufacturing thereof

Sintering materials and attachment methods using same

Module and method of manufacturing module

3D integrated circuit (3DIC) structure

Solder reflow apparatus and method of manufacturing an electronic d...

Warpage-compensated bonded structure including a support chip and a...

Solderless interconnection structure and method of forming same

Low pressure sintering powder

Copper electroplating compositions and methods of electroplating co...

Method for manufacturing electronic package

Photodetector-arrays and methods of fabrication thereof

Enhanced cleaning for water-soluble flux soldering

Semiconductor device and method of manufacturing thereof

Copper electroplating compositions and methods of electroplating co...

3D packaging method for semiconductor components

Solderless interconnection structure and method of forming same

Bonded 3D integrated circuit (3DIC) structure

Apparatus and method for manufacturing semiconductor device

Multi-strike process for bonding packages and the packages thereof

Enhanced cleaning for water-soluble flux soldering

Electronic apparatus and method for fabricating the same

Thermocompression bonding systems and methods of operating the same

Electronic apparatus and method for fabricating the same

Thermal compression bonding process cooling manifold

Solder bumps formed on wafers using preformed solder balls with dif...

Interfacial alloy layer for improving electromigration (EM) resista...

Thermocompression bonding systems and methods of operating the same

Bonding method, bonding apparatus, and method for manufacturing sub...

Patents Applicationslast 30 patents

LOW PRESSURE SINTERING POWDER

SUBSTRATE BONDING METHOD

3D INTEGRATED CIRCUIT (3DIC) STRUCTURE

DISPLAY DEVICE INCLUDING A WIRING PAD AND METHOD FOR MANUFACTURING...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

3D INTEGRATED CIRCUIT (3DIC) STRUCTURE

MODULE AND METHOD OF MANUFACTURING MODULE

METHOD FOR MANUFACTURING ELECTRONIC PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

Solderless Interconnection Structure and Method of Forming Same

3D INTEGRATED CIRCUIT (3DIC) STRUCTURE AND METHOD OF MAKING SAME

3D Packaging Method for Semiconductor Components

ENHANCED CLEANING FOR WATER-SOLUBLE FLUX SOLDERING

ENHANCED CLEANING FOR WATER-SOLUBLE FLUX SOLDERING

THERMOCOMPRESSION BONDING SYSTEMS AND METHODS OF OPERATING THE SAME

Multi-Strike Process for Bonding

SOLDER BUMPS FORMED ON WAFERS USING PREFORMED SOLDER BALLS WITH DIF...

Interconnection Structure and Method of Forming Same

PACKAGE-ON-PACKAGE DEVICE AND CAVITY FORMATION BY SOLDER REMOVAL FO...

3D INTEGRATED CIRCUIT (3DIC) STRUCTURE AND METHOD OF MAKING SAME

APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

FLIP CHIP BONDER AND FLIP CHIP BONDING METHOD

THERMOCOMPRESSION BONDING SYSTEMS AND METHODS OF OPERATING THE SAME

SEMICONDUCTOR DEVICES AND PACKAGES INCLUDING CONDUCTIVE UNDERFILL M...

3D ASSEMBLY FOR INTERPOSER BOW

METHOD FOR BONDING SEMICONDUCTOR SUBSTRATES AND DEVICES OBTAINED TH...

ELECTRICAL CONNECTING ELEMENT HAVING NANO-TWINNED COPPER, METHOD OF...

INTERFACIAL ALLOY LAYER FOR IMPROVING ELECTROMIGRATION (EM) RESISTA...

LEAD-FREE SOLDER BUMP BONDING STRUCTURE

Package Structure and Substrate Bonding Method