Thermosonic bonding

Industry

CPC
H01L2224/81207

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81207Thermosonic bonding

Industries

Patents Grantslast 30 patents

Information Patent Grant
Interconnect structure for semiconductor with ultra-fine pitch and...
- Patent number 11,742,316
- Issue date Aug 29, 2023
- GUANGDONG UNIVERSITY OF TECHNOLOGY
- Yu Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulation resin composition, laminated sheet, cured product, se...
- Patent number 11,674,032
- Issue date Jun 13, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shigeru Yamatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display device
- Patent number 11,552,155
- Issue date Jan 10, 2023
- Samsung Display Co., Ltd.
- Chan-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic-assisted solder transfer
- Patent number 11,541,472
- Issue date Jan 3, 2023
- International Business Machines Corporation
- Jae-Woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic packages with high integration microelectronic dice...
- Patent number 11,527,507
- Issue date Dec 13, 2022
- Intel Corporation
- Richard Patten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrates having embedded dielectric magnetic material...
- Patent number 11,189,409
- Issue date Nov 30, 2021
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate with integrated inductive component
- Patent number 11,133,375
- Issue date Sep 28, 2021
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages with high integration microelectronic dice...
- Patent number 10,872,881
- Issue date Dec 22, 2020
- Intel IP Corporation
- Richard Patten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting Method of a semiconductor device using a colored auxiliary...
- Patent number 10,786,876
- Issue date Sep 29, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Teppei Kojio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vibration device, electronic apparatus, and vehicle
- Patent number 10,784,835
- Issue date Sep 22, 2020
- Seiko Epson Corporation
- Ryuta Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin substrate, component-mounting resin substrate, and method of...
- Patent number 10,741,462
- Issue date Aug 11, 2020
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with back-side integrated inductive component
- Patent number 10,692,964
- Issue date Jun 23, 2020
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages with high integration microelectronic dice...
- Patent number 10,622,333
- Issue date Apr 14, 2020
- Intel IP Corporation
- Richard Patten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assembly with electromagnetic shielding and thermally...
- Patent number 10,354,984
- Issue date Jul 16, 2019
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 10,312,216
- Issue date Jun 4, 2019
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 10,297,568
- Issue date May 21, 2019
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluxing systems, bonding machines including fluxing systems, and me...
- Patent number 10,245,668
- Issue date Apr 2, 2019
- Kulicke and Soffa Industries, Inc.
- Daniel P. Buergi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect substrate having cavity for stackable semiconductor as...
- Patent number 10,199,321
- Issue date Feb 5, 2019
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assembly having anti-warping controller and vertical...
- Patent number 10,177,130
- Issue date Jan 8, 2019
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for producing an electronic device
- Patent number 10,147,696
- Issue date Dec 4, 2018
- Osram Opto Semiconductors GmbH
- Andreas Ploessl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced semiconductor assembly with three dimensional in...
- Patent number 10,134,711
- Issue date Nov 20, 2018
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced face-to-face semiconductor assembly with built-i...
- Patent number 10,121,768
- Issue date Nov 6, 2018
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assembly with built-in stiffener and integrated dual...
- Patent number 10,062,663
- Issue date Aug 28, 2018
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and corresponding method
- Patent number 10,049,966
- Issue date Aug 14, 2018
- STMicroelectronics S.r.l.
- Alberto Arrigoni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 9,905,530
- Issue date Feb 27, 2018
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mounted piezoelectric vibrator
- Patent number 9,831,414
- Issue date Nov 28, 2017
- DAISHINKU CORPORATION
- Takuya Kojo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Organic thin film passivation of metal interconnections
- Patent number 9,824,991
- Issue date Nov 21, 2017
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect substrate having cavity for stackable semiconductor as...
- Patent number 9,825,009
- Issue date Nov 21, 2017
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device mounting method
- Patent number 9,793,221
- Issue date Oct 17, 2017
- Fujitsu Limited
- Hidehiko Kira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to form high density through-mold interconnections
- Patent number 9,741,692
- Issue date Aug 22, 2017
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH LEAD-ON-CHIP INTERCONNECT AND METHOD THER...
- Publication number 20240014123
- Publication date Jan 11, 2024
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEMS FOR BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES...
- Publication number 20230133526
- Publication date May 4, 2023
- KULICKE AND SOFFA INDUSTRIES, INC.
- Thomas J. Colosimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD USING THE SAME
- Publication number 20230057934
- Publication date Feb 23, 2023
- SAMSUNG DISPLAY CO., LTD.
- SANGDUK LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR SEMICONDUCTOR WITH ULTRA-FINE PITCH AND...
- Publication number 20220415846
- Publication date Dec 29, 2022
- Guangdong University of Technology
- Yu ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MODULE WITH HEAT DISSIPATION DEVICE AND MANUFACTURING METHOD T...
- Publication number 20220336314
- Publication date Oct 20, 2022
- SMArim Global Corp.
- TIEN-LAI WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC-ASSISTED SOLDER TRANSFER
- Publication number 20210229203
- Publication date Jul 29, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING DISPLAY DEVICE
- Publication number 20210151543
- Publication date May 20, 2021
- SAMSUNG DISPLAY CO., LTD.
- Chan-Jae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210082856
- Publication date Mar 18, 2021
- Kioxia Corporation
- Soichi HOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES WITH HIGH INTEGRATION MICROELECTRONIC DICE...
- Publication number 20210035950
- Publication date Feb 4, 2021
- Intel IP Corporation
- Richard PATTEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATION RESIN COMPOSITION, LAMINATED SHEET, CURED PRODUCT, SE...
- Publication number 20200377715
- Publication date Dec 3, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- Shigeru YAMATSU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MICROELECTRONIC PACKAGES WITH HIGH INTEGRATION MICROELECTRONIC DICE...
- Publication number 20200219844
- Publication date Jul 9, 2020
- Intel IP Corporation
- Richard PATTEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3-D STACKING SEMICONDUCTOR ASSEMBLY HAVING HEAT DISSIPATION CHARACT...
- Publication number 20200091116
- Publication date Mar 19, 2020
- BRIDGE SEMICONDUCTOR CORP.
- Charles W. C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHO...
- Publication number 20180374827
- Publication date Dec 27, 2018
- Bridge Semiconductor Corporation
- Charles W.C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUXILIARY JOINING AGENT AND METHOD FOR PRODUCING THE SAME
- Publication number 20180236613
- Publication date Aug 23, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- Teppei Kojio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20180182733
- Publication date Jun 28, 2018
- KULICKE AND SOFFA INDUSTRIES, INC.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20180026006
- Publication date Jan 25, 2018
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD
- Publication number 20170309548
- Publication date Oct 26, 2017
- STMicroelectronics S.r.l.
- Alberto Arrigoni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20170179072
- Publication date Jun 22, 2017
- KULICKE AND SOFFA INDUSTRIES, INC.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC THIN FILM PASSIVATION OF METAL INTERCONNECTIONS
- Publication number 20170141061
- Publication date May 18, 2017
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL IN...
- Publication number 20170133352
- Publication date May 11, 2017
- Bridge Semiconductor Corporation
- Charles W.C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHO...
- Publication number 20170133353
- Publication date May 11, 2017
- Bridge Semiconductor Corporation
- Charles W.C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE PACKAGE WITH IMPROVED INTERCONNECT BAN...
- Publication number 20160329272
- Publication date Nov 10, 2016
- Intel IP Corporation
- Christian GEISSLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20150348951
- Publication date Dec 3, 2015
- KULICKE AND SOFFA INDUSTRIES, INC.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND METHOD OF FABRICATING THE SAME
- Publication number 20140339695
- Publication date Nov 20, 2014
- Taiyo Yuden Co., Ltd.
- Motoi YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...
- Publication number 20140295619
- Publication date Oct 2, 2014
- Tanaka Kikinzoku Kogyo K.K.
- TOSHINORI OGASHIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH EMBEDDED CHIP AND IN...
- Publication number 20140175633
- Publication date Jun 26, 2014
- Bridge Semiconductor Corporation
- Charles W.C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC THIN FILM PASSIVATION OF METAL INTERCONNECTIONS
- Publication number 20140138818
- Publication date May 22, 2014
- Alexsandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH THERMALLY AND ELECTRICALLY CONDUCTIVE...
- Publication number 20140131900
- Publication date May 15, 2014
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20130183799
- Publication date Jul 18, 2013
- Elpida Memory, Inc.
- Jun SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES AND METHODS OF MAKING THE SAME
- Publication number 20130107485
- Publication date May 2, 2013
- Georgia Tech Research Corporation
- Pulugurtha Markondeya Raj
- H01 - BASIC ELECTRIC ELEMENTS

Thermosonic bonding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interconnect structure for semiconductor with ultra-fine pitch and...

Encapsulation resin composition, laminated sheet, cured product, se...

Method for manufacturing display device

Ultrasonic-assisted solder transfer

Microelectronic packages with high integration microelectronic dice...

Electronic substrates having embedded dielectric magnetic material...

Semiconductor substrate with integrated inductive component

Microelectronic packages with high integration microelectronic dice...

Mounting Method of a semiconductor device using a colored auxiliary...

Vibration device, electronic apparatus, and vehicle

Resin substrate, component-mounting resin substrate, and method of...

Semiconductor die with back-side integrated inductive component

Microelectronic packages with high integration microelectronic dice...

Semiconductor assembly with electromagnetic shielding and thermally...

Systems and methods for bonding semiconductor elements

Systems and methods for bonding semiconductor elements

Fluxing systems, bonding machines including fluxing systems, and me...

Interconnect substrate having cavity for stackable semiconductor as...

Semiconductor assembly having anti-warping controller and vertical...

Electronic device and method for producing an electronic device

Thermally enhanced semiconductor assembly with three dimensional in...

Thermally enhanced face-to-face semiconductor assembly with built-i...

Semiconductor assembly with built-in stiffener and integrated dual...

Semiconductor device and corresponding method

Systems and methods for bonding semiconductor elements

Surface mounted piezoelectric vibrator

Organic thin film passivation of metal interconnections

Interconnect substrate having cavity for stackable semiconductor as...

Semiconductor device mounting method

Methods to form high density through-mold interconnections

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH LEAD-ON-CHIP INTERCONNECT AND METHOD THER...

BONDING SYSTEMS FOR BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES...

BONDING APPARATUS AND BONDING METHOD USING THE SAME

INTERCONNECT STRUCTURE FOR SEMICONDUCTOR WITH ULTRA-FINE PITCH AND...

CHIP MODULE WITH HEAT DISSIPATION DEVICE AND MANUFACTURING METHOD T...

ULTRASONIC-ASSISTED SOLDER TRANSFER

METHOD FOR MANUFACTURING DISPLAY DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MICROELECTRONIC PACKAGES WITH HIGH INTEGRATION MICROELECTRONIC DICE...

ENCAPSULATION RESIN COMPOSITION, LAMINATED SHEET, CURED PRODUCT, SE...

MICROELECTRONIC PACKAGES WITH HIGH INTEGRATION MICROELECTRONIC DICE...

3-D STACKING SEMICONDUCTOR ASSEMBLY HAVING HEAT DISSIPATION CHARACT...

SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHO...

AUXILIARY JOINING AGENT AND METHOD FOR PRODUCING THE SAME

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

ORGANIC THIN FILM PASSIVATION OF METAL INTERCONNECTIONS

THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL IN...

SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHO...

STACKED SEMICONDUCTOR DEVICE PACKAGE WITH IMPROVED INTERCONNECT BAN...

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

ELECTRONIC COMPONENT AND METHOD OF FABRICATING THE SAME

BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...

THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH EMBEDDED CHIP AND IN...

ORGANIC THIN FILM PASSIVATION OF METAL INTERCONNECTIONS

MICROELECTRONIC ASSEMBLY WITH THERMALLY AND ELECTRICALLY CONDUCTIVE...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

INTERCONNECT STRUCTURES AND METHODS OF MAKING THE SAME