Thermal treatments

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H01L2224/11848

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/11848Thermal treatments

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of forming brass-coated metals in flip-chip redistribution l...
- Patent number 11,984,418
- Issue date May 14, 2024
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,456,264
- Issue date Sep 27, 2022
- Renesas Electronics Corporation
- Yoshiaki Sato
- G11 - INFORMATION STORAGE
Information Patent Grant
Brass-coated metals in flip-chip redistribution layers
- Patent number 11,410,947
- Issue date Aug 9, 2022
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Low temperature hybrid bonding structures and manufacturing method...
- Patent number 11,205,635
- Issue date Dec 21, 2021
- Shun-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bonding pads for packaging applications
- Patent number 10,825,792
- Issue date Nov 3, 2020
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Expanded head pillar for bump bonds
- Patent number 10,636,758
- Issue date Apr 28, 2020
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,483,240
- Issue date Nov 19, 2019
- Tohoku University
- Mitsumasa Koyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper structures with intermetallic coating for integrated circuit...
- Patent number 10,461,052
- Issue date Oct 29, 2019
- Monolithic Power Systems, Inc.
- Hunt Hang Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor package interposer with die cavity
- Patent number 10,446,520
- Issue date Oct 15, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bonding pads for packaging applications
- Patent number 10,381,323
- Issue date Aug 13, 2019
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method for producing bonding structure
- Patent number 10,332,853
- Issue date Jun 25, 2019
- Osaka University
- Katsuaki Suganuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,177,118
- Issue date Jan 8, 2019
- Tohoku University
- Mitsumasa Koyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump stretching method
- Patent number 10,163,835
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Chun Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal bump structure for use in driver IC and method for forming th...
- Patent number 10,128,348
- Issue date Nov 13, 2018
- Himax Technologies Limited
- Chiu-Shun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 10,090,231
- Issue date Oct 2, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing alloy bump
- Patent number 10,062,657
- Issue date Aug 28, 2018
- Ishihara Chemical Co., Ltd.
- Shoya Iuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for interconnect simulation and characterization
- Patent number 10,043,720
- Issue date Aug 7, 2018
- Arizona Board of Regents
- Blake Rogers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structure and methods for forming the same
- Patent number 9,985,013
- Issue date May 29, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid low metal loading flux
- Patent number 9,950,393
- Issue date Apr 24, 2018
- Intel Corporation
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bump stretching method and device for performing the same
- Patent number 9,842,817
- Issue date Dec 12, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Chun Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 9,793,198
- Issue date Oct 17, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D semiconductor package interposer with die cavity
- Patent number 9,780,072
- Issue date Oct 3, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper structures with intermetallic coating for integrated circuit...
- Patent number 9,754,909
- Issue date Sep 5, 2017
- Monolithic Power Systems, Inc.
- Hunt Hang Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and manufacturing method
- Patent number 9,735,123
- Issue date Aug 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Guo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a cylindrical shaped conductive portion
- Patent number 9,576,925
- Issue date Feb 21, 2017
- Kabushiki Kaisha Toshiba
- Nobuto Managaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump forming method and apparatus
- Patent number 9,511,438
- Issue date Dec 6, 2016
- Senju Metal Industry Co., Ltd.
- Issaku Sato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal bump structure for use in driver IC and method for forming th...
- Patent number 9,450,061
- Issue date Sep 20, 2016
- Himax Technologies Limited
- Chiu-Shun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor package interposer with die cavity
- Patent number 9,385,095
- Issue date Jul 5, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,379,076
- Issue date Jun 28, 2016
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Chih Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240113066
- Publication date Apr 4, 2024
- Sony Semiconductor Solutions Corporation
- Takashi IMAHIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER PASTE, METHOD FOR FORMING SOLDER BUMPS, AND METHOD FOR PRODU...
- Publication number 20240105653
- Publication date Mar 28, 2024
- Resonac Corporation
- Yoshinori EJIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240038706
- Publication date Feb 1, 2024
- Sony Semiconductor Solutions Corporation
- Takashi IMAHIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-PITCH JOINING PAD STRUCTURE
- Publication number 20230317652
- Publication date Oct 5, 2023
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THE SAME,...
- Publication number 20230178506
- Publication date Jun 8, 2023
- Mitsubishi Electric Corporation
- Tatsushi MORISADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRASS-COATED METALS IN FLIP-CHIP REDISTRIBUTION LAYERS
- Publication number 20220384375
- Publication date Dec 1, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE HYBRID BONDING STRUCTURES AND MANUFACTURING METHOD...
- Publication number 20210242166
- Publication date Aug 5, 2021
- SHUN-PING HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRASS-COATED METALS IN FLIP-CHIP REDISTRIBUTION LAYERS
- Publication number 20210193600
- Publication date Jun 24, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ELECTROPLATED COPPER STRUCTURES
- Publication number 20200286844
- Publication date Sep 10, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Keith Edward Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDED HEAD PILLAR FOR BUMP BONDS
- Publication number 20200258856
- Publication date Aug 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING BUMP STRUCTURES AND SEMICONDUCTOR PACKA...
- Publication number 20200075524
- Publication date Mar 5, 2020
- Samsung Electronics Co., Ltd.
- Ju Bin SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BONDING PADS FOR PACKAGING APPLICATIONS
- Publication number 20190304948
- Publication date Oct 3, 2019
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID LOW METAL LOADING FLUX
- Publication number 20180236609
- Publication date Aug 23, 2018
- Intel Corporation
- Rajen S. SIDHU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180226382
- Publication date Aug 9, 2018
- TOHOKU UNIVERSITY
- Mitsumasa KOYANAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP STRETCHING METHOD
- Publication number 20180108632
- Publication date Apr 19, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Chun YANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
3D Semiconductor Package Interposer with Die Cavity
- Publication number 20180026008
- Publication date Jan 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...
- Publication number 20180019191
- Publication date Jan 18, 2018
- Invensas Corporation
- Cyprian Emeka UZOH
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR MANUFACTURING ALLOY BUMP
- Publication number 20170330850
- Publication date Nov 16, 2017
- Ishihara Chemical Co., Ltd.
- Shoya IUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER STRUCTURES WITH INTERMETALLIC COATING FOR INTEGRATED CIRCUIT...
- Publication number 20170330853
- Publication date Nov 16, 2017
- Monolithic Power Systems, Inc.
- Hunt Hang Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170200703
- Publication date Jul 13, 2017
- TOHOKU UNIVERSITY
- Mitsumasa KOYANAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD FOR PRODUCING BONDING STRUCTURE
- Publication number 20170170137
- Publication date Jun 15, 2017
- OSAKA UNIVERSITY
- Katsuaki SUGANUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR INTERCONNECT SIMULATION AND CHARACTERIZATION
- Publication number 20170162454
- Publication date Jun 8, 2017
- Blake Rogers
- G01 - MEASURING TESTING
Information Patent Application
COPPER STRUCTURES WITH INTERMETALLIC COATING FOR INTEGRATED CIRCUIT...
- Publication number 20160351520
- Publication date Dec 1, 2016
- Monolithic Power Systems, Inc.
- Hunt Hang Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE DEVICE AND CAVITY FORMATION BY SOLDER REMOVAL FO...
- Publication number 20160351522
- Publication date Dec 1, 2016
- FREESCALE SEMICONDUCTOR, INC.
- MICHAEL B. VINCENT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLUTIONS AND PROCESSES FOR REMOVING SUBSTANCES FROM SUBSTRATES
- Publication number 20160215240
- Publication date Jul 28, 2016
- DYNALOY, LLC
- Travis Acra
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20160218076
- Publication date Jul 28, 2016
- KABUSHIKI KAISHA TOSHIBA
- Nobuto MANAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL APPARATUS AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160133595
- Publication date May 12, 2016
- FUJITSU LIMITED
- Taiki Uemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20160099223
- Publication date Apr 7, 2016
- Taiwan Semiconductor Manufacturing company Ltd.
- CHEN-CHIH HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Structure and Methods for Forming the Same
- Publication number 20160013175
- Publication date Jan 14, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR APPA...
- Publication number 20150303167
- Publication date Oct 22, 2015
- SONY CORPORATION
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS

Thermal treatments

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming brass-coated metals in flip-chip redistribution l...

Method of manufacturing semiconductor device

Brass-coated metals in flip-chip redistribution layers

Sintering materials and attachment methods using same

Low temperature hybrid bonding structures and manufacturing method...

Metal bonding pads for packaging applications

Expanded head pillar for bump bonds

Semiconductor device and method for manufacturing the same

Copper structures with intermetallic coating for integrated circuit...

3D semiconductor package interposer with die cavity

Metal bonding pads for packaging applications

Bonding structure and method for producing bonding structure

Semiconductor device and method for manufacturing the same

Solder bump stretching method

Metal bump structure for use in driver IC and method for forming th...

Conductive connections, structures with such connections, and metho...

Method for manufacturing alloy bump

Systems and methods for interconnect simulation and characterization

Package-on-package structure and methods for forming the same

Hybrid low metal loading flux

Solder bump stretching method and device for performing the same

Conductive connections, structures with such connections, and metho...

3D semiconductor package interposer with die cavity

Copper structures with intermetallic coating for integrated circuit...

Semiconductor device structure and manufacturing method

Semiconductor device having a cylindrical shaped conductive portion

Solder bump forming method and apparatus

Metal bump structure for use in driver IC and method for forming th...

3D semiconductor package interposer with die cavity

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

SOLDER PASTE, METHOD FOR FORMING SOLDER BUMPS, AND METHOD FOR PRODU...

ELECTRONIC DEVICE

FINE-PITCH JOINING PAD STRUCTURE

POWER SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THE SAME,...

BRASS-COATED METALS IN FLIP-CHIP REDISTRIBUTION LAYERS

LOW TEMPERATURE HYBRID BONDING STRUCTURES AND MANUFACTURING METHOD...

BRASS-COATED METALS IN FLIP-CHIP REDISTRIBUTION LAYERS

SEMICONDUCTOR DEVICE WITH ELECTROPLATED COPPER STRUCTURES

EXPANDED HEAD PILLAR FOR BUMP BONDS

SEMICONDUCTOR DEVICE HAVING BUMP STRUCTURES AND SEMICONDUCTOR PACKA...

METAL BONDING PADS FOR PACKAGING APPLICATIONS

HYBRID LOW METAL LOADING FLUX

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SOLDER BUMP STRETCHING METHOD

3D Semiconductor Package Interposer with Die Cavity

CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...

METHOD FOR MANUFACTURING ALLOY BUMP

COPPER STRUCTURES WITH INTERMETALLIC COATING FOR INTEGRATED CIRCUIT...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

BONDING STRUCTURE AND METHOD FOR PRODUCING BONDING STRUCTURE

SYSTEMS AND METHODS FOR INTERCONNECT SIMULATION AND CHARACTERIZATION

COPPER STRUCTURES WITH INTERMETALLIC COATING FOR INTEGRATED CIRCUIT...

PACKAGE-ON-PACKAGE DEVICE AND CAVITY FORMATION BY SOLDER REMOVAL FO...

SOLUTIONS AND PROCESSES FOR REMOVING SUBSTANCES FROM SUBSTRATES

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

ELECTRICAL APPARATUS AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Package-on-Package Structure and Methods for Forming the Same

SEMICONDUCTOR APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR APPA...