Thin films associated with contacts of capacitors

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H01L21/7687

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/7687Thin films associated with contacts of capacitors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Self-aligned barrier for metal vias
- Patent number 11,972,974
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked via structure
- Patent number 11,973,023
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of forming the same
- Patent number 11,973,027
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,973,117
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 11,973,149
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yu-Hsing Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer deposition on 3D NAND structures
- Patent number 11,972,952
- Issue date Apr 30, 2024
- Lam Research Corporation
- Ruopeng Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a three-dimensional memory device using composite...
- Patent number 11,972,954
- Issue date Apr 30, 2024
- SanDisk Technologies LLC
- Roshan Jayakhar Tirukkonda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of rigid close-pitch interconnects
- Patent number 11,972,977
- Issue date Apr 30, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution substrate, method of fabricating the same, and semic...
- Patent number 11,973,028
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanotwin copper materials in semiconductor devices
- Patent number 11,973,034
- Issue date Apr 30, 2024
- Applied Materials, Inc.
- Eric J. Bergman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Conductive via of integrated circuitry, memory array comprising str...
- Patent number 11,972,978
- Issue date Apr 30, 2024
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,973,024
- Issue date Apr 30, 2024
- Kioxia Corporation
- Hisashi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SRAM layout for double patterning
- Patent number 11,974,421
- Issue date Apr 30, 2024
- Texas Instruments Incorporated
- James Walter Blatchford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with via extending across adjacent conducti...
- Patent number 11,967,550
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of the same
- Patent number 11,967,553
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D NAND gate stack reinforcement
- Patent number 11,967,524
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- Praket Prakash Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating microelectronic devices with contacts to co...
- Patent number 11,967,556
- Issue date Apr 23, 2024
- Biow Hiem Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit
- Patent number 11,967,560
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective tungsten deposition at low temperatures
- Patent number 11,967,525
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- Yi Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and manufacturing method thereof
- Patent number 11,967,526
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming interconnect structures in semiconductor fabrica...
- Patent number 11,967,552
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with sidewall interconnection structure and me...
- Patent number 11,961,787
- Issue date Apr 16, 2024
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuitry, memory circuitry comprising strings of memory...
- Patent number 11,961,801
- Issue date Apr 16, 2024
- Micron Technology, Inc.
- Lifang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package component with stepped passivation layer
- Patent number 11,961,762
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for controlling stress variation in a material...
- Patent number 11,961,722
- Issue date Apr 16, 2024
- SPTS Technologies Limited
- Anthony Wilby
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Staircase formation in three-dimensional memory device
- Patent number 11,961,760
- Issue date Apr 16, 2024
- Yangtze Memory Technologies Co., Ltd.
- Yu Ting Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned metal gate for multigate device and method of forming...
- Patent number 11,961,763
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jia-Chuan You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via for semiconductor device connection and methods of forming the...
- Patent number 11,961,800
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to dual-sided radio-frequency package w...
- Patent number 11,961,805
- Issue date Apr 16, 2024
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlling threshold voltages through blocking layers
- Patent number 11,961,732
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ching Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DECOUPLING CAPACITANCE IN BACKSIDE INTERCONNECT
- Publication number 20240145376
- Publication date May 2, 2024
- International Business Machines Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR FILM PLATING PERIMETER MAPPING AND COMPENSATION
- Publication number 20240145251
- Publication date May 2, 2024
- Applied Materials, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fin Field-Effect Transistor Device Having Contact Plugs with Re-Ent...
- Publication number 20240145597
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA WITH SACRIFICIAL STRESS BARRIER RING
- Publication number 20240145378
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE DIELECTRIC STRUCTURES FOR SEMICONDUCTOR DIE ASSEMBLIES AN...
- Publication number 20240145436
- Publication date May 2, 2024
- Micron Technology, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRCASE FORMATION IN THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20240145296
- Publication date May 2, 2024
- Yangtze Memory Technologies Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240145344
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
- Publication number 20240145391
- Publication date May 2, 2024
- Tahoe Research, Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...
- Publication number 20240147727
- Publication date May 2, 2024
- Lodestar Licensing Group LLC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD TO IMPROVE FAV RIE PROCESS MARGIN AND ELECTROM...
- Publication number 20240145299
- Publication date May 2, 2024
- TESSERA LLC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING INTERCONNECTING M...
- Publication number 20240145302
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240145375
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION LINER ON INTERCONNECT WIRE TO ENLARGE PROCESSING WINDOW...
- Publication number 20240145381
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE AND METHOD
- Publication number 20240138152
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Feng-Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR DEVICE AND METHOD OF FABRICATING CONTACTS TO A SEMICONDU...
- Publication number 20240136411
- Publication date Apr 25, 2024
- Infineon Technologies Austria AG
- Seung Hwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier-Free Approach for Forming Contact Plugs
- Publication number 20240136227
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION RAIL BETWEEN BACKSIDE POWER RAILS
- Publication number 20240136253
- Publication date Apr 25, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FILLING A RECESSED FEATURE ON A SUBSTRATE AND RELATED S...
- Publication number 20240136224
- Publication date Apr 25, 2024
- ASM IP HOLDING B.V.
- YoungChol Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SEMICONDUCTOR COMPONENT ON THE BASIS OF GALLIUM NITRIDE...
- Publication number 20240136407
- Publication date Apr 25, 2024
- ROBERT BOSCH GmbH
- Kevin Dannecker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT END OF LINE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AN...
- Publication number 20240136295
- Publication date Apr 25, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AND USING MASK
- Publication number 20240136184
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN FIELD-EFFECT TRANSISTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240136191
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Hsiu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR INTERCONNECTING A BURIED WIRING LINE AND A SOURCE/DRAIN...
- Publication number 20240136225
- Publication date Apr 25, 2024
- IMEC vzw
- Boon Teik Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, MEMORY DEVICES, AND ELECTRONIC SYSTEMS
- Publication number 20240136285
- Publication date Apr 25, 2024
- Lodestar Licensing Group LLC
- Shuangqiang Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN INDIVIDUALIZATION ZONE OF AN INTEGRATED CIR...
- Publication number 20240128119
- Publication date Apr 18, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Stefan LANDIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240128122
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240128120
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240120272
- Publication date Apr 11, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Wei-Hao LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH RING-LIKE STRUCTURE
- Publication number 20240120313
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yao YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE OF CUT END WITH SELF-ALIGNED DOUBLE PATTERNING
- Publication number 20240120200
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS

Thin films associated with contacts of capacitors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Self-aligned barrier for metal vias

Stacked via structure

Semiconductor device and methods of forming the same

Semiconductor device

Semiconductor device and method of forming the same

Atomic layer deposition on 3D NAND structures

Method of making a three-dimensional memory device using composite...

Fabrication of rigid close-pitch interconnects

Redistribution substrate, method of fabricating the same, and semic...

Nanotwin copper materials in semiconductor devices

Conductive via of integrated circuitry, memory array comprising str...

Semiconductor memory device

SRAM layout for double patterning

Semiconductor structure with via extending across adjacent conducti...

Semiconductor package and manufacturing method of the same

3D NAND gate stack reinforcement

Methods for fabricating microelectronic devices with contacts to co...

Integrated circuit

Selective tungsten deposition at low temperatures

Integrated circuit structure and manufacturing method thereof

Methods of forming interconnect structures in semiconductor fabrica...

Semiconductor device with sidewall interconnection structure and me...

Integrated circuitry, memory circuitry comprising strings of memory...

Package component with stepped passivation layer

Method and apparatus for controlling stress variation in a material...

Staircase formation in three-dimensional memory device

Self-aligned metal gate for multigate device and method of forming...

Via for semiconductor device connection and methods of forming the...

Devices and methods related to dual-sided radio-frequency package w...

Controlling threshold voltages through blocking layers

Patents Applicationslast 30 patents

DECOUPLING CAPACITANCE IN BACKSIDE INTERCONNECT

SEMICONDUCTOR FILM PLATING PERIMETER MAPPING AND COMPENSATION

Fin Field-Effect Transistor Device Having Contact Plugs with Re-Ent...

VIA WITH SACRIFICIAL STRESS BARRIER RING

COMPOSITE DIELECTRIC STRUCTURES FOR SEMICONDUCTOR DIE ASSEMBLIES AN...

STAIRCASE FORMATION IN THREE-DIMENSIONAL MEMORY DEVICE

VIA STRUCTURE AND METHOD FOR FORMING THE SAME

COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF

MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...

STRUCTURE AND METHOD TO IMPROVE FAV RIE PROCESS MARGIN AND ELECTROM...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING INTERCONNECTING M...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

PROTECTION LINER ON INTERCONNECT WIRE TO ENLARGE PROCESSING WINDOW...

THREE-DIMENSIONAL MEMORY DEVICE AND METHOD

TRANSISTOR DEVICE AND METHOD OF FABRICATING CONTACTS TO A SEMICONDU...

Barrier-Free Approach for Forming Contact Plugs

ISOLATION RAIL BETWEEN BACKSIDE POWER RAILS

METHODS FOR FILLING A RECESSED FEATURE ON A SUBSTRATE AND RELATED S...

VERTICAL SEMICONDUCTOR COMPONENT ON THE BASIS OF GALLIUM NITRIDE...

FRONT END OF LINE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AN...

METHOD FOR FORMING AND USING MASK

FIN FIELD-EFFECT TRANSISTOR DEVICE AND METHOD OF FORMING THE SAME

METHOD FOR INTERCONNECTING A BURIED WIRING LINE AND A SOURCE/DRAIN...

MICROELECTRONIC DEVICES, MEMORY DEVICES, AND ELECTRONIC SYSTEMS

METHOD FOR PRODUCING AN INDIVIDUALIZATION ZONE OF AN INTEGRATED CIR...

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

CHIP PACKAGE STRUCTURE WITH RING-LIKE STRUCTURE

METHOD AND STRUCTURE OF CUT END WITH SELF-ALIGNED DOUBLE PATTERNING