Thermal treatments

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H01L2224/83048

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83048Thermal treatments

Industries

Patents Grantslast 30 patents

Information Patent Grant
Self-aligned interconnect structures and methods of fabrication
- Patent number 12,266,570
- Issue date Apr 1, 2025
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device
- Patent number 12,173,207
- Issue date Dec 24, 2024
- Celanese Mercury Holdings Inc.
- Yumi Matsuura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 12,080,662
- Issue date Sep 3, 2024
- Samsung Display Co., Ltd.
- Eui Jeong Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die, a semiconductor die stack, and a semiconductor m...
- Patent number 12,046,573
- Issue date Jul 23, 2024
- SK hynix Inc.
- Jin Woong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and preparation method thereof
- Patent number 12,033,994
- Issue date Jul 9, 2024
- BOE Technology Group Co., Ltd.
- Zhijun Lv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of providing the same
- Patent number 11,950,467
- Issue date Apr 2, 2024
- Samsung Display Co., Ltd.
- Byoungyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low warpage curing methodology by inducing curvature
- Patent number 11,929,260
- Issue date Mar 12, 2024
- Applied Materials, Inc.
- Fang Jie Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,869,870
- Issue date Jan 9, 2024
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,776,932
- Issue date Oct 3, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,626,383
- Issue date Apr 11, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Power module comprising two substrates and method of manufacturing...
- Patent number 11,574,889
- Issue date Feb 7, 2023
- Infineon Technologies AG
- Ottmar Geitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,488,930
- Issue date Nov 1, 2022
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jointing material, fabrication method for semiconductor device usin...
- Patent number 11,476,399
- Issue date Oct 18, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidetoshi Kitaura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die-attach method to compensate for thermal expansion
- Patent number 11,430,744
- Issue date Aug 30, 2022
- Cree, Inc.
- David Seebacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating high-power module
- Patent number 11,426,793
- Issue date Aug 30, 2022
- National Cheng Kung University
- In-Gann Chen
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Chip bonding method and bonding device
- Patent number 11,239,198
- Issue date Feb 1, 2022
- BOE Technology Group Co., Ltd.
- Lili Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,950,527
- Issue date Mar 16, 2021
- Renesas Electronics Corporation
- Shoji Hashizume
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 10,910,341
- Issue date Feb 2, 2021
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material on package
- Patent number 10,896,862
- Issue date Jan 19, 2021
- International Business Machines Corporation
- Isabel De Sousa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for improved delamination characteristics in a...
- Patent number 10,763,130
- Issue date Sep 1, 2020
- Microchip Technology Incorporated
- Taweesak Laevohan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging methods using a photolithographic bonding mat...
- Patent number 10,755,979
- Issue date Aug 25, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hu Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and method for manufacturing power semic...
- Patent number 10,727,167
- Issue date Jul 28, 2020
- Mitsubishi Electric Corporation
- Takayuki Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant layer for wafer to wafer bonding
- Patent number 10,707,186
- Issue date Jul 7, 2020
- Intel Corporation
- Mauro J. Kobrinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste for bonding
- Patent number 10,696,875
- Issue date Jun 30, 2020
- E. I. Du Pont de Nemours and Company
- Yumi Matsuura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic-component mounting apparatus
- Patent number 10,568,245
- Issue date Feb 18, 2020
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 10,541,224
- Issue date Jan 21, 2020
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method of fixing an object to a rough surface
- Patent number 10,483,231
- Issue date Nov 19, 2019
- Tsinghua University
- Xiang Jin
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Method for manufacturing semiconductor apparatus, method for manufa...
- Patent number 10,416,557
- Issue date Sep 17, 2019
- Shin-Etsu Chemical Co., Ltd.
- Kyoko Soga
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Micro-pillar assisted semiconductor bonding
- Patent number 10,319,693
- Issue date Jun 11, 2019
- Skorpios Technologies, Inc.
- Damien Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic sub-assembly and method for the production of an electro...
- Patent number 10,229,895
- Issue date Mar 12, 2019
- Schweizer Electronic AG
- Thomas Gottwald
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Heat-Electricity Discrete Power Module Including Two-Way Heat-Dissi...
- Publication number 20250132233
- Publication date Apr 24, 2025
- ICP TECHNOLOGY CO., LTD.
- HO-CHIEH YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID STACKING OF SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSE...
- Publication number 20250132302
- Publication date Apr 24, 2025
- Micron Technology, Inc.
- Kwun-Han Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SURFACE MODIFICATION FOR WAFER BONDING
- Publication number 20250087628
- Publication date Mar 13, 2025
- TOKYO ELECTRON LIMITED
- Soo Doo CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240404969
- Publication date Dec 5, 2024
- SAMSUNG DISPLAY CO., LTD.
- EUI JEONG KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP MOUNTING STRUCTURE AND FLIP-CHIP MOUNTING METHOD
- Publication number 20240387444
- Publication date Nov 21, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- TAKAHIRO KUMAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...
- Publication number 20240332241
- Publication date Oct 3, 2024
- SK HYNIX INC.
- Jin Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-DENSIFYING NANO-SILVER PASTE AND A METHOD OF FORMING INTERCONN...
- Publication number 20230230950
- Publication date Jul 20, 2023
- NANO AND ADVANCED MATERIALS INSTITUTE LIMITED
- Yuechen WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20230207517
- Publication date Jun 29, 2023
- Fuji Electric Co., Ltd.
- Tsunehiro NAKAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...
- Publication number 20230139612
- Publication date May 4, 2023
- SK HYNIX INC.
- Jin Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF PROVIDING THE SAME
- Publication number 20220392989
- Publication date Dec 8, 2022
- BYOUNGYONG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND PREPARATION METHOD THEREOF
- Publication number 20220068899
- Publication date Mar 3, 2022
- Boe Technology Group Co., Ltd.
- Zhijun LV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210375804
- Publication date Dec 2, 2021
- SAMSUNG DISPLAY CO., LTD.
- EUI JEONG KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING METHOD AND BONDING DEVICE
- Publication number 20210159208
- Publication date May 27, 2021
- BOE TECHNOLOGY GROUP CO., LTD.
- Lili WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING
- Publication number 20210104488
- Publication date Apr 8, 2021
- DANFOSS SILICON POWER GMBH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD FOR BONDING SUBSTRATE, TRANSPARENT SUBSTRATE LAMINATE, AND D...
- Publication number 20210017075
- Publication date Jan 21, 2021
- LAN TECHNICAL SERVICE CO., LTD.
- Tadatomo SUGA
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE
- Publication number 20200248040
- Publication date Aug 6, 2020
- DUPONT ELECTRONICS, INC.
- Yumi Matsuura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE BONDING APPARATUS AND DIE BONDING METHOD
- Publication number 20200243477
- Publication date Jul 30, 2020
- FURUKAWA ELECTRIC CO., LTD.
- Teruyuki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Fabricating High-Power Module
- Publication number 20200171578
- Publication date Jun 4, 2020
- National Cheng Kung University
- In-Gann Chen
- B22 - CASTING POWDER METALLURGY
Information Patent Application
WAFER-LEVEL PACKAGING METHODS USING A PHOTOLITHOGRAPHIC BONDING MAT...
- Publication number 20200135689
- Publication date Apr 30, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hu SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190311974
- Publication date Oct 10, 2019
- RENESAS ELECTRONICS CORPORATION
- Shoji HASHIZUME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD OF FIXING AN OBJECT TO A ROUGH SURFACE
- Publication number 20190206830
- Publication date Jul 4, 2019
- TSINGHUA UNIVERSITY
- XIANG JIN
- C01 - INORGANIC CHEMISTRY
Information Patent Application
DIE BONDING TO A BOARD
- Publication number 20190013308
- Publication date Jan 10, 2019
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL ON PACKAGE
- Publication number 20180190565
- Publication date Jul 5, 2018
- International Business Machines Corporation
- Isabel DE SOUSA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Paste For Bonding
- Publication number 20180072923
- Publication date Mar 15, 2018
- E I DU PONT DE NEMOURS AND COMPANY
- Yumi Matsuura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL INTERFACE MATERIAL ON PACKAGE
- Publication number 20180047655
- Publication date Feb 15, 2018
- International Business Machines Corporation
- Isabel DE SOUSA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING APPARATUS AND DIE BONDING METHOD
- Publication number 20170365578
- Publication date Dec 21, 2017
- FURUKAWA ELECTRIC CO., LTD.
- Teruyuki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD
- Publication number 20170352635
- Publication date Dec 7, 2017
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC-COMPONENT MOUNTING APPARATUS AND ELECTRONIC-COMPONENT MO...
- Publication number 20170347504
- Publication date Nov 30, 2017
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING SEMICONDUCTOR SUBSTRATES
- Publication number 20170301646
- Publication date Oct 19, 2017
- IMEC vzw
- Soon-Wook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERFORMING DIRECT BONDING BETWEEN TWO STRUCTURES
- Publication number 20170179073
- Publication date Jun 22, 2017
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Hubert MORICEAU
- H01 - BASIC ELECTRIC ELEMENTS

Thermal treatments

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Self-aligned interconnect structures and methods of fabrication

Method of manufacturing an electronic device

Display device and method of manufacturing the same

Semiconductor die, a semiconductor die stack, and a semiconductor m...

Display panel and preparation method thereof

Display device and method of providing the same

Low warpage curing methodology by inducing curvature

Bonding process with inhibited oxide formation

Process and device for low-temperature pressure sintering

Process and device for low-temperature pressure sintering

Power module comprising two substrates and method of manufacturing...

Bonding process with inhibited oxide formation

Jointing material, fabrication method for semiconductor device usin...

Die-attach method to compensate for thermal expansion

Method of fabricating high-power module

Chip bonding method and bonding device

Semiconductor device and method for manufacturing the same

Bonding process with inhibited oxide formation

Thermal interface material on package

Systems and methods for improved delamination characteristics in a...

Wafer-level packaging methods using a photolithographic bonding mat...

Power semiconductor device and method for manufacturing power semic...

Compliant layer for wafer to wafer bonding

Conductive paste for bonding

Electronic-component mounting apparatus

Bonding process with inhibited oxide formation

Bonding method of fixing an object to a rough surface

Method for manufacturing semiconductor apparatus, method for manufa...

Micro-pillar assisted semiconductor bonding

Electronic sub-assembly and method for the production of an electro...

Patents Applicationslast 30 patents

Heat-Electricity Discrete Power Module Including Two-Way Heat-Dissi...

HYBRID STACKING OF SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSE...

METHOD OF SURFACE MODIFICATION FOR WAFER BONDING

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

FLIP-CHIP MOUNTING STRUCTURE AND FLIP-CHIP MOUNTING METHOD

SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...

SELF-DENSIFYING NANO-SILVER PASTE AND A METHOD OF FORMING INTERCONN...

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...

DISPLAY DEVICE AND METHOD OF PROVIDING THE SAME

DISPLAY PANEL AND PREPARATION METHOD THEREOF

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

CHIP BONDING METHOD AND BONDING DEVICE

PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING

METHOD FOR BONDING SUBSTRATE, TRANSPARENT SUBSTRATE LAMINATE, AND D...

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE

DIE BONDING APPARATUS AND DIE BONDING METHOD

Method of Fabricating High-Power Module

WAFER-LEVEL PACKAGING METHODS USING A PHOTOLITHOGRAPHIC BONDING MAT...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

BONDING METHOD OF FIXING AN OBJECT TO A ROUGH SURFACE

DIE BONDING TO A BOARD

THERMAL INTERFACE MATERIAL ON PACKAGE

Conductive Paste For Bonding

THERMAL INTERFACE MATERIAL ON PACKAGE

DIE BONDING APPARATUS AND DIE BONDING METHOD

BONDING STRUCTURE AND METHOD

ELECTRONIC-COMPONENT MOUNTING APPARATUS AND ELECTRONIC-COMPONENT MO...

METHOD OF BONDING SEMICONDUCTOR SUBSTRATES

METHOD FOR PERFORMING DIRECT BONDING BETWEEN TWO STRUCTURES