Thin films associated with contacts of capacitors

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CPC
H01L21/7687

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/7687Thin films associated with contacts of capacitors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip and semiconductor package including the same
- Patent number 12,224,258
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Wonkyun Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming backside power rails
- Patent number 12,224,324
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with doped semiconductor bridge str...
- Patent number 12,225,720
- Issue date Feb 11, 2025
- SanDisk Technologies LLC
- Ryousuke Itou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and manufacturing methods of the same
- Patent number 12,225,725
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- So Hyeon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including active contacts and support conta...
- Patent number 12,224,240
- Issue date Feb 11, 2025
- Micron Technology, Inc.
- S M Istiaque Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure with power connect...
- Patent number 12,224,227
- Issue date Feb 11, 2025
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,224,325
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 12,218,005
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsia-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an integrated circuit device having an etch-stop...
- Patent number 12,218,054
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Taeyong Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method of forming the same
- Patent number 12,218,105
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatuses for forming semiconductor devices containin...
- Patent number 12,217,965
- Issue date Feb 4, 2025
- SanDisk Technologies LLC
- Fei Zhou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,218,194
- Issue date Feb 4, 2025
- SK Hynix Inc.
- Hae Jung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and manufacturing method thereof, and three...
- Patent number 12,218,032
- Issue date Feb 4, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor device
- Patent number 12,218,050
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Te-Hsin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip with graphene based interconnect
- Patent number 12,218,060
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices with a polysilicon structure above a stairc...
- Patent number 12,218,081
- Issue date Feb 4, 2025
- Lodestar Licensing Group LLC
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure
- Patent number 12,218,004
- Issue date Feb 4, 2025
- Semiconductor Manufacturing International (Shanghai) Corporation
- He Zuopeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned via formation using spacers
- Patent number 12,218,007
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with conductive contacts of differen...
- Patent number 12,218,055
- Issue date Feb 4, 2025
- NANYA TECHNOLOGY CORPORATION
- Ming-Hung Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 12,219,763
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Jisung Cheon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 12,213,317
- Issue date Jan 28, 2025
- Micron Technology, Inc.
- Lifang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective removal of an etching stop layer for improving overlay sh...
- Patent number 12,211,700
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating semiconductor devices
- Patent number 12,211,745
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Uihyoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked vias with bottom portions formed using selective growth
- Patent number 12,211,786
- Issue date Jan 28, 2025
- Intel Corporation
- Andy Chih-Hung Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid interconnect structure for self aligned via
- Patent number 12,211,788
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming the same
- Patent number 12,211,801
- Issue date Jan 28, 2025
- Parabellum Strategic Opportunities Fund LLC
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with shared barrier layer in redistribution a...
- Patent number 12,211,823
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 12,205,888
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method of forming same
- Patent number 12,205,911
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic devices, and related electronic...
- Patent number 12,205,846
- Issue date Jan 21, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VERTICAL MEMORY DEVICES
- Publication number 20250056801
- Publication date Feb 13, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhong ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE METAL CAPPING PROCESSES FOR A JUNCTION SILICIDE
- Publication number 20250054767
- Publication date Feb 13, 2025
- Applied Materials, Inc.
- Qihao ZHU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A DEFECT...
- Publication number 20250051950
- Publication date Feb 13, 2025
- BASF SE
- Charlotte Emnet
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND SYSTEM
- Publication number 20250054857
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Jung CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE BOTTOM-UP METAL FILL/CAP ON JUNCTION SILICIDE BY SELECTIV...
- Publication number 20250054812
- Publication date Feb 13, 2025
- Applied Materials, Inc.
- Qihao ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20250054870
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- WOONCHUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PAD METALLIZATION SYSTEMS AND RELATED METHODS
- Publication number 20250054887
- Publication date Feb 13, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Guy BRIZAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY SELF-ALIGNED VIA WITH GRAPHENE CAP
- Publication number 20250054809
- Publication date Feb 13, 2025
- TOKYO ELECTRON LIMITED
- Kandabara Tapily
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE INCLUDING CAP LAYER OF TWO-DIMENSIONAL MATE...
- Publication number 20250054810
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED REVERSE SELECTIVE BARRIER STRUCTURE
- Publication number 20250046716
- Publication date Feb 6, 2025
- QUALCOMM Incorporated
- Junjing BAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENTIAL ETCH RATES OF COPPER FEATURES
- Publication number 20250046654
- Publication date Feb 6, 2025
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PROTECTION LAYER AND METHOD FOR FABRICATI...
- Publication number 20250046708
- Publication date Feb 6, 2025
- NANYA TECHNOLOGY CORPORATION
- CHUN-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PROTECTION LAYER AND METHOD FOR FABRICATI...
- Publication number 20250046709
- Publication date Feb 6, 2025
- NANYA TECHNOLOGY CORPORATION
- CHUN-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20250046625
- Publication date Feb 6, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERCONNECT STRUCTURE FOR THERMAL MANAGEMENT OF ELECTRICAL...
- Publication number 20250046673
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING DUAL DAMASCENE STRUCTURES USING MULTILAYER PHOTOSENSITI...
- Publication number 20250046652
- Publication date Feb 6, 2025
- Applied Materials, Inc.
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20250046681
- Publication date Feb 6, 2025
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELF-ALIGNED PATTERNING WITH COLORED BLOCKING AND STRUCTURES RESULT...
- Publication number 20250046713
- Publication date Feb 6, 2025
- Intel Corporation
- Mohit K. HARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH BACKSIDE INTERCONNECT STRUCTURE AND THRO...
- Publication number 20250038074
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND STRUCTURE
- Publication number 20250038106
- Publication date Jan 30, 2025
- Advanced Semiconductor Engineering, Inc.
- Chun-Wei CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES
- Publication number 20250040254
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED METAL LINES
- Publication number 20250038152
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Stephen Morein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNGSTEN MOLYBDENUM STRUCTURES
- Publication number 20250038051
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Xi CEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR FORMING STAIRS IN THREE-DIMENSIONAL MEMORY DEVICES
- Publication number 20250038046
- Publication date Jan 30, 2025
- Yangtze Memory Technologies Co., Ltd.
- Xiangning Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20250038049
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED ELECTRON...
- Publication number 20250038109
- Publication date Jan 30, 2025
- Micron Technology, Inc.
- Paolo Tessariol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING SAME
- Publication number 20250040224
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIAS INCLUDING AN ELECTROPLATED LAYER AND METHODS FOR FABRICATING T...
- Publication number 20250038010
- Publication date Jan 30, 2025
- Corning Incorporated
- Bomi Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FEATURE FILL WITH NUCLEATION INHIBITION
- Publication number 20250038050
- Publication date Jan 30, 2025
- LAM RESEARCH CORPORATION
- Son Vo Nam TRAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEMS AND METHODS FOR DEPOSITING METAL
- Publication number 20250037981
- Publication date Jan 30, 2025
- TOKYO ELECTRON LIMITED
- David Eitan Barlaz
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Thin films associated with contacts of capacitors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor chip and semiconductor package including the same

Method of forming backside power rails

Three-dimensional memory device with doped semiconductor bridge str...

Semiconductor devices and manufacturing methods of the same

Microelectronic devices including active contacts and support conta...

Method for manufacturing semiconductor structure with power connect...

Semiconductor device and manufacturing method thereof

Integrated circuit device

Method of forming an integrated circuit device having an etch-stop...

Package and method of forming the same

Methods and apparatuses for forming semiconductor devices containin...

Semiconductor device and method for fabricating the same

Semiconductor apparatus and manufacturing method thereof, and three...

Manufacturing method for semiconductor device

Integrated chip with graphene based interconnect

Microelectronic devices with a polysilicon structure above a stairc...

Method for forming semiconductor structure

Self-aligned via formation using spacers

Semiconductor device structure with conductive contacts of differen...

Integrated circuit device

Memory arrays and methods used in forming a memory array comprising...

Selective removal of an etching stop layer for improving overlay sh...

Methods of fabricating semiconductor devices

Stacked vias with bottom portions formed using selective growth

Hybrid interconnect structure for self aligned via

Chip package and method of forming the same

Semiconductor package with shared barrier layer in redistribution a...

Semiconductor packages and methods of forming the same

Bonding structure and method of forming same

Methods of forming microelectronic devices, and related electronic...

Patents Applicationslast 30 patents

VERTICAL MEMORY DEVICES

SELECTIVE METAL CAPPING PROCESSES FOR A JUNCTION SILICIDE

ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A DEFECT...

INTEGRATED CIRCUIT DEVICE AND SYSTEM

SELECTIVE BOTTOM-UP METAL FILL/CAP ON JUNCTION SILICIDE BY SELECTIV...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

COPPER PAD METALLIZATION SYSTEMS AND RELATED METHODS

FULLY SELF-ALIGNED VIA WITH GRAPHENE CAP

SEMICONDUCTOR STRUCTURE INCLUDING CAP LAYER OF TWO-DIMENSIONAL MATE...

MODIFIED REVERSE SELECTIVE BARRIER STRUCTURE

DIFFERENTIAL ETCH RATES OF COPPER FEATURES

SEMICONDUCTOR DEVICE WITH PROTECTION LAYER AND METHOD FOR FABRICATI...

SEMICONDUCTOR DEVICE WITH PROTECTION LAYER AND METHOD FOR FABRICATI...

MICROELECTRONIC ASSEMBLIES

THERMAL INTERCONNECT STRUCTURE FOR THERMAL MANAGEMENT OF ELECTRICAL...

FABRICATING DUAL DAMASCENE STRUCTURES USING MULTILAYER PHOTOSENSITI...

THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE

SELF-ALIGNED PATTERNING WITH COLORED BLOCKING AND STRUCTURES RESULT...

SEMICONDUCTOR DEVICES WITH BACKSIDE INTERCONNECT STRUCTURE AND THRO...

BOND STRUCTURE

PACKAGE STRUCTURES

EMBEDDED METAL LINES

TUNGSTEN MOLYBDENUM STRUCTURES

METHODS FOR FORMING STAIRS IN THREE-DIMENSIONAL MEMORY DEVICES

INTERCONNECT STRUCTURE AND FABRICATION METHOD THEREOF

MEMORY DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED ELECTRON...

INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING SAME

VIAS INCLUDING AN ELECTROPLATED LAYER AND METHODS FOR FABRICATING T...

FEATURE FILL WITH NUCLEATION INHIBITION

SYSTEMS AND METHODS FOR DEPOSITING METAL