Three-layer coating

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H01L2224/13583

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13583Three-layer coating

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages
- Patent number 11,705,379
- Issue date Jul 18, 2023
- Samsung Electronics Co., Ltd.
- Chanho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method for manufacturing the same
- Patent number 11,682,653
- Issue date Jun 20, 2023
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming Hung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Core material, electronic component and method for forming bump ele...
- Patent number 11,495,566
- Issue date Nov 8, 2022
- Senju Metal Industry Co., Ltd.
- Shigeki Kondoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a pillar structure having a non-metal sidewall pro...
- Patent number 11,257,714
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,257,776
- Issue date Feb 22, 2022
- Advanced Semiconductor Engineering, Inc.
- Yung-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method for manufacturing the same
- Patent number 10,937,761
- Issue date Mar 2, 2021
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming Hung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bump structure manufacturing method
- Patent number 10,937,751
- Issue date Mar 2, 2021
- LBSEMICON CO., LTD.
- Jin Kuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding package components through plating
- Patent number 10,840,212
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal core solder ball interconnector fan-out wafer level package
- Patent number 10,679,930
- Issue date Jun 9, 2020
- Hana Micron Inc.
- Hyun Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-encapsulated semiconductor device and method of manufacturing...
- Patent number 10,600,752
- Issue date Mar 24, 2020
- ABLIC Inc.
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method for manufacturing the same
- Patent number 10,522,505
- Issue date Dec 31, 2019
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming Hung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bonding package components through plating
- Patent number 10,483,230
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced through substrate via metallization in three dimensional s...
- Patent number 10,396,013
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced through substrate via metallization in three dimensional s...
- Patent number 10,396,012
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-encapsulated semiconductor device and method of manufacturing...
- Patent number 10,354,968
- Issue date Jul 16, 2019
- ABLIC Inc.
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,224,301
- Issue date Mar 5, 2019
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang Fang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer-level chip-scale package device having bump assemblies config...
- Patent number 9,721,912
- Issue date Aug 1, 2017
- Maxim Integrated Products, Inc.
- Viren Khandekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure comprising fine pitch backside metal redistr...
- Patent number 9,716,066
- Issue date Jul 25, 2017
- Intel Corporation
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 9,698,088
- Issue date Jul 4, 2017
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding package components through plating
- Patent number 9,691,738
- Issue date Jun 27, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,559,028
- Issue date Jan 31, 2017
- Rohm Co., Ltd.
- Hirofumi Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure for yield improvement
- Patent number 9,553,053
- Issue date Jan 24, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D interconnect structure comprising fine pitch single damascene ba...
- Patent number 9,449,913
- Issue date Sep 20, 2016
- Intel Corporation
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper pillar bump with cobalt-containing sidewall protection layer
- Patent number 9,275,965
- Issue date Mar 1, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component that includes a protective structure
- Patent number 9,263,390
- Issue date Feb 16, 2016
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a conducting contact on a conducting element
- Patent number 9,224,708
- Issue date Dec 29, 2015
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean-Philippe Colonna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor component
- Patent number 9,219,010
- Issue date Dec 22, 2015
- Semiconductor Componenets Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal coating for indium bump bonding
- Patent number 9,190,377
- Issue date Nov 17, 2015
- Indium Corporation
- Sihai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a pillar structure having a non-metal sidewall pro...
- Patent number 9,136,167
- Issue date Sep 15, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding package components through plating
- Patent number 9,117,772
- Issue date Aug 25, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...
- Publication number 20240332033
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Michele DERAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE IN CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240304582
- Publication date Sep 12, 2024
- XINTEC INC.
- Wei-Ming CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240105657
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Hansung Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230335533
- Publication date Oct 19, 2023
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming HUNG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230132054
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- Wooram MYUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL STRUCTURE AND WIRING SUBSTRATE
- Publication number 20220399297
- Publication date Dec 15, 2022
- Shinko Electric Industries Co., Ltd.
- Yoko NAKABAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING STRUCTURE, PACKAGE STRUCTURE AND MANUFACTURING METHOD TH...
- Publication number 20220336400
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORE MATERIAL, ELECTRONIC COMPONENT AND METHOD FOR FORMING BUMP ELE...
- Publication number 20220077093
- Publication date Mar 10, 2022
- SENJU METAL INDUSTRY CO., LTD.
- Shigeki KONDOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210175205
- Publication date Jun 10, 2021
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming HUNG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210082853
- Publication date Mar 18, 2021
- Advanced Semiconductor Engineering, Inc.
- Yung-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE MANUFACTURING METHOD
- Publication number 20200266163
- Publication date Aug 20, 2020
- LBSEMICON CO., LTD.
- Jin Kuk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200118968
- Publication date Apr 16, 2020
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming HUNG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Bonding Package Components Through Plating
- Publication number 20200020662
- Publication date Jan 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...
- Publication number 20190333888
- Publication date Oct 31, 2019
- ABLIC Inc.
- Noriyuki KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190013284
- Publication date Jan 10, 2019
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang FANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180294247
- Publication date Oct 11, 2018
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming HUNG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...
- Publication number 20180286827
- Publication date Oct 4, 2018
- ABLIC Inc.
- Noriyuki KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A PILLAR STRUCTURE HAVING A NON-METAL SIDEWALL PRO...
- Publication number 20140363970
- Publication date Dec 11, 2014
- Chien Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP WITH COBALT-CONTAINING SIDEWALL PROTECTION LAYER
- Publication number 20140342546
- Publication date Nov 20, 2014
- Chien Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Metal Bump Die Assembly
- Publication number 20140193952
- Publication date Jul 10, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE
- Publication number 20140182912
- Publication date Jul 3, 2014
- Unimicron Technology Corporation
- Chun-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT ASSEMBLIES AND METHODS OF MAKING AND USING SAME
- Publication number 20140145328
- Publication date May 29, 2014
- Georgia Tech Research Corporation
- Rao Tummala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Structure for Yield Improvement
- Publication number 20140027900
- Publication date Jan 30, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Package components Through Plating
- Publication number 20130334692
- Publication date Dec 19, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plating Process and Structure
- Publication number 20130330921
- Publication date Dec 12, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Fu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING FINE-PITCH BUMPS AND STRUCTURE THEREOF
- Publication number 20130256882
- Publication date Oct 3, 2013
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTERCONNECT STRUCTURE COMPRISING FINE PITCH SINGLE DAMASCENE BA...
- Publication number 20130256910
- Publication date Oct 3, 2013
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING FINE-PITCH BUMPS AND STRUCTURE THEREOF
- Publication number 20130249081
- Publication date Sep 26, 2013
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT
- Publication number 20130244418
- Publication date Sep 19, 2013
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component that includes a protective structure
- Publication number 20130234311
- Publication date Sep 12, 2013
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS

Three-layer coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packages

Semiconductor device package and method for manufacturing the same

Core material, electronic component and method for forming bump ele...

Method of making a pillar structure having a non-metal sidewall pro...

Semiconductor package structure and method for manufacturing the same

Semiconductor device package and method for manufacturing the same

Bump structure manufacturing method

Bonding package components through plating

Metal core solder ball interconnector fan-out wafer level package

Resin-encapsulated semiconductor device and method of manufacturing...

Semiconductor device package and method for manufacturing the same

Bonding package components through plating

Advanced through substrate via metallization in three dimensional s...

Advanced through substrate via metallization in three dimensional s...

Resin-encapsulated semiconductor device and method of manufacturing...

Semiconductor package device and method of manufacturing the same

Wafer-level chip-scale package device having bump assemblies config...

Interconnect structure comprising fine pitch backside metal redistr...

Semiconductor packages

Bonding package components through plating

Semiconductor device

Bump structure for yield improvement

3D interconnect structure comprising fine pitch single damascene ba...

Copper pillar bump with cobalt-containing sidewall protection layer

Semiconductor component that includes a protective structure

Method for manufacturing a conducting contact on a conducting element

Method of manufacturing a semiconductor component

Metal coating for indium bump bonding

Method of making a pillar structure having a non-metal sidewall pro...

Bonding package components through plating

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...

CIRCUIT SUBSTRATE IN CHIP PACKAGE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

TERMINAL STRUCTURE AND WIRING SUBSTRATE

CONNECTING STRUCTURE, PACKAGE STRUCTURE AND MANUFACTURING METHOD TH...

CORE MATERIAL, ELECTRONIC COMPONENT AND METHOD FOR FORMING BUMP ELE...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

BUMP STRUCTURE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Bonding Package Components Through Plating

RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...

METHOD OF MAKING A PILLAR STRUCTURE HAVING A NON-METAL SIDEWALL PRO...

COPPER PILLAR BUMP WITH COBALT-CONTAINING SIDEWALL PROTECTION LAYER

Methods for Metal Bump Die Assembly

PACKAGING SUBSTRATE

INTERCONNECT ASSEMBLIES AND METHODS OF MAKING AND USING SAME

Bump Structure for Yield Improvement

Bonding Package components Through Plating

Plating Process and Structure

METHOD FOR MANUFACTURING FINE-PITCH BUMPS AND STRUCTURE THEREOF

3D INTERCONNECT STRUCTURE COMPRISING FINE PITCH SINGLE DAMASCENE BA...

METHOD FOR MANUFACTURING FINE-PITCH BUMPS AND STRUCTURE THEREOF

METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT

Semiconductor component that includes a protective structure