Thermal treatments

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H01L2224/80048

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/80048Thermal treatments

Industries

Patents Grantslast 30 patents

Information Patent Grant
Low temperature hybrid bonding
- Patent number 11,911,839
- Issue date Feb 27, 2024
- Advanced Micro Devices, Inc.
- Priyal Shah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,869,870
- Issue date Jan 9, 2024
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with re-fill layer
- Patent number 11,646,292
- Issue date May 9, 2023
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 11,600,598
- Issue date Mar 7, 2023
- SK hynix Inc.
- Jin Ha Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,488,930
- Issue date Nov 1, 2022
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly containing oxidation barriers, hybrid bonding, or a...
- Patent number 11,393,780
- Issue date Jul 19, 2022
- SanDisk Technologies LLC
- Ramy Nashed Bassely Said
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly containing oxidation barriers and/or adhesion enhan...
- Patent number 11,139,272
- Issue date Oct 5, 2021
- SanDisk Technologies LLC
- Raghuveer S. Makala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 10,978,428
- Issue date Apr 13, 2021
- SK hynix Inc.
- Jin Ha Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 10,910,341
- Issue date Feb 2, 2021
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of liquid assisted micro cold binding
- Patent number 10,672,736
- Issue date Jun 2, 2020
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solar cell manufacturing method
- Patent number 10,636,919
- Issue date Apr 28, 2020
- TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
- Takahiro Hiramatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing substrate structure
- Patent number 10,468,400
- Issue date Nov 5, 2019
- Samsung Electronics Co., Ltd.
- Pil Kyu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-plated substrate for die attachment
- Patent number 9,893,027
- Issue date Feb 13, 2018
- NXP USA, INC.
- David F. Abdo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method, storage medium, bonding apparatus and bonding system
- Patent number 9,741,595
- Issue date Aug 22, 2017
- Tokyo Electron Limited
- Kenji Sugakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-wafer pair anodic bonding apparatus and method
- Patent number 9,287,126
- Issue date Mar 15, 2016
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Integrated circuit assembly and method of making
- Patent number 8,912,646
- Issue date Dec 16, 2014
- Silanna Semiconductor U.S.A., Inc.
- Michael A. Stuber
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE BONDING SYSTEM AND METHOD FOR SUBSTRATE BONDING
- Publication number 20240014153
- Publication date Jan 11, 2024
- TOKYO ELECTRON LIMITED
- Takashi FUJIBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE AND FABRICATION METHOD
- Publication number 20230402425
- Publication date Dec 14, 2023
- Yangtze Memory Technologies Co., Ltd.
- Zhiyong LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A PROCEDURE TO ENABLE DIE REWORK FOR HYBRID BONDING
- Publication number 20230260955
- Publication date Aug 17, 2023
- Ying WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20230207529
- Publication date Jun 29, 2023
- SK HYNIX INC.
- Jin Ha KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH RE-FILL LAYER
- Publication number 20230110531
- Publication date Apr 13, 2023
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20210193627
- Publication date Jun 24, 2021
- SK HYNIX INC.
- Jin Ha KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY CONTAINING OXIDATION BARRIERS AND/OR ADHESION ENHAN...
- Publication number 20210028149
- Publication date Jan 28, 2021
- SANDISK TECHNOLOGIES LLC
- Raghuveer S. MAKALA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY CONTAINING OXIDATION BARRIERS, HYBRID BONDING, OR A...
- Publication number 20210028135
- Publication date Jan 28, 2021
- SANDISK TECHNOLOGIES LLC
- Ramy Nashed Bassely SAID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-PLATED SUBSTRATE FOR DIE ATTACHMENT
- Publication number 20180012855
- Publication date Jan 11, 2018
- NXP USA, Inc.
- David F. Abdo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-PLATED SUBSTRATE FOR DIE ATTACHMENT
- Publication number 20170294393
- Publication date Oct 12, 2017
- FREESCALE SEMICONDUCTOR, INC.
- David F. Abdo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-WAFER PAIR ANODIC BONDING APPARATUS AND METHOD
- Publication number 20140322892
- Publication date Oct 30, 2014
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
INTERCONNECT ASSEMBLIES AND METHODS OF MAKING AND USING SAME
- Publication number 20140145328
- Publication date May 29, 2014
- Georgia Tech Research Corporation
- Rao Tummala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLY AND METHOD OF MAKING
- Publication number 20130134585
- Publication date May 30, 2013
- IO SEMICONDUCTOR, INC.
- Michael A. Stuber
- H01 - BASIC ELECTRIC ELEMENTS

Thermal treatments

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low temperature hybrid bonding

Bonding process with inhibited oxide formation

Method for fabricating semiconductor device with re-fill layer

Manufacturing method of semiconductor device

Bonding process with inhibited oxide formation

Bonded assembly containing oxidation barriers, hybrid bonding, or a...

Bonded assembly containing oxidation barriers and/or adhesion enhan...

Manufacturing method of semiconductor device

Bonding process with inhibited oxide formation

Method of liquid assisted micro cold binding

Solar cell manufacturing method

Method of manufacturing substrate structure

Pre-plated substrate for die attachment

Bonding method, storage medium, bonding apparatus and bonding system

Multi-wafer pair anodic bonding apparatus and method

Integrated circuit assembly and method of making

Patents Applicationslast 30 patents

SUBSTRATE BONDING SYSTEM AND METHOD FOR SUBSTRATE BONDING

THREE-DIMENSIONAL MEMORY DEVICE AND FABRICATION METHOD

A PROCEDURE TO ENABLE DIE REWORK FOR HYBRID BONDING

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH RE-FILL LAYER

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

BONDED ASSEMBLY CONTAINING OXIDATION BARRIERS AND/OR ADHESION ENHAN...

BONDED ASSEMBLY CONTAINING OXIDATION BARRIERS, HYBRID BONDING, OR A...

PRE-PLATED SUBSTRATE FOR DIE ATTACHMENT

PRE-PLATED SUBSTRATE FOR DIE ATTACHMENT

MULTI-WAFER PAIR ANODIC BONDING APPARATUS AND METHOD

INTERCONNECT ASSEMBLIES AND METHODS OF MAKING AND USING SAME

INTEGRATED CIRCUIT ASSEMBLY AND METHOD OF MAKING