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MICROELECTRONIC ASSEMBLIES
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Publication number 20250046625
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Publication date Feb 6, 2025
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ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
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Belgacem Haba
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H01 - BASIC ELECTRIC ELEMENTS
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BOND STRUCTURE
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Publication number 20250038106
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Publication date Jan 30, 2025
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Advanced Semiconductor Engineering, Inc.
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Chun-Wei CHIANG
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H01 - BASIC ELECTRIC ELEMENTS
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PACKAGE STRUCTURES
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Publication number 20250040254
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Publication date Jan 30, 2025
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Ming-Fa Chen
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H01 - BASIC ELECTRIC ELEMENTS
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TUNGSTEN MOLYBDENUM STRUCTURES
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Publication number 20250038051
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Publication date Jan 30, 2025
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Applied Materials, Inc.
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Xi CEN
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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EMBEDDED METAL LINES
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Publication number 20250038152
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Publication date Jan 30, 2025
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ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
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Stephen Morein
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H01 - BASIC ELECTRIC ELEMENTS
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SYSTEMS AND METHODS FOR DEPOSITING METAL
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Publication number 20250037981
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Publication date Jan 30, 2025
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TOKYO ELECTRON LIMITED
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David Eitan Barlaz
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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FEATURE FILL WITH NUCLEATION INHIBITION
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Publication number 20250038050
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Publication date Jan 30, 2025
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LAM RESEARCH CORPORATION
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Son Vo Nam TRAN
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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