Tin (Sn) as principal constituent

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/45111Tin (Sn) as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and inspection device
- Patent number 12,040,303
- Issue date Jul 16, 2024
- Kabushiki Kaisha Toshiba
- Mitsuaki Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,998,295
- Issue date May 4, 2021
- Denso Corporation
- Hiromasa Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,840,208
- Issue date Nov 17, 2020
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,737,356
- Issue date Aug 11, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device having cobalt coated aluminum contact pads
- Patent number 10,714,439
- Issue date Jul 14, 2020
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 10,672,696
- Issue date Jun 2, 2020
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,610,976
- Issue date Apr 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,525,555
- Issue date Jan 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,414,002
- Issue date Sep 17, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tooling for coupling multiple electronic chips
- Patent number 10,340,239
- Issue date Jul 2, 2019
- Cufer Asset Ltd. L.L.C.
- Roger Dugas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 10,269,733
- Issue date Apr 23, 2019
- Realtek Semiconductor Corp.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,137,534
- Issue date Nov 27, 2018
- Nippon Micrometal Corporation
- Takashi Yamada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Package systems including passive electrical components
- Patent number 9,660,532
- Issue date May 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Alan Roth
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Anti-fuse on and/or in package
- Patent number 9,613,910
- Issue date Apr 4, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- An-Jhih Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package systems including passive electrical components
- Patent number 9,530,761
- Issue date Dec 27, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Alan Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable wire method
- Patent number 9,245,670
- Issue date Jan 26, 2016
- Tessera, Inc.
- Cyprian Uzoh
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Processes and structures for IC fabrication
- Patent number 9,224,641
- Issue date Dec 29, 2015
- Jayna Sheats
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Apparatus with a multi-layer coating and method of forming the same
- Patent number 9,055,700
- Issue date Jun 9, 2015
- Semblant Limited
- Mark Robson Humphries
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power/ground layout for chips
- Patent number 8,946,890
- Issue date Feb 3, 2015
- Marvell World Trade Ltd.
- Sehat Sutardja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes and structures for IC fabrication
- Patent number 8,928,118
- Issue date Jan 6, 2015
- Jayna Sheats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to fabricate integrated circuits by assembling components
- Patent number 8,889,482
- Issue date Nov 18, 2014
- Jayna Sheats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a method for manufacturing a chip package
- Patent number 8,815,647
- Issue date Aug 26, 2014
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for interconnecting bonding pads between components
- Patent number 8,759,713
- Issue date Jun 24, 2014
- Terepac Corporation
- Jayna Sheats
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Reliable wire structure and method
- Patent number 8,692,118
- Issue date Apr 8, 2014
- Tessera, Inc.
- Cyprian Uzoh
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Thermoelectric application for waste heat recovery from semiconduct...
- Patent number 8,552,283
- Issue date Oct 8, 2013
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Ercan Mehmet Dede
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Processes and structures for beveled slope integrated circuits for...
- Patent number 8,513,110
- Issue date Aug 20, 2013
- Jayna Sheats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device, method for manufacturing the same, and backl...
- Patent number 8,476,662
- Issue date Jul 2, 2013
- LG Innotek Co., Ltd
- Dong Wook Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes and structures for IC fabrication
- Patent number 8,387,238
- Issue date Mar 5, 2013
- Jayna Sheats
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Pre-formed conductive bumps on bonding pads
- Patent number 8,319,353
- Issue date Nov 27, 2012
- Marvell International Ltd.
- Shiann-Ming Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes and structures for IC fabrication
- Patent number 8,153,517
- Issue date Apr 10, 2012
- TEREPAC Corporation
- Jayna Sheats
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240347499
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Hongjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED TRACE SUBSTRATE ASSEMBLIES, AND RELATED MICROELECTRONIC DE...
- Publication number 20240079305
- Publication date Mar 7, 2024
- Micron Technology, Inc.
- Bong Woo Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240023346
- Publication date Jan 18, 2024
- Samsung Electronics Co., Ltd.
- Younghun CHEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND INSPECTION DEVICE
- Publication number 20210296279
- Publication date Sep 23, 2021
- Kabushiki Kaisha Toshiba
- Mitsuaki KATO
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190221549
- Publication date Jul 18, 2019
- DENSO CORPORATION
- Hiromasa HAYASHI
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20190157197
- Publication date May 23, 2019
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE HAVING COATED CONTACT PADS
- Publication number 20190109104
- Publication date Apr 11, 2019
- TEXAS INSTRUMENTS INCORPORATED
- NAZILLA DADVAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20180133843
- Publication date May 17, 2018
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS
- Publication number 20180033754
- Publication date Feb 1, 2018
- Cufer Asset Ltd. L.L.C.
- Roger Dugas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20170365576
- Publication date Dec 21, 2017
- NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
- Tetsuya OYAMADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20170216974
- Publication date Aug 3, 2017
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
PACKAGE SYSTEMS INCLUDING PASSIVE ELECTRICAL COMPONENTS
- Publication number 20170063236
- Publication date Mar 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Alan ROTH
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
RELIABLE WIRE STRUCTURE AND METHOD
- Publication number 20140157592
- Publication date Jun 12, 2014
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140061669
- Publication date Mar 6, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processes and structures for IC fabrication
- Publication number 20130193561
- Publication date Aug 1, 2013
- TEREPAC CORPORATION
- Jayna Sheats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SYSTEMS INCLUDING PASSIVE ELECTRICAL COMPONENTS
- Publication number 20130058049
- Publication date Mar 7, 2013
- TAIWAN SEMICONDUCOTR MANUFACTURING COMPANY, LTD.
- Alan ROTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE WIRE STRUCTURE AND METHOD
- Publication number 20120325517
- Publication date Dec 27, 2012
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER/GROUND LAYOUT FOR CHIPS
- Publication number 20120098127
- Publication date Apr 26, 2012
- Sehat Sutardja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus with a Multi-Layer Coating and Method of Forming the Same
- Publication number 20110253429
- Publication date Oct 20, 2011
- Semblant Global Limited
- Mark Robson Humphries
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING DEVICE, METHOD FOR MANUFACTURING THE SAME, AND BACKL...
- Publication number 20110194273
- Publication date Aug 11, 2011
- Dong Wook Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC APPLICATION FOR WASTE HEAT RECOVERY FROM SEMICONDUCT...
- Publication number 20110168223
- Publication date Jul 14, 2011
- Toyota Motor Engin, & Manufact. N.A. (TEMA)
- Ercan Mehmet DEDE
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Processes and structures for IC fabrication
- Publication number 20100313413
- Publication date Dec 16, 2010
- TEREPAC
- Jayna Sheats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processes and structures for IC fabrication
- Publication number 20100314734
- Publication date Dec 16, 2010
- TEREPAC
- Jayna Sheats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processes and structures for IC fabrication
- Publication number 20100314718
- Publication date Dec 16, 2010
- TEREPAC
- Jayna Sheats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processes and structures for IC fabrication
- Publication number 20100314719
- Publication date Dec 16, 2010
- TEREPAC
- Jayna Sheats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processes and structures for IC fabrication
- Publication number 20100314735
- Publication date Dec 16, 2010
- TEREPAC
- Jayna Sheats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processes and structures for IC fabrication
- Publication number 20100314751
- Publication date Dec 16, 2010
- TEREPAC
- Jayna Sheats
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Processes and structures for IC fabrication
- Publication number 20100313414
- Publication date Dec 16, 2010
- TEREPAC
- Jayna Sheats
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20100295180
- Publication date Nov 25, 2010
- GREAT TEAM BACKEND FOUNDRY INC.
- CHING HSING TZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20100072619
- Publication date Mar 25, 2010
- GREAT TEAM BACKEND FOUNDRY, INC.
- Chung Hsing Tzu
- H01 - BASIC ELECTRIC ELEMENTS

Tin (Sn) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and inspection device

Semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Electronic device having cobalt coated aluminum contact pads

Semiconductor device package

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Tooling for coupling multiple electronic chips

Integrated circuit device

Bonding wire for semiconductor device

Package systems including passive electrical components

Anti-fuse on and/or in package

Package systems including passive electrical components

Reliable wire method

Processes and structures for IC fabrication

Apparatus with a multi-layer coating and method of forming the same

Power/ground layout for chips

Processes and structures for IC fabrication

Methods to fabricate integrated circuits by assembling components

Chip package and a method for manufacturing a chip package

Methods for interconnecting bonding pads between components

Reliable wire structure and method

Thermoelectric application for waste heat recovery from semiconduct...

Processes and structures for beveled slope integrated circuits for...

Light emitting device, method for manufacturing the same, and backl...

Processes and structures for IC fabrication

Pre-formed conductive bumps on bonding pads

Processes and structures for IC fabrication

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

EMBEDDED TRACE SUBSTRATE ASSEMBLIES, AND RELATED MICROELECTRONIC DE...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND INSPECTION DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE PACKAGE

ELECTRONIC DEVICE HAVING COATED CONTACT PADS

BONDING WIRE FOR SEMICONDUCTOR DEVICE

TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS

BONDING WIRE FOR SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICE

PACKAGE SYSTEMS INCLUDING PASSIVE ELECTRICAL COMPONENTS

RELIABLE WIRE STRUCTURE AND METHOD

CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE

Processes and structures for IC fabrication

PACKAGE SYSTEMS INCLUDING PASSIVE ELECTRICAL COMPONENTS

RELIABLE WIRE STRUCTURE AND METHOD

POWER/GROUND LAYOUT FOR CHIPS

Apparatus with a Multi-Layer Coating and Method of Forming the Same

LIGHT EMITTING DEVICE, METHOD FOR MANUFACTURING THE SAME, AND BACKL...

THERMOELECTRIC APPLICATION FOR WASTE HEAT RECOVERY FROM SEMICONDUCT...

Processes and structures for IC fabrication

Processes and structures for IC fabrication

Processes and structures for IC fabrication

Processes and structures for IC fabrication

Processes and structures for IC fabrication

Processes and structures for IC fabrication

Processes and structures for IC fabrication

WIRE BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF

WIRE BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF