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H05K3/4038
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H
ELECTRICITY
H05
Electric techniques
H05K
PRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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Apparatus or processes for manufacturing printed circuits
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H05K3/4038
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Patents Grants
last 30 patents
Information
Patent Grant
Laminated circuit board
Patent number
11,985,768
Issue date
May 14, 2024
Pi-Crystal Incorporation
Junichi Takeya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Offset interposers for large-bottom packages and large-die package-...
Patent number
11,978,730
Issue date
May 7, 2024
Intel Corporation
Russell K. Mortensen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems and methods for manufacturing electrical components using e...
Patent number
11,970,783
Issue date
Apr 30, 2024
FABRIC8LABS, INC.
David Pain
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Method for manufacturing transparent circuit board
Patent number
11,950,371
Issue date
Apr 2, 2024
HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
Cheng-Jia Li
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Vertically spaced intra-level interconnect line metallization for i...
Patent number
11,948,874
Issue date
Apr 2, 2024
Intel Corporation
Kevin L. Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mating backplane for high speed, high density electrical connector
Patent number
11,950,356
Issue date
Apr 2, 2024
Amphenol Corporation
Mark W. Gailus
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure for circuit interconnects
Patent number
11,937,368
Issue date
Mar 19, 2024
OpenLight Photonics, Inc.
Christopher Paul Wyland
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayer substrate and a manufacturing method of the multilayer s...
Patent number
11,923,123
Issue date
Mar 5, 2024
Murata Manufacturing Co., Ltd.
Kazutaka Muraoka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of package structure
Patent number
11,895,780
Issue date
Feb 6, 2024
Unimicron Technology Corp.
Kai-Ming Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Creating inductors, resistors, capacitors and other structures in p...
Patent number
11,864,327
Issue date
Jan 2, 2024
International Business Machines Corporation
Gerald Bartley
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Grant
Sn—Bi and copper powder conductive paste in through hole of insulat...
Patent number
11,864,317
Issue date
Jan 2, 2024
Nichia Corporation
Masaaki Katsumata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Rogowski coil integrated in glass substrate
Patent number
11,856,711
Issue date
Dec 26, 2023
Infineon Technologies Austria AG
Alexander Breymesser
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Offset interposers for large-bottom packages and large-die package-...
Patent number
11,798,932
Issue date
Oct 24, 2023
Intel Corporation
Russell K. Mortensen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Right angle sidewall and button interconnects for molded SiPs
Patent number
11,765,838
Issue date
Sep 19, 2023
Apple Inc.
Bilal Mohamed Ibrahim Kani
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Sealed package and method of forming same
Patent number
11,744,518
Issue date
Sep 5, 2023
Medtronic, Inc.
David A Ruben
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Grant
Interconnect structure having conductor extending along dielectric...
Patent number
11,737,205
Issue date
Aug 22, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Jiun-Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Resistive PCB traces for improved stability
Patent number
11,723,149
Issue date
Aug 8, 2023
Kioxia Corporation
Stephen Pardoe
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Circuit carrier, package, and method for manufacturing a package
Patent number
11,723,155
Issue date
Aug 8, 2023
Siemens Aktiengesellschaft
Stefan Pfefferlein
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Embedded module
Patent number
11,696,400
Issue date
Jul 4, 2023
RISING TECHNOLOGIES CO., LTD.
Shuzo Akejima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Manufacturing method of carrier structure
Patent number
11,690,180
Issue date
Jun 27, 2023
Unimicron Technology Corp.
Tzyy-Jang Tseng
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Methods and systems for detecting defects in devices using X-rays
Patent number
11,688,067
Issue date
Jun 27, 2023
Bruker Nano, Inc.
David Lewis Adler
G01 - MEASURING TESTING
Information
Patent Grant
Inspection method of printed wiring board
Patent number
11,683,891
Issue date
Jun 20, 2023
Ibiden Co., Ltd.
Yasuhiro Kawai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Acousto-optic modulator system and device with connections and rela...
Patent number
11,662,612
Issue date
May 30, 2023
Eagle Technology, LLC
Peter A. Wasilousky
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Methods and systems for printed circuit board design based on autom...
Patent number
11,662,479
Issue date
May 30, 2023
Bruker Nano, Inc.
David Lewis Adler
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Circuit board structure and manufacturing method thereof
Patent number
11,665,832
Issue date
May 30, 2023
Unimicron Technology Corp.
John Hon-Shing Lau
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Oxide liner stress buffer
Patent number
11,659,660
Issue date
May 23, 2023
Raytheon Company
Christine Frandsen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and systems for manufacturing printed circuit board based o...
Patent number
11,651,492
Issue date
May 16, 2023
Bruker Nano, Inc.
David Lewis Adler
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Microelectronic package with substrate-integrated components
Patent number
11,641,711
Issue date
May 2, 2023
Intel Corporation
Georgios Dogiamis
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Lithographically defined vertical interconnect access (VIA) in diel...
Patent number
11,640,934
Issue date
May 2, 2023
Intel Corporation
Meizi Jiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing embedded circuit board, embedded circuit b...
Patent number
11,632,861
Issue date
Apr 18, 2023
SHENNAN CIRCUITS CO., LTD.
Lixiang Huang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
FILLING CRACKS ON A SUBSTRATE VIA
Publication number
20240155767
Publication date
May 9, 2024
Micron Technology, Inc.
Quang Nguyen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
Publication number
20240138076
Publication date
Apr 25, 2024
IBIDEN CO., LTD.
Ikuya TERAUCHI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC DEVICE
Publication number
20240114619
Publication date
Apr 4, 2024
InnoLux Corporation
Cheng-Chi WANG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
POWER VIA RESONANCE SUPPRESSION
Publication number
20240098898
Publication date
Mar 21, 2024
HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Melvin Kent Benedict
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CAMERA MODULE AND MANUFACTURING METHOD THEREOF
Publication number
20240089571
Publication date
Mar 14, 2024
TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
KUEI-FENG PENG
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
SYSTEM AND METHOD TO ELIMINATE VIA STRIPING
Publication number
20240080978
Publication date
Mar 7, 2024
Dell Products L.P.
Sandor FARKAS
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SUBSTRATES WITH CONTINUOUS SLOT VIAS
Publication number
20240074055
Publication date
Feb 29, 2024
Micron Technology, Inc.
Walter L. Moden
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME
Publication number
20240057267
Publication date
Feb 15, 2024
Samsung Electro-Mechanics Co., Ltd.
Soo Yun KIM
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD MANUFACTURING SYSTEM AND METHOD
Publication number
20240057260
Publication date
Feb 15, 2024
UFab Corporation
Tyler Richards
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Probe Card and Method of Manufacturing Thereof
Publication number
20240044941
Publication date
Feb 8, 2024
Nippon Telegraph and Telephone Corporation
Ai Yanagihara
G01 - MEASURING TESTING
Information
Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
Publication number
20240040699
Publication date
Feb 1, 2024
Murata Manufacturing Co., Ltd.
Hiromitsu ITO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Battery Management System
Publication number
20240014678
Publication date
Jan 11, 2024
Holding Zero, LLC
Derek Simkowiak
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Application
METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD
Publication number
20240014047
Publication date
Jan 11, 2024
TOPPAN INC.
Yuki UMEMURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
VERTICAL INTERCONNECT DESIGN FOR IMPROVED ELECTRICAL PERFORMANCE
Publication number
20240008177
Publication date
Jan 4, 2024
Intel Corporation
Jackson Chung Peng KONG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MODULAR POWER ELECTRONICS CONVERTERS WITH ENHANCED CONNECTIVITY REL...
Publication number
20240008182
Publication date
Jan 4, 2024
University of Maryland, College Park
YONGWAN PARK
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
Publication number
20240006401
Publication date
Jan 4, 2024
Intel Corporation
Russell K. MORTENSEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATES HAVING ADHESION PROMOTOR LAYERS AND RELATED METHODS
Publication number
20240006285
Publication date
Jan 4, 2024
The Intel Corporation
Yi Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE
Publication number
20230413438
Publication date
Dec 21, 2023
Samsung Electronics Co., Ltd.
Peiyu CHEN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD
Publication number
20230413425
Publication date
Dec 21, 2023
LG Innotek Co., Ltd.
Myung Jae KWON
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC DEVICE COMPRISING SEALING MEMBER
Publication number
20230413427
Publication date
Dec 21, 2023
Samsung Electronics Co., Ltd.
Seongki JEONG
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE WIRING CIRCUIT BOARD
Publication number
20230413431
Publication date
Dec 21, 2023
Nitto Denko Corporation
Takahiro IKEDA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC PACKAGE WITH THROUGH-MOLD CONNECTIONS AND RELATED ELECTR...
Publication number
20230402338
Publication date
Dec 14, 2023
Skyworks Solutions, Inc.
Anthony James LoBianco
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HEAT DISSIPATION STRUCTURE OF PRINTED CIRCUIT BOARD, MANUFACTURING...
Publication number
20230371166
Publication date
Nov 16, 2023
HL KLEMOVE CORP.
Jihoon HAN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC...
Publication number
20230354503
Publication date
Nov 2, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Jiun-Yi WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIFFERENTIAL VIA DESIGN ON A PRINTED CIRCUIT BOARD
Publication number
20230345634
Publication date
Oct 26, 2023
Dell Products L.P.
Chang-Kai Chu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC DEVICE CAPABLE OF SUPPRESSING HIGH GROUND IMPEDANCE, AND...
Publication number
20230309214
Publication date
Sep 28, 2023
Canon Kabushiki Kaisha
SHUICHI NAKAMURA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD
Publication number
20230309244
Publication date
Sep 28, 2023
IBIDEN CO., LTD.
Atsushi ISHIDA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC DEVICE HAVING MULTILAYERED SUBSTRATE AND MANUFACTURING M...
Publication number
20230300984
Publication date
Sep 21, 2023
Samsung Electronics Co., Ltd.
Seungjin LEE
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
RADIO FREQUENCY FRONT-END MODULE, MANUFACTURING METHOD THEREOF AND...
Publication number
20230292438
Publication date
Sep 14, 2023
Shenzhen Newsonic Technologies Co., Ltd.
Guojun WENG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
QUASI-HELICAL ANTENNAS AND ASSOCIATED MANUFACTURING METHODS
Publication number
20230291113
Publication date
Sep 14, 2023
ELECTRONIC DESIGN & DEVELOPMENT, CORP.
Kevin W. Patrick
H01 - BASIC ELECTRIC ELEMENTS