Through-connections or via connections

Industry

CPC
H05K3/4038

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4038Through-connections or via connections

Industries

Patents Grantslast 30 patents

Information Patent Grant
Embeddable electrically insulating thermal connector and circuit bo...
- Patent number 12,200,853
- Issue date Jan 14, 2025
- KYOCERA AVX Components Corporation
- Cory Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,193,156
- Issue date Jan 7, 2025
- Ibiden Co., Ltd.
- Tomoyuki Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitive compensation for vertical interconnect accesses
- Patent number 12,185,462
- Issue date Dec 31, 2024
- Achronix Semiconductor Corporation
- Hansel Desmond Dsilva
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic device
- Patent number 12,185,461
- Issue date Dec 31, 2024
- Innolux Corporation
- Cheng-Chi Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making printed wiring board, printed wiring board, and a...
- Patent number 12,185,477
- Issue date Dec 31, 2024
- Ajinomoto Co., Inc.
- Habib Hichri
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Light board, method for manufacturing the same, and LED backlight m...
- Patent number 12,177,966
- Issue date Dec 24, 2024
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
- Xinghan He
- F21 - LIGHTING
Information Patent Grant
Transparent antenna and manufacturing method thereof
- Patent number 12,166,278
- Issue date Dec 10, 2024
- Industrial Technology Research Institute
- Shih-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jig for via-hole processing, via-hole processing device, and via-ho...
- Patent number 12,156,347
- Issue date Nov 26, 2024
- LG Innotek Co., Ltd
- Jong Heum Yoon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 12,107,082
- Issue date Oct 1, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module and manufacturing method thereof
- Patent number 12,047,662
- Issue date Jul 23, 2024
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
- Kuei-Feng Peng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 12,035,485
- Issue date Jul 9, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Guh Hwan Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low profile phased array
- Patent number 12,021,306
- Issue date Jun 25, 2024
- Raytheon Company
- Thomas V. Sikina
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Radio frequency front-end module, manufacturing method thereof and...
- Patent number 12,022,616
- Issue date Jun 25, 2024
- Shenzhen Newsonic Technologies Co., Ltd.
- Guojun Weng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic-based circuit board assemblies formed using metal nanoparti...
- Patent number 12,016,118
- Issue date Jun 18, 2024
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,010,796
- Issue date Jun 11, 2024
- Ibiden Co., Ltd.
- Yoshinori Takenaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,004,294
- Issue date Jun 4, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Zhi Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated circuit board
- Patent number 11,985,768
- Issue date May 14, 2024
- Pi-Crystal Incorporation
- Junichi Takeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 11,978,730
- Issue date May 7, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for manufacturing electrical components using e...
- Patent number 11,970,783
- Issue date Apr 30, 2024
- FABRIC8LABS, INC.
- David Pain
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for manufacturing transparent circuit board
- Patent number 11,950,371
- Issue date Apr 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Cheng-Jia Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vertically spaced intra-level interconnect line metallization for i...
- Patent number 11,948,874
- Issue date Apr 2, 2024
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 11,950,356
- Issue date Apr 2, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for circuit interconnects
- Patent number 11,937,368
- Issue date Mar 19, 2024
- OpenLight Photonics, Inc.
- Christopher Paul Wyland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate and a manufacturing method of the multilayer s...
- Patent number 11,923,123
- Issue date Mar 5, 2024
- Murata Manufacturing Co., Ltd.
- Kazutaka Muraoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package structure
- Patent number 11,895,780
- Issue date Feb 6, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Creating inductors, resistors, capacitors and other structures in p...
- Patent number 11,864,327
- Issue date Jan 2, 2024
- International Business Machines Corporation
- Gerald Bartley
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Sn—Bi and copper powder conductive paste in through hole of insulat...
- Patent number 11,864,317
- Issue date Jan 2, 2024
- Nichia Corporation
- Masaaki Katsumata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rogowski coil integrated in glass substrate
- Patent number 11,856,711
- Issue date Dec 26, 2023
- Infineon Technologies Austria AG
- Alexander Breymesser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 11,798,932
- Issue date Oct 24, 2023
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Right angle sidewall and button interconnects for molded SiPs
- Patent number 11,765,838
- Issue date Sep 19, 2023
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE TRANSPARENT WIRING BOARD AND METHOD FOR MANUFACTURING FLEX...
- Publication number 20250056728
- Publication date Feb 13, 2025
- NIPPON MEKTRON, LTD.
- Akihiro NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEXTILE CONDUCTIVE BUS AND METHOD OF MAKING THE SAME
- Publication number 20250048550
- Publication date Feb 6, 2025
- The Charles Stark Draper Laboratory, Inc.
- William A. ROY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20250046694
- Publication date Feb 6, 2025
- Innolux Corporation
- Ying-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20250048562
- Publication date Feb 6, 2025
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
A PRINTED CIRCUIT BOARD ARRANGEMENT AND WAVEGUIDE INTERFACE ARRANGE...
- Publication number 20250040046
- Publication date Jan 30, 2025
- Telefonaktiebolaget LM Ericsson (publ)
- Klas ERIKSSON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE INCLUDING METAL MATERIALS WITH DIFFERENT TH...
- Publication number 20250040036
- Publication date Jan 30, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- LI-CHUN HUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FUNCTIONAL SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20250029938
- Publication date Jan 23, 2025
- BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Yifan WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20250024602
- Publication date Jan 16, 2025
- Amphenol Corporation
- Marc B. Cartier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250008652
- Publication date Jan 2, 2025
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS SUBSTRATE, THROUGH-ELECTRODE, MULTILAYER WIRING SUBSTRATE, AN...
- Publication number 20240431027
- Publication date Dec 26, 2024
- TOPPAN Holdings Inc.
- Yuki UMEMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CURABLE RESIN COMPOSITION AND PROCESS FOR PRODUCING PRINTED WIRING...
- Publication number 20240417586
- Publication date Dec 19, 2024
- TAIYO HOLDINGS CO., LTD.
- Yasuyo KANAZAWA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
- Publication number 20240422896
- Publication date Dec 19, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Chulmun Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER THIN-FILM FPCB AND HEATER
- Publication number 20240414852
- Publication date Dec 12, 2024
- Seoul National University R&DB Foundation
- Seung Hwan KO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTRA-PAIR SKEW COMPENSATION OF DIFFERENTIAL SIGNALS
- Publication number 20240407093
- Publication date Dec 5, 2024
- Achronix Semiconductor Corporation
- Hansel Desmond Dsilva
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OFFSET VOIDING SCHEME FOR VERTICAL INTERCONNECTS
- Publication number 20240397610
- Publication date Nov 28, 2024
- Intel Corporation
- Aik Hong Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240389231
- Publication date Nov 21, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING THEREOF
- Publication number 20240357730
- Publication date Oct 24, 2024
- Harman Becker Automotive Systems GmbH
- Paul-Alexandru BILIGA-NISIPEANU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE MULTILA...
- Publication number 20240349427
- Publication date Oct 17, 2024
- TOPPAN Holdings Inc.
- Takehisa TAKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240341033
- Publication date Oct 10, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier Method of Manufacturing the Component Carrier and...
- Publication number 20240334617
- Publication date Oct 3, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Hans PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SPLIT PAD WITH TEST LINE
- Publication number 20240304503
- Publication date Sep 12, 2024
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTUING ELECTRONIC DEVICES
- Publication number 20240292547
- Publication date Aug 29, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Shaun Bowers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC-BASED CIRCUIT BOARD ASSEMBLIES FORMED USING METAL NANOPARTI...
- Publication number 20240292531
- Publication date Aug 29, 2024
- Kuprion Inc.
- Alfred A. ZINN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, MANUFACTURING METHOD, AND DISPLAY MODULE
- Publication number 20240284608
- Publication date Aug 22, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Gang Yuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240268038
- Publication date Aug 8, 2024
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED MAGNETIC COMPONENT DEVICE INCLUDING VENTED CHANNELS AND MU...
- Publication number 20240260196
- Publication date Aug 1, 2024
- Murata Manufacturing Co., Ltd.
- Scott Andrew PARISH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARYING DIAMETERS OF POWER-VIAS IN A PCB BASED ON VIA LOCATION
- Publication number 20240260188
- Publication date Aug 1, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- Brian Mark Hostetler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CIRCUIT BOARD ASSEMBLIES
- Publication number 20240251507
- Publication date Jul 25, 2024
- Simmonds Precision Products, Inc.
- Jeffrey Ewanchuk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR MANUFACTURING ELECTRICAL COMPONENTS USING E...
- Publication number 20240240347
- Publication date Jul 18, 2024
- FABRIC8LABS, INC.
- David Pain
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
VERTICALLY SPACED INTRA-LEVEL INTERCONNECT LINE METALLIZATION FOR I...
- Publication number 20240243052
- Publication date Jul 18, 2024
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS

Through-connections or via connections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Embeddable electrically insulating thermal connector and circuit bo...

Wiring substrate and method for manufacturing wiring substrate

Capacitive compensation for vertical interconnect accesses

Electronic device

Method for making printed wiring board, printed wiring board, and a...

Light board, method for manufacturing the same, and LED backlight m...

Transparent antenna and manufacturing method thereof

Jig for via-hole processing, via-hole processing device, and via-ho...

Offset interposers for large-bottom packages and large-die package-...

Camera module and manufacturing method thereof

Printed circuit board and method for manufacturing the same

Low profile phased array

Radio frequency front-end module, manufacturing method thereof and...

Ceramic-based circuit board assemblies formed using metal nanoparti...

Wiring substrate and method for manufacturing wiring substrate

Circuit board

Laminated circuit board

Offset interposers for large-bottom packages and large-die package-...

Systems and methods for manufacturing electrical components using e...

Method for manufacturing transparent circuit board

Vertically spaced intra-level interconnect line metallization for i...

Mating backplane for high speed, high density electrical connector

Structure for circuit interconnects

Multilayer substrate and a manufacturing method of the multilayer s...

Manufacturing method of package structure

Creating inductors, resistors, capacitors and other structures in p...

Sn—Bi and copper powder conductive paste in through hole of insulat...

Rogowski coil integrated in glass substrate

Offset interposers for large-bottom packages and large-die package-...

Right angle sidewall and button interconnects for molded SiPs

Patents Applicationslast 30 patents

FLEXIBLE TRANSPARENT WIRING BOARD AND METHOD FOR MANUFACTURING FLEX...

TEXTILE CONDUCTIVE BUS AND METHOD OF MAKING THE SAME

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

WIRING SUBSTRATE

A PRINTED CIRCUIT BOARD ARRANGEMENT AND WAVEGUIDE INTERFACE ARRANGE...

CIRCUIT BOARD STRUCTURE INCLUDING METAL MATERIALS WITH DIFFERENT TH...

FUNCTIONAL SUBSTRATE AND METHOD FOR MANUFACTURING SAME

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

PRINTED WIRING BOARD

GLASS SUBSTRATE, THROUGH-ELECTRODE, MULTILAYER WIRING SUBSTRATE, AN...

CURABLE RESIN COMPOSITION AND PROCESS FOR PRODUCING PRINTED WIRING...

CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD

METHOD FOR MANUFACTURING MULTILAYER THIN-FILM FPCB AND HEATER

INTRA-PAIR SKEW COMPENSATION OF DIFFERENTIAL SIGNALS

OFFSET VOIDING SCHEME FOR VERTICAL INTERCONNECTS

PRINTED WIRING BOARD

PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING THEREOF

MULTILAYER WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE MULTILA...

WIRING SUBSTRATE

Component Carrier Method of Manufacturing the Component Carrier and...

SPLIT PAD WITH TEST LINE

ELECTRONIC DEVICES AND METHODS OF MANUFACTUING ELECTRONIC DEVICES

CERAMIC-BASED CIRCUIT BOARD ASSEMBLIES FORMED USING METAL NANOPARTI...

CIRCUIT BOARD, MANUFACTURING METHOD, AND DISPLAY MODULE

PRINTED WIRING BOARD

EMBEDDED MAGNETIC COMPONENT DEVICE INCLUDING VENTED CHANNELS AND MU...

VARYING DIAMETERS OF POWER-VIAS IN A PCB BASED ON VIA LOCATION

ELECTRICAL CIRCUIT BOARD ASSEMBLIES

SYSTEMS AND METHODS FOR MANUFACTURING ELECTRICAL COMPONENTS USING E...

VERTICALLY SPACED INTRA-LEVEL INTERCONNECT LINE METALLIZATION FOR I...