Thin films associated with contacts of capacitors

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CPC
H01L21/7687

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/7687Thin films associated with contacts of capacitors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 12,283,523
- Issue date Apr 22, 2025
- Semiconductor Manufacturing International (Shanghai) Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 12,283,545
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method
- Patent number 12,283,479
- Issue date Apr 22, 2025
- ASM IP Holding B.V.
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
String driver assemblies including two-dimensional materials, and r...
- Patent number 12,284,805
- Issue date Apr 22, 2025
- Lodestar Licensing Group LLC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with multi-carbon-concentration dielectrics
- Patent number 12,278,183
- Issue date Apr 15, 2025
- NANYA TECHNOLOGY CORPORATION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array
- Patent number 12,278,180
- Issue date Apr 15, 2025
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin diffusion barrier
- Patent number 12,278,186
- Issue date Apr 15, 2025
- Purdue Research Foundation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 12,278,139
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 12,278,177
- Issue date Apr 15, 2025
- SK keyfoundry Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure having air gap and method for manufacturi...
- Patent number 12,272,636
- Issue date Apr 8, 2025
- NANYA TECHNOLOGY CORPORATION
- Tsu-Chieh Ai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reflectance isolation structure to increase image sensor perfo...
- Patent number 12,272,715
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Chan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cell with top electrode via
- Patent number 12,274,183
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Che Ku
- G11 - INFORMATION STORAGE
Information Patent Grant
Conductive feature of a semiconductor device
- Patent number 12,272,598
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- U-Ting Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 12,272,646
- Issue date Apr 8, 2025
- United Microelectronics Corp.
- Feng-Yi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 12,272,596
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Junghyuck Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition and method for fabrication of nickel interconnects
- Patent number 12,270,121
- Issue date Apr 8, 2025
- MacDermid Enthone Inc.
- Eric Yakobson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device with identification structure, method for manu...
- Patent number 12,272,643
- Issue date Apr 8, 2025
- AP Memory Technology Corporation
- Wenliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective metal removal with flowable polymer
- Patent number 12,272,551
- Issue date Apr 8, 2025
- Applied Materials, Inc.
- Liqi Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Removing polymer through treatment
- Patent number 12,272,595
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques to inhibit delamination from flowable gap-fill dielectric
- Patent number 12,266,604
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of manufacture
- Patent number 12,266,576
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device having at least one via incl...
- Patent number 12,266,593
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect wires including relatively low resistivity cores
- Patent number 12,266,568
- Issue date Apr 1, 2025
- Intel Corporation
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 12,266,539
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ru-Gun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with source/drain contact formed using bottom-...
- Patent number 12,266,688
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enlarging contact area and process window for a contact via
- Patent number 12,266,563
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,266,564
- Issue date Apr 1, 2025
- NANYA TECHNOLOGY CORPORATION
- Chiang-Lin Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned contacts
- Patent number 12,266,571
- Issue date Apr 1, 2025
- Intel Corporation
- Mark T. Bohr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via interconnects with line wiggling prevention
- Patent number 12,266,605
- Issue date Apr 1, 2025
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom barrier free interconnects without voids
- Patent number 12,266,607
- Issue date Apr 1, 2025
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURES WITH BACKSIDE POWER DELIVERY NETWORK
- Publication number 20250132246
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi Ling Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING SUPPORT STRUCTURES
- Publication number 20250132267
- Publication date Apr 24, 2025
- Micron Technology, Inc.
- Andrew Zhe Wei Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECTION STRUCTURES FOR PREVENTING FIXED POSITIVE...
- Publication number 20250132250
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zi-Ang Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL LINES LOCATED BETWEEN ETCH STOP LAYERS AND SEPARATED BY AIR G...
- Publication number 20250132301
- Publication date Apr 24, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Fumitaka AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250132198
- Publication date Apr 24, 2025
- Samsung Electronics Co., LTD
- Yunho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE
- Publication number 20250132247
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Lin TENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH LINER LAYER HAVING TAPERED SIDE...
- Publication number 20250132194
- Publication date Apr 24, 2025
- NANYA TECHNOLOGY CORPORATION
- JAR-MING HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD TO IMPROVE FAV RIE PROCESS MARGIN AND ELECTROM...
- Publication number 20250132199
- Publication date Apr 24, 2025
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NUCLEATION-FREE DEPOSITION
- Publication number 20250132201
- Publication date Apr 24, 2025
- LAM RESEARCH CORPORATION
- Sema ERMEZ
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132202
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Seokkyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HARDMASK INTEGRATION FOR HIGH ASPECT RATIO APPLICATIONS
- Publication number 20250132159
- Publication date Apr 24, 2025
- TOKYO ELECTRON LIMITED
- Joshua Baillargeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH LINER LAYER HAVING TAPERED SIDE...
- Publication number 20250132193
- Publication date Apr 24, 2025
- NANYA TECHNOLOGY CORPORATION
- JAR-MING HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE WITH POWER CONNECT...
- Publication number 20250132229
- Publication date Apr 24, 2025
- TZU-WEI CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICON...
- Publication number 20250132266
- Publication date Apr 24, 2025
- Universal Global Technology(Shanghai)Co.,Ltd.
- Yao LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED VIA FORMATION USING SPACERS
- Publication number 20250132204
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250133755
- Publication date Apr 24, 2025
- United Microelectronics Corp.
- Shin-Hung LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250133800
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hwei-Jay CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OLIGOMER FILM FOR BOTTOM-UP GAP FILL PROCESSES
- Publication number 20250125195
- Publication date Apr 17, 2025
- Applied Materials, Inc.
- Feng Q. Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED VIAS WITH BOTTOM PORTIONS FORMED USING SELECTIVE GROWTH
- Publication number 20250125255
- Publication date Apr 17, 2025
- Intel Corporation
- Andy Chih-Hung Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrolyte and Deposition of a Copper Barrier Layer in a Damascene...
- Publication number 20250125151
- Publication date Apr 17, 2025
- Louis Caillard
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250126780
- Publication date Apr 17, 2025
- WINBOND ELECTRONICS CORP.
- Pin-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINE-VIA-LINE STRUCTURE FOR BSPDN
- Publication number 20250125250
- Publication date Apr 17, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL SOURCE OR DRAIN STRUCTURES FOR ADVANCED INTEGRATED CIRCUI...
- Publication number 20250126869
- Publication date Apr 17, 2025
- Intel Corporation
- Subhash JOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH REINFORCING SPACER AND METHOD FOR MANUF...
- Publication number 20250125189
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hao LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED TOPVIA AND METAL LINE WITH INCREASED HEIGHT
- Publication number 20250125193
- Publication date Apr 17, 2025
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TWO-DIMENSIONAL MENTAL LINE PATTERNING
- Publication number 20250125148
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDING A METAL-INSULATOR-METAL CAPACITOR IN A PASSIVATION LAYER
- Publication number 20250118654
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUT SHAPES FOR BACKSIDE METALS
- Publication number 20250118661
- Publication date Apr 10, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR SEMICONDUCTOR DIE COUPLING IN STACKED MEMORY ARCHITE...
- Publication number 20250118693
- Publication date Apr 10, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SHARED BARRIER LAYER IN REDISTRIBUTION A...
- Publication number 20250118711
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

Thin films associated with contacts of capacitors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and fabrication method thereof

Package structure and method of manufacturing the same

Substrate processing method

String driver assemblies including two-dimensional materials, and r...

Semiconductor device with multi-carbon-concentration dielectrics

Memory arrays and methods used in forming a memory array

Ultra-thin diffusion barrier

Manufacturing method of semiconductor device

Semiconductor device manufacturing method

Interconnection structure having air gap and method for manufacturi...

High reflectance isolation structure to increase image sensor perfo...

Memory cell with top electrode via

Conductive feature of a semiconductor device

Semiconductor memory device

Method of manufacturing semiconductor devices

Composition and method for fabrication of nickel interconnects

Semiconductor device with identification structure, method for manu...

Selective metal removal with flowable polymer

Removing polymer through treatment

Techniques to inhibit delamination from flowable gap-fill dielectric

Semiconductor device and methods of manufacture

Method of forming semiconductor device having at least one via incl...

Interconnect wires including relatively low resistivity cores

Method of manufacturing semiconductor devices

Semiconductor device with source/drain contact formed using bottom-...

Enlarging contact area and process window for a contact via

Semiconductor device

Self-aligned contacts

Top via interconnects with line wiggling prevention

Bottom barrier free interconnects without voids

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURES WITH BACKSIDE POWER DELIVERY NETWORK

MEMORY DEVICE INCLUDING SUPPORT STRUCTURES

ELECTRICAL INTERCONNECTION STRUCTURES FOR PREVENTING FIXED POSITIVE...

METAL LINES LOCATED BETWEEN ETCH STOP LAYERS AND SEPARATED BY AIR G...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

INTERCONNECTION STRUCTURE

SEMICONDUCTOR DEVICE STRUCTURE WITH LINER LAYER HAVING TAPERED SIDE...

STRUCTURE AND METHOD TO IMPROVE FAV RIE PROCESS MARGIN AND ELECTROM...

NUCLEATION-FREE DEPOSITION

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

HARDMASK INTEGRATION FOR HIGH ASPECT RATIO APPLICATIONS

SEMICONDUCTOR DEVICE STRUCTURE WITH LINER LAYER HAVING TAPERED SIDE...

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE WITH POWER CONNECT...

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICON...

SELF-ALIGNED VIA FORMATION USING SPACERS

CAPACITOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

OLIGOMER FILM FOR BOTTOM-UP GAP FILL PROCESSES

STACKED VIAS WITH BOTTOM PORTIONS FORMED USING SELECTIVE GROWTH

Electrolyte and Deposition of a Copper Barrier Layer in a Damascene...

MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME

LINE-VIA-LINE STRUCTURE FOR BSPDN

EPITAXIAL SOURCE OR DRAIN STRUCTURES FOR ADVANCED INTEGRATED CIRCUI...

INTERCONNECT STRUCTURE WITH REINFORCING SPACER AND METHOD FOR MANUF...

SELF-ALIGNED TOPVIA AND METAL LINE WITH INCREASED HEIGHT

METHOD FOR TWO-DIMENSIONAL MENTAL LINE PATTERNING

EMBEDDING A METAL-INSULATOR-METAL CAPACITOR IN A PASSIVATION LAYER

CUT SHAPES FOR BACKSIDE METALS

TECHNIQUES FOR SEMICONDUCTOR DIE COUPLING IN STACKED MEMORY ARCHITE...

SEMICONDUCTOR PACKAGE WITH SHARED BARRIER LAYER IN REDISTRIBUTION A...