Three-layer arrangements

Industry

CPC
H01L2224/45033

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/45033Three-layer arrangements

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,027,490
- Issue date Jul 2, 2024
- Infineon Technologies AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,908,830
- Issue date Feb 20, 2024
- Infineon Technologies AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum coated copper ribbon
- Patent number 9,214,444
- Issue date Dec 15, 2015
- Heraeus Deutschland GmbH & Co. KG
- Eugen Milke
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Ribbon bonding in an electronic package
- Patent number 8,685,789
- Issue date Apr 1, 2014
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ribbon bonding in an electronic package
- Patent number 8,685,791
- Issue date Apr 1, 2014
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ribbon bonding in an electronic package
- Patent number 7,745,253
- Issue date Jun 29, 2010
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with micro connecting elements and method for...
- Patent number 7,468,560
- Issue date Dec 23, 2008
- Infineon Technologies AG
- Volker Guengerich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Superconducting bonds for thin film devices
- Patent number 5,139,192
- Issue date Aug 18, 1992
- Quantum Magnetics, Inc.
- Michael B. Simmonds
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bonds for thin film devices
- Patent number 5,110,034
- Issue date May 5, 1992
- Quantum Magnetics, Inc.
- Michael B. Simmonds
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20220045031
- Publication date Feb 10, 2022
- INFINEON TECHNOLOGIES AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIBBON BONDING IN AN ELECTRONIC PACKAGE
- Publication number 20130134577
- Publication date May 30, 2013
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING
- Publication number 20130009296
- Publication date Jan 10, 2013
- GEM Services, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING CONFIGURABLE LEAD FRAME FINGERS
- Publication number 20130009297
- Publication date Jan 10, 2013
- GEM Services, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIBBON BONDING IN AN ELECTRONIC PACKAGE
- Publication number 20100214754
- Publication date Aug 26, 2010
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer bonding ribbon
- Publication number 20070290373
- Publication date Dec 20, 2007
- Manfred Reinold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIBBON BONDING IN AN ELECTRONIC PACKAGE
- Publication number 20070141755
- Publication date Jun 21, 2007
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with micro connecting elements and method for...
- Publication number 20060185892
- Publication date Aug 24, 2006
- Volker Guengerich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ribbon bonding in an electronic package
- Publication number 20050269694
- Publication date Dec 8, 2005
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ribbon bonding
- Publication number 20040217488
- Publication date Nov 4, 2004
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS

Three-layer arrangements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

Aluminum coated copper ribbon

Ribbon bonding in an electronic package

Ribbon bonding in an electronic package

Ribbon bonding in an electronic package

Semiconductor device with micro connecting elements and method for...

Superconducting bonds for thin film devices

Superconducting bonds for thin film devices

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

RIBBON BONDING IN AN ELECTRONIC PACKAGE

SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING

SEMICONDUCTOR DEVICE PACKAGE HAVING CONFIGURABLE LEAD FRAME FINGERS

RIBBON BONDING IN AN ELECTRONIC PACKAGE

Multilayer bonding ribbon

RIBBON BONDING IN AN ELECTRONIC PACKAGE

Semiconductor device with micro connecting elements and method for...

Ribbon bonding in an electronic package

Ribbon bonding