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B81B2207/095

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B2207/00Micro-structural systems or auxiliary parts thereof

Current Industry

B81B2207/095through the lid

Industries

Patents Grantslast 30 patents

Information Patent Grant
Device for supporting MEMS and/or ASIC components
- Patent number 12,116,270
- Issue date Oct 15, 2024
- TE CONNECTIVITY SOLUTIONS GmbH
- Ismael Brunner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging of microfluidic devices and microfluidic integrated syste...
- Patent number 11,926,522
- Issue date Mar 12, 2024
- Corporation for National Research Initiatives
- Michael A. Huff
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
IR emitter with glass lid
- Patent number 11,926,521
- Issue date Mar 12, 2024
- Infineon Technologies AG
- Stephan Pindl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electrical contacting and method for producing an electrical contac...
- Patent number 11,897,758
- Issue date Feb 13, 2024
- Robert Bosch GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical system (MEMS) sensor packages and methods fo...
- Patent number 11,851,322
- Issue date Dec 26, 2023
- Infineon Technologies AG
- Rainer Markus Schaller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS pressure sensor
- Patent number 11,579,033
- Issue date Feb 14, 2023
- MEI Micro, Inc.
- Robert Mark Boysel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integration of stress decoupling and particle filter on a single wa...
- Patent number 11,505,450
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Florian Brandl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetic conductive feedthroughs for a semiconductor wafer
- Patent number 11,485,670
- Issue date Nov 1, 2022
- Medtronic, Inc.
- David A. Ruben
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging structure and packaging method for retinal prosthesis imp...
- Patent number 11,478,654
- Issue date Oct 25, 2022
- HANGZHOU NANOCHAP ELECTRONICS CO., LTD.
- Jiawei Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged pressure sensor device
- Patent number 11,427,464
- Issue date Aug 30, 2022
- NXP USA, INC.
- Weng Foong Yap
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,427,466
- Issue date Aug 30, 2022
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Component with a thin-layer covering and method for its production
- Patent number 11,296,673
- Issue date Apr 5, 2022
- Snaptrack, Inc.
- Thomas Metzger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS devices and methods of forming same
- Patent number 11,180,365
- Issue date Nov 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Chih Liang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device packages and methods of manufacturing the same
- Patent number 11,174,157
- Issue date Nov 16, 2021
- Advanced Semiconductor Engineering Inc.
- Chi Sheng Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Full symmetric multi-throw switch using conformal pinched through via
- Patent number 11,148,935
- Issue date Oct 19, 2021
- Menlo Microsystems, Inc.
- Xu Zhu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical device, method for manufacturing a microelec...
- Patent number 11,078,072
- Issue date Aug 3, 2021
- Infineon Technologies Dresden GmbH & Co. KG
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level integrated MEMS device enabled by silicon pillar and sm...
- Patent number 10,961,118
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Chia Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device and method for producing same
- Patent number 10,934,161
- Issue date Mar 2, 2021
- Murata Manufacturing Co., Ltd.
- Masakazu Fukumitsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level integrated MEMS device enabled by silicon pillar and sm...
- Patent number 10,899,608
- Issue date Jan 26, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Chia Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integration of stress decoupling and particle filter on a single wa...
- Patent number 10,899,604
- Issue date Jan 26, 2021
- Infineon Technologies AG
- Florian Brandl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Through silicon interposer wafer and method of manufacturing the same
- Patent number 10,882,737
- Issue date Jan 5, 2021
- Agency for Science, Technology and Research
- Navab Singh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for forming micro-electro-mechanical system (MEMS) structure
- Patent number 10,865,100
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Fung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged pressure sensor device
- Patent number 10,822,224
- Issue date Nov 3, 2020
- NXP USA, INC.
- Weng Foong Yap
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor
- Patent number 10,816,422
- Issue date Oct 27, 2020
- Invensense, Inc.
- Chung-Hsien Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level encapsulation for MEMS device
- Patent number 10,793,421
- Issue date Oct 6, 2020
- VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.
- Natarajan Rajasekaran
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS pressure sensor
- Patent number 10,768,065
- Issue date Sep 8, 2020
- MEI Micro, Inc.
- Robert Mark Boysel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS package
- Patent number 10,745,269
- Issue date Aug 18, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Nick Renaud-Bezot
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Waterproof MEMS chip package structure
- Patent number 10,696,543
- Issue date Jun 30, 2020
- Lingsen Precision Industries, Ltd.
- Chiung-Yueh Tien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical device, method for manufacturing a microelec...
- Patent number 10,683,203
- Issue date Jun 16, 2020
- Infineon Technologies Dresden GmbH
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS component having a high integration density
- Patent number 10,680,159
- Issue date Jun 9, 2020
- Snaptrack, Inc.
- Thomas Metzger
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MEMS SWITCH UTILIZING CONDUCTIVE BARRIER LAYER
- Publication number 20240409397
- Publication date Dec 12, 2024
- Menlo Microsystems, Inc.
- Christopher F. Keimel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE
- Publication number 20240174511
- Publication date May 30, 2024
- Murata Manufacturing Co., Ltd.
- Masakazu FUKUMITSU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR SEALING A MEMS DEVICE AND A SEALED MEMS DEVICE
- Publication number 20240116753
- Publication date Apr 11, 2024
- Murata Manufacturing Co., Ltd.
- Antti IIHOLA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PRESSURE SENSOR
- Publication number 20230417614
- Publication date Dec 28, 2023
- MEI Micro, Inc.
- Robert Mark Boysel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR
- Publication number 20230077493
- Publication date Mar 16, 2023
- Kabushiki Kaisha Toshiba
- Ping WANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Device for Supporting MEMS and/or ASIC Components
- Publication number 20220250902
- Publication date Aug 11, 2022
- TE Connectivity Solutions GmbH
- Ismael Brunner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSOR AND PACKAGING METHOD THEREOF
- Publication number 20220178773
- Publication date Jun 9, 2022
- FATRI UNITED TESTING & CONTROL (QUANZHOU) TECHNOLOGIES CO., LTD.
- Yongzhong NIE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Full Symmetric Multi-Throw Switch Using Conformal Pinched Through Via
- Publication number 20210403317
- Publication date Dec 30, 2021
- Xu Zhu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
RESONANCE DEVICE AND RESONANCE DEVICE MANUFACTURING METHOD
- Publication number 20210371273
- Publication date Dec 2, 2021
- Murata Manufacturing Co., Ltd.
- Masakazu Fukumitsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR PACKAGES AND METHODS FOR PRODUCING SENSOR PACKAGES
- Publication number 20210300749
- Publication date Sep 30, 2021
- INFINEON TECHNOLOGIES AG
- Rainer Markus SCHALLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRICAL CONTACTING AND METHOD FOR PRODUCING AN ELECTRICAL CONTAC...
- Publication number 20210261404
- Publication date Aug 26, 2021
- ROBERT BOSCH GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
IR Emitter with Glass Lid
- Publication number 20210246016
- Publication date Aug 12, 2021
- INFINEON TECHNOLOGIES AG
- Stephan Pindl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PRESSURE SENSOR
- Publication number 20210156756
- Publication date May 27, 2021
- MEI Micro, Inc.
- Robert Mark Boysel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATION OF STRESS DECOUPLING AND PARTICLE FILTER ON A SINGLE WA...
- Publication number 20210032097
- Publication date Feb 4, 2021
- INFINEON TECHNOLOGIES AG
- Florian BRANDL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210017018
- Publication date Jan 21, 2021
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGED PRESSURE SENSOR DEVICE
- Publication number 20210009405
- Publication date Jan 14, 2021
- NXP USA, Inc.
- Weng Foong YAP
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING FOR A MEMS TRANSDUCER
- Publication number 20200369514
- Publication date Nov 26, 2020
- Cirrus Logic International Semiconductor Ltd.
- Roberto BRIOSCHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD FOR RETINAL PROSTHESIS IMP...
- Publication number 20200353268
- Publication date Nov 12, 2020
- HANGZHOU NANOCHAP ELECTRONICS CO., LTD.
- Jiawei YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATION OF STRESS DECOUPLING AND PARTICLE FILTER ON A SINGLE WA...
- Publication number 20200331748
- Publication date Oct 22, 2020
- INFINEON TECHNOLOGIES AG
- Florian BRANDL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL DEVICE, METHOD FOR MANUFACTURING A MICROELE...
- Publication number 20200290867
- Publication date Sep 17, 2020
- Infineon Technologies Dresden GmbH & Co. KG
- Thoralf KAUTZSCH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Full Symmetric Multi-Throw Switch Using Conformal Pinched Through Via
- Publication number 20200270120
- Publication date Aug 27, 2020
- Xu Zhu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PRESSURE SENSOR
- Publication number 20200232860
- Publication date Jul 23, 2020
- Motion Engine, Inc.
- Robert Mark Boysel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Devices and Methods of Forming Same
- Publication number 20200062588
- Publication date Feb 27, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Chih Liang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETIC CONDUCTIVE FEEDTHROUGHS FOR A SEMICONDUCTOR WAFER
- Publication number 20200062633
- Publication date Feb 27, 2020
- Medtronic, Inc.
- David A. RUBEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL INTEGRATED MEMS DEVICE ENABLED BY SILICON PILLAR AND SM...
- Publication number 20200024136
- Publication date Jan 23, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Chia Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL INTEGRATED MEMS DEVICE ENABLED BY SILICON PILLAR AND SM...
- Publication number 20200024137
- Publication date Jan 23, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Chia Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20200002162
- Publication date Jan 2, 2020
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng TSENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FORMING MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) STRUCTURE
- Publication number 20190315620
- Publication date Oct 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Fung CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICE PACKAGING
- Publication number 20190169022
- Publication date Jun 6, 2019
- KNOWLES ELECTRONICS, LLC
- Tony K. Lim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL INTEGRATED MEMS DEVICE ENABLED BY SILICON PILLAR AND SM...
- Publication number 20190161346
- Publication date May 30, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Chia Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY

through the lid

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Device for supporting MEMS and/or ASIC components

Packaging of microfluidic devices and microfluidic integrated syste...

IR emitter with glass lid

Electrical contacting and method for producing an electrical contac...

Microelectromechanical system (MEMS) sensor packages and methods fo...

MEMS pressure sensor

Integration of stress decoupling and particle filter on a single wa...

Hermetic conductive feedthroughs for a semiconductor wafer

Packaging structure and packaging method for retinal prosthesis imp...

Packaged pressure sensor device

Semiconductor package structure and method for manufacturing the same

Component with a thin-layer covering and method for its production

MEMS devices and methods of forming same

Semiconductor device packages and methods of manufacturing the same

Full symmetric multi-throw switch using conformal pinched through via

Microelectromechanical device, method for manufacturing a microelec...

Wafer level integrated MEMS device enabled by silicon pillar and sm...

MEMS device and method for producing same

Wafer level integrated MEMS device enabled by silicon pillar and sm...

Integration of stress decoupling and particle filter on a single wa...

Through silicon interposer wafer and method of manufacturing the same

Method for forming micro-electro-mechanical system (MEMS) structure

Packaged pressure sensor device

Pressure sensor

Wafer level encapsulation for MEMS device

MEMS pressure sensor

MEMS package

Waterproof MEMS chip package structure

Microelectromechanical device, method for manufacturing a microelec...

MEMS component having a high integration density

Patents Applicationslast 30 patents

MEMS SWITCH UTILIZING CONDUCTIVE BARRIER LAYER

MEMS DEVICE

METHOD FOR SEALING A MEMS DEVICE AND A SEALED MEMS DEVICE

MEMS PRESSURE SENSOR

SENSOR

Device for Supporting MEMS and/or ASIC Components

PRESSURE SENSOR AND PACKAGING METHOD THEREOF

Full Symmetric Multi-Throw Switch Using Conformal Pinched Through Via

RESONANCE DEVICE AND RESONANCE DEVICE MANUFACTURING METHOD

SENSOR PACKAGES AND METHODS FOR PRODUCING SENSOR PACKAGES

ELECTRICAL CONTACTING AND METHOD FOR PRODUCING AN ELECTRICAL CONTAC...

IR Emitter with Glass Lid

MEMS PRESSURE SENSOR

INTEGRATION OF STRESS DECOUPLING AND PARTICLE FILTER ON A SINGLE WA...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

PACKAGED PRESSURE SENSOR DEVICE

PACKAGING FOR A MEMS TRANSDUCER

PACKAGING STRUCTURE AND PACKAGING METHOD FOR RETINAL PROSTHESIS IMP...

INTEGRATION OF STRESS DECOUPLING AND PARTICLE FILTER ON A SINGLE WA...

MICROELECTROMECHANICAL DEVICE, METHOD FOR MANUFACTURING A MICROELE...

Full Symmetric Multi-Throw Switch Using Conformal Pinched Through Via

MEMS PRESSURE SENSOR

MEMS Devices and Methods of Forming Same

HERMETIC CONDUCTIVE FEEDTHROUGHS FOR A SEMICONDUCTOR WAFER

WAFER LEVEL INTEGRATED MEMS DEVICE ENABLED BY SILICON PILLAR AND SM...

WAFER LEVEL INTEGRATED MEMS DEVICE ENABLED BY SILICON PILLAR AND SM...

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME

METHOD FOR FORMING MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) STRUCTURE

MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICE PACKAGING

WAFER LEVEL INTEGRATED MEMS DEVICE ENABLED BY SILICON PILLAR AND SM...