Thermocompression bonding

Industry

CPC
H01L2224/84203

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/84203Thermocompression bonding

Industries

Patents Grantslast 30 patents

Information Patent Grant
Chip packaging device, chip packaging method, and package chip
- Patent number 11,764,184
- Issue date Sep 19, 2023
- HOSIN GLOBAL ELECTRONICS CO., LTD
- Chen-Nan Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for die and clip attachment
- Patent number 11,289,447
- Issue date Mar 29, 2022
- Alpha Assembly Solutions, Inc.
- Oscar Khaselev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid top terminal for discrete power devices
- Patent number 10,872,846
- Issue date Dec 22, 2020
- RENESAS ELECTRONICS AMERICA INC.
- Jean Claude Harel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with vertical interconnect between carrier and clip
- Patent number 10,707,158
- Issue date Jul 7, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with adhesive material pre-printed on the lea...
- Patent number 9,653,424
- Issue date May 16, 2017
- Alpha and Omega Semiconductor Incorporated
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method of manufacturing electronic component
- Patent number 9,627,342
- Issue date Apr 18, 2017
- Fuji Electric Co., Ltd.
- Takashi Saito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor package and method for fabricating the same
- Patent number 8,952,551
- Issue date Feb 10, 2015
- International Business Machines Corporation
- Takashi Hisada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-spring chip attachment using ribbon bonds
- Patent number 8,614,514
- Issue date Dec 24, 2013
- Palo Alto Research Center Incorporated
- Vernon Powers
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for Die and Clip Attachment
- Publication number 20180166415
- Publication date Jun 14, 2018
- Alpha Assembly Solutions Inc.
- Oscar Khaselev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20140001636
- Publication date Jan 2, 2014
- Fuji Electric Co., Ltd.
- Takashi SAITO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METAL BONDING APPARATUS
- Publication number 20130284794
- Publication date Oct 31, 2013
- Sanyo Electric Co., Ltd.
- Takashi SUZUKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Package and Method for Fabricating the Same
- Publication number 20120187562
- Publication date Jul 26, 2012
- International Business Machines Corporation
- Takashi Hisada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20120068258
- Publication date Mar 22, 2012
- Kabushiki Kaisha Toshiba
- Syotaro Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method for Fabricating the Same
- Publication number 20080237856
- Publication date Oct 2, 2008
- International Business Machines Corporation
- Takashi Hisada
- H01 - BASIC ELECTRIC ELEMENTS

Thermocompression bonding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip packaging device, chip packaging method, and package chip

Method for die and clip attachment

Solid top terminal for discrete power devices

Package with vertical interconnect between carrier and clip

Semiconductor package with adhesive material pre-printed on the lea...

Electronic component and method of manufacturing electronic component

Semiconductor package and method for fabricating the same

Micro-spring chip attachment using ribbon bonds

Patents Applicationslast 30 patents

Method for Die and Clip Attachment

ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT

METAL BONDING APPARATUS

Semiconductor Package and Method for Fabricating the Same

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Semiconductor Package and Method for Fabricating the Same