Thermosonic bonding

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H01L2224/80207

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/80207Thermosonic bonding

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Patents Grantslast 30 patents

Information Patent Grant
Thermosonically bonded connection for flip chip packages
- Patent number 10,741,415
- Issue date Aug 11, 2020
- STMicroelectronics S.r.l.
- Mauro Mazzola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for providing void-free layers for semiconductor assemblies
- Patent number 6,780,747
- Issue date Aug 24, 2004
- Tessera, Inc.
- Thomas H. Distefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for providing void-free layers for semiconductor assemblies
- Patent number 6,653,172
- Issue date Nov 25, 2003
- Tessera, Inc.
- Thomas H. Distefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for providing void free layer for semiconductor assemblies
- Patent number 6,458,681
- Issue date Oct 1, 2002
- Tessera, Inc.
- Thomas H. Distefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for providing void-free layers for semiconductor assemblies
- Patent number 6,107,123
- Issue date Aug 22, 2000
- Tessera, Inc.
- Thomas H. Distefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for providing void-free layers for semiconductor assemblies
- Patent number 5,834,339
- Issue date Nov 10, 1998
- Tessera, Inc.
- Thomas H. Distefano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Methods for providing void-free layers for semiconductor assemblies
- Publication number 20030027373
- Publication date Feb 6, 2003
- Tessera, Inc.
- Thomas H. DiStefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for providing void-free layers for semiconductor assemblies
- Publication number 20020094671
- Publication date Jul 18, 2002
- Thomas H. Distefano
- H01 - BASIC ELECTRIC ELEMENTS