Thin films associated with contacts of capacitors

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H01L21/7687

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/7687Thin films associated with contacts of capacitors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Interconnection structure having air gap and method for manufacturi...
- Patent number 12,272,636
- Issue date Apr 8, 2025
- NANYA TECHNOLOGY CORPORATION
- Tsu-Chieh Ai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reflectance isolation structure to increase image sensor perfo...
- Patent number 12,272,715
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Chan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive feature of a semiconductor device
- Patent number 12,272,598
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- U-Ting Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 12,272,646
- Issue date Apr 8, 2025
- United Microelectronics Corp.
- Feng-Yi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cell with top electrode via
- Patent number 12,274,183
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Che Ku
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 12,272,596
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Junghyuck Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition and method for fabrication of nickel interconnects
- Patent number 12,270,121
- Issue date Apr 8, 2025
- MacDermid Enthone Inc.
- Eric Yakobson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device with identification structure, method for manu...
- Patent number 12,272,643
- Issue date Apr 8, 2025
- AP Memory Technology Corporation
- Wenliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective metal removal with flowable polymer
- Patent number 12,272,551
- Issue date Apr 8, 2025
- Applied Materials, Inc.
- Liqi Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Removing polymer through treatment
- Patent number 12,272,595
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques to inhibit delamination from flowable gap-fill dielectric
- Patent number 12,266,604
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of manufacture
- Patent number 12,266,576
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device having at least one via incl...
- Patent number 12,266,593
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect wires including relatively low resistivity cores
- Patent number 12,266,568
- Issue date Apr 1, 2025
- Intel Corporation
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with source/drain contact formed using bottom-...
- Patent number 12,266,688
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 12,266,539
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ru-Gun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enlarging contact area and process window for a contact via
- Patent number 12,266,563
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,266,564
- Issue date Apr 1, 2025
- NANYA TECHNOLOGY CORPORATION
- Chiang-Lin Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned contacts
- Patent number 12,266,571
- Issue date Apr 1, 2025
- Intel Corporation
- Mark T. Bohr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via interconnects with line wiggling prevention
- Patent number 12,266,605
- Issue date Apr 1, 2025
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom barrier free interconnects without voids
- Patent number 12,266,607
- Issue date Apr 1, 2025
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal device capacitance enhancement
- Patent number 12,261,196
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lu-Sheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with a nitrided capping layer
- Patent number 12,261,082
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Chin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Middle-end-of-line strap for standard cell
- Patent number 12,261,113
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Hung Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC device with chip to package interconnects from a copper metal in...
- Patent number 12,261,141
- Issue date Mar 25, 2025
- Texas Instruments Incorporated
- Manoj Kumar Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming vias in a GaN/diamond wafer
- Patent number 12,261,206
- Issue date Mar 25, 2025
- RFHIC Corporation
- Won Sang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tungsten feature fill with inhibition control
- Patent number 12,261,081
- Issue date Mar 25, 2025
- Lam Research Corporation
- Tsung-Han Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization stacks with self-aligned staggered metal lines
- Patent number 12,261,114
- Issue date Mar 25, 2025
- Intel Corporation
- Elijah V. Karpov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structures with etch stop layers for advan...
- Patent number 12,261,122
- Issue date Mar 25, 2025
- Intel Corporation
- Atul Madhavan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer line structure
- Patent number 12,255,145
- Issue date Mar 18, 2025
- Dai Nippon Printing Co., Ltd.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDING A METAL-INSULATOR-METAL CAPACITOR IN A PASSIVATION LAYER
- Publication number 20250118654
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUT SHAPES FOR BACKSIDE METALS
- Publication number 20250118661
- Publication date Apr 10, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR SEMICONDUCTOR DIE COUPLING IN STACKED MEMORY ARCHITE...
- Publication number 20250118693
- Publication date Apr 10, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SHARED BARRIER LAYER IN REDISTRIBUTION A...
- Publication number 20250118711
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A THROUGH VIA AND A WIRING LAYER
- Publication number 20250118662
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Dohyun Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING SEMICONDUCTOR DEVICES
- Publication number 20250118600
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Uihyoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Embedded Trace Substrate...
- Publication number 20250118599
- Publication date Apr 10, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20250120172
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jia-Chuan YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE, SEMICONDUCTOR DEVICE COMPRISING THE SAME, AND ME...
- Publication number 20250112159
- Publication date Apr 3, 2025
- NANYA TECHNOLOGY CORPORATION
- Jhen-Yu TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250113495
- Publication date Apr 3, 2025
- United Microelectronics Corp.
- Wen-Jen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES
- Publication number 20250112085
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250112087
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hwei-Jay CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE, SEMICONDUCTOR DEVICE COMPRISING THE SAME, AND ME...
- Publication number 20250112158
- Publication date Apr 3, 2025
- NANYA TECHNOLOGY CORPORATION
- Jhen-Yu TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE TREATMENT ENABLING SUPER-CONFORMAL METAL CAP PROFILE ON MID...
- Publication number 20250112091
- Publication date Apr 3, 2025
- Applied Materials, Inc.
- Jianqiu GUO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME
- Publication number 20250112149
- Publication date Apr 3, 2025
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- SHU HUI LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ASSEMBLIES HAVING ONE OR MORE MODIFYING SUBSTANCES DISTR...
- Publication number 20250107089
- Publication date Mar 27, 2025
- Lodestar Licensing Group LLC
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FILLING METHOD
- Publication number 20250105060
- Publication date Mar 27, 2025
- Shanghai Huali Integrated Circuit Corporation
- Zhiqi YUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES WITH ACTIVE SOURCE/DRAIN CONTACTS IN TRENCH...
- Publication number 20250107204
- Publication date Mar 27, 2025
- Micron Technology, Inc.
- Lifang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING METHOD OF INTERCONNECT STRUCTURE
- Publication number 20250105058
- Publication date Mar 27, 2025
- HON HAI PRECISION INDUSTRY CO., LTD.
- Yun-Hung SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF VIA FILLING
- Publication number 20250105059
- Publication date Mar 27, 2025
- TOKYO ELECTRON LIMITED
- Ryota Yonezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH METHOD FOR OPENING A SOURCE LINE IN FLASH MEMORY
- Publication number 20250098160
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yong-Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION OF GRAPHENE ON COBALT-CAPPED COPPER DUAL DAMAS...
- Publication number 20250096036
- Publication date Mar 20, 2025
- LAM RESEARCH CORPORATION
- Asish Parbatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER FABRICATION WITH POLYIMIDE TO GRAPHENE CONVERSION
- Publication number 20250096113
- Publication date Mar 20, 2025
- NXP USA, Inc.
- Douglas Michael Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL POWER MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20250096109
- Publication date Mar 20, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Jianhong ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIRGAPS IN TOP LAYERS OF SEMICONDUCTOR DEVICES
- Publication number 20250096139
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- John Jianhong ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250096044
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250098283
- Publication date Mar 20, 2025
- MEDIATEK INC.
- Po-Chao TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Buried Interconnect Structure
- Publication number 20250096037
- Publication date Mar 20, 2025
- IMEC vzw
- Gaspard Hiblot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR DEVICE
- Publication number 20250096135
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Sung-Hun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20250096140
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Chang WU
- H01 - BASIC ELECTRIC ELEMENTS

Thin films associated with contacts of capacitors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interconnection structure having air gap and method for manufacturi...

High reflectance isolation structure to increase image sensor perfo...

Conductive feature of a semiconductor device

Semiconductor memory device

Memory cell with top electrode via

Method of manufacturing semiconductor devices

Composition and method for fabrication of nickel interconnects

Semiconductor device with identification structure, method for manu...

Selective metal removal with flowable polymer

Removing polymer through treatment

Techniques to inhibit delamination from flowable gap-fill dielectric

Semiconductor device and methods of manufacture

Method of forming semiconductor device having at least one via incl...

Interconnect wires including relatively low resistivity cores

Semiconductor device with source/drain contact formed using bottom-...

Method of manufacturing semiconductor devices

Enlarging contact area and process window for a contact via

Semiconductor device

Self-aligned contacts

Top via interconnects with line wiggling prevention

Bottom barrier free interconnects without voids

Metal-insulator-metal device capacitance enhancement

Semiconductor devices with a nitrided capping layer

Middle-end-of-line strap for standard cell

IC device with chip to package interconnects from a copper metal in...

Method of forming vias in a GaN/diamond wafer

Tungsten feature fill with inhibition control

Metallization stacks with self-aligned staggered metal lines

Contact over active gate structures with etch stop layers for advan...

Multi-layer line structure

Patents Applicationslast 30 patents

EMBEDDING A METAL-INSULATOR-METAL CAPACITOR IN A PASSIVATION LAYER

CUT SHAPES FOR BACKSIDE METALS

TECHNIQUES FOR SEMICONDUCTOR DIE COUPLING IN STACKED MEMORY ARCHITE...

SEMICONDUCTOR PACKAGE WITH SHARED BARRIER LAYER IN REDISTRIBUTION A...

SEMICONDUCTOR DEVICE INCLUDING A THROUGH VIA AND A WIRING LAYER

METHODS OF FABRICATING SEMICONDUCTOR DEVICES

Semiconductor Device and Method of Forming Embedded Trace Substrate...

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

CONTACT STRUCTURE, SEMICONDUCTOR DEVICE COMPRISING THE SAME, AND ME...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES

INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME

CONTACT STRUCTURE, SEMICONDUCTOR DEVICE COMPRISING THE SAME, AND ME...

SURFACE TREATMENT ENABLING SUPER-CONFORMAL METAL CAP PROFILE ON MID...

SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME

INTEGRATED ASSEMBLIES HAVING ONE OR MORE MODIFYING SUBSTANCES DISTR...

CONTACT FILLING METHOD

MICROELECTRONIC DEVICES WITH ACTIVE SOURCE/DRAIN CONTACTS IN TRENCH...

FORMING METHOD OF INTERCONNECT STRUCTURE

METHOD OF VIA FILLING

ETCH METHOD FOR OPENING A SOURCE LINE IN FLASH MEMORY

SELECTIVE DEPOSITION OF GRAPHENE ON COBALT-CAPPED COPPER DUAL DAMAS...

SEMICONDUCTOR WAFER FABRICATION WITH POLYIMIDE TO GRAPHENE CONVERSION

WAFER-LEVEL POWER MODULE AND MANUFACTURING METHOD THEREFOR

AIRGAPS IN TOP LAYERS OF SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE

Method for Forming a Buried Interconnect Structure

THREE-DIMENSIONAL SEMICONDUCTOR DEVICE

INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME