Tin [Sn] as principal constituent

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H01L2224/83411

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83411Tin [Sn] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for electrically contacting a component by galvanic connecti...
- Patent number 11,037,862
- Issue date Jun 15, 2021
- Siemens Aktiengesellschaft
- Hubert Baueregger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for creating a bond between objects based on f...
- Patent number 10,923,454
- Issue date Feb 16, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Line-integrated switch and method for producing a line-integrated s...
- Patent number 10,840,207
- Issue date Nov 17, 2020
- Auto-Kabel Management GmbH
- Simon Betscher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and the method to fabricate thereof
- Patent number 10,636,735
- Issue date Apr 28, 2020
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming PIP with inner known goo...
- Patent number RE47923
- Issue date Mar 31, 2020
- STATS ChipPAC Pte. Ltd.
- Zigmund R. Camacho
Information Patent Grant
Process of forming semiconductor apparatus mounting on substrate
- Patent number 10,446,510
- Issue date Oct 15, 2019
- Sumitomo Electric Device Innovations, Inc.
- Masaomi Emori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sinterable bonding material and semiconductor device using the same
- Patent number 10,446,518
- Issue date Oct 15, 2019
- Henkel AG & Co. KGaA
- Hajime Inoue
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Micro-bonding structure and method of forming the same
- Patent number 10,388,627
- Issue date Aug 20, 2019
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and light emitting module
- Patent number 10,297,716
- Issue date May 21, 2019
- LG Innotek Co., Ltd
- Shuhei Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-transfer printing with volatile adhesive layer
- Patent number 10,157,880
- Issue date Dec 18, 2018
- X-CELEPRINT LIMITED
- Salvatore Bonafede
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sinterable bonding material and semiconductor device using the same
- Patent number 10,141,283
- Issue date Nov 27, 2018
- Henkel AG & Co. KGaA
- Hajime Inoue
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Die bonding to a board
- Patent number 10,115,716
- Issue date Oct 30, 2018
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic particle paste, cured product using same, and semiconducto...
- Patent number 10,086,478
- Issue date Oct 2, 2018
- Kabushiki Kaisha Toshiba
- Daisuke Hiratsuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frames with wettable flanks
- Patent number 9,966,326
- Issue date May 8, 2018
- Unisem (M) Berhad
- Maria Cristina T. Santillan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct die solder of gallium arsenide integrated circuit dies and m...
- Patent number 9,530,719
- Issue date Dec 27, 2016
- Skyworks Solutions, Inc.
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame construct for lead-free solder connections
- Patent number 9,520,347
- Issue date Dec 13, 2016
- Honeywell International Inc.
- Jianxing Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate warpage control using external frame stiffener
- Patent number 9,355,966
- Issue date May 31, 2016
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Adam Gallegos
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring board and printed wiring board
- Patent number 9,185,806
- Issue date Nov 10, 2015
- Ibiden Co., Ltd.
- Fumitaka Takagi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure and the method to manufacture thereof
- Patent number 9,171,818
- Issue date Oct 27, 2015
- Cyntec Co., Ltd.
- Da-Jung Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Power semiconductor module
- Patent number 9,129,949
- Issue date Sep 8, 2015
- Mitsubishi Electric Corporation
- Shinsuke Asada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joint structure for substrates and methods of forming
- Patent number 9,082,763
- Issue date Jul 14, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming the same
- Patent number 8,945,990
- Issue date Feb 3, 2015
- Infineon Technologies AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming PIP with inner known goo...
- Patent number 8,884,418
- Issue date Nov 11, 2014
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a method for manufacturing a chip package
- Patent number 8,841,768
- Issue date Sep 23, 2014
- Infineon Technologies AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting semiconductor element bonded to a base by a silver c...
- Patent number 8,836,130
- Issue date Sep 16, 2014
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package substrate
- Patent number 8,736,077
- Issue date May 27, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jong Man Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding with metal germanium silicon material
- Patent number 8,592,926
- Issue date Nov 26, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of forming PiP with inner known goo...
- Patent number 8,283,209
- Issue date Oct 9, 2012
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding with metal germanium silicon material
- Patent number 8,058,143
- Issue date Nov 15, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Mountable integrated circuit package-in-package system
- Patent number 7,977,779
- Issue date Jul 12, 2011
- Stats Chippac Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...
- Publication number 20210167035
- Publication date Jun 3, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING APPARATUS AND DIE BONDING METHOD
- Publication number 20200243477
- Publication date Jul 30, 2020
- FURUKAWA ELECTRIC CO., LTD.
- Teruyuki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Line-integrated switch and method for producing a line-integrated s...
- Publication number 20190172811
- Publication date Jun 6, 2019
- AUTO-KABEL MANAGEMENT GMBH
- Simon Betscher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING TO A BOARD
- Publication number 20190013308
- Publication date Jan 10, 2019
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS OF FORMING SEMICONDUCTOR APPARATUS MOUNTING ON SUBSTRATE
- Publication number 20180240765
- Publication date Aug 23, 2018
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Masaomi Emori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-TRANSFER PRINTING WITH VOLATILE ADHESIVE LAYER
- Publication number 20180096964
- Publication date Apr 5, 2018
- X-Celeprint Limited
- Salvatore Bonafede
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING APPARATUS AND DIE BONDING METHOD
- Publication number 20170365578
- Publication date Dec 21, 2017
- FURUKAWA ELECTRIC CO., LTD.
- Teruyuki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING PIP WITH INNER KNOWN GOO...
- Publication number 20140284788
- Publication date Sep 25, 2014
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT BONDING METHOD
- Publication number 20140263581
- Publication date Sep 18, 2014
- ALPHA DESIGN CO., LTD.
- Toshiyuki SHIRATORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING METHOD AND DIE BONDING STRUCTURE OF LIGHT EMITTING DIOD...
- Publication number 20140175495
- Publication date Jun 26, 2014
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODES AND METHODS OF FABRICATING THE SAME
- Publication number 20140124799
- Publication date May 8, 2014
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Doo Hyeb YOUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD
- Publication number 20140090877
- Publication date Apr 3, 2014
- IBIDEN CO., LTD.
- Fumitaka TAKAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE STABILIZATION POST
- Publication number 20140084482
- Publication date Mar 27, 2014
- LUXVUE TECHNOLOGY CORPORATION
- Hsin-Hua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTED STRUCTURE
- Publication number 20140048942
- Publication date Feb 20, 2014
- Taichi Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140021610
- Publication date Jan 23, 2014
- INFINEON TECHNOLOGIES AG
- Carsten VON KOBLINSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BONDING MATERIAL, METHOD OF MANUFACTURING THE SAME, AND...
- Publication number 20130313309
- Publication date Nov 28, 2013
- Masayuki KITAJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20130277813
- Publication date Oct 24, 2013
- INFINEON TECHNOLOGIES AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Joint Structure for Substrates and Methods of Forming
- Publication number 20130241083
- Publication date Sep 19, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20130221516
- Publication date Aug 29, 2013
- MITSUBISHI ELECTRIC CORPORATION
- Shinsuke Asada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMIZATION OF COPPER PLATING THROUGH WAFER VIA
- Publication number 20130193575
- Publication date Aug 1, 2013
- SKYWORKS SOLUTIONS, INC.
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND THE METHOD TO MANUFACTURE THEREOF
- Publication number 20130146341
- Publication date Jun 13, 2013
- CYNTEC CO., LTD.
- DA-JUNG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND THE METHOD TO FABRICATE THEREOF
- Publication number 20130093069
- Publication date Apr 18, 2013
- CYNTEC CO., LTD.
- BAU-RU LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE
- Publication number 20130037967
- Publication date Feb 14, 2013
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jong Man KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming PIP with Inner Known Goo...
- Publication number 20120326302
- Publication date Dec 27, 2012
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20120153486
- Publication date Jun 21, 2012
- Nichia Corporation.
- Masafumi KURAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL
- Publication number 20120068325
- Publication date Mar 22, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Method of Forming PIP with Inner Known Goo...
- Publication number 20110140263
- Publication date Jun 16, 2011
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING A PACKAGING SUBSTRATE AND AN ELECTRICAL...
- Publication number 20110115069
- Publication date May 19, 2011
- Serene Seoh Hian Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL
- Publication number 20100181676
- Publication date Jul 22, 2010
- RUBEN B. MONTEZ
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MOUNTABLE INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM
- Publication number 20090302452
- Publication date Dec 10, 2009
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS

Tin [Sn] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for electrically contacting a component by galvanic connecti...

Method and apparatus for creating a bond between objects based on f...

Line-integrated switch and method for producing a line-integrated s...

Package structure and the method to fabricate thereof

Semiconductor device and method of forming PIP with inner known goo...

Process of forming semiconductor apparatus mounting on substrate

Sinterable bonding material and semiconductor device using the same

Micro-bonding structure and method of forming the same

Light emitting device and light emitting module

Micro-transfer printing with volatile adhesive layer

Sinterable bonding material and semiconductor device using the same

Die bonding to a board

Metallic particle paste, cured product using same, and semiconducto...

Lead frames with wettable flanks

Direct die solder of gallium arsenide integrated circuit dies and m...

Lead frame construct for lead-free solder connections

Substrate warpage control using external frame stiffener

Method for manufacturing printed wiring board and printed wiring board

Package structure and the method to manufacture thereof

Power semiconductor module

Joint structure for substrates and methods of forming

Chip package and method of forming the same

Semiconductor device and method of forming PIP with inner known goo...

Chip package and a method for manufacturing a chip package

Light emitting semiconductor element bonded to a base by a silver c...

Semiconductor package substrate

Substrate bonding with metal germanium silicon material

Semiconductor device and method of forming PiP with inner known goo...

Substrate bonding with metal germanium silicon material

Mountable integrated circuit package-in-package system

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...

DIE BONDING APPARATUS AND DIE BONDING METHOD

Line-integrated switch and method for producing a line-integrated s...

DIE BONDING TO A BOARD

PROCESS OF FORMING SEMICONDUCTOR APPARATUS MOUNTING ON SUBSTRATE

MICRO-TRANSFER PRINTING WITH VOLATILE ADHESIVE LAYER

DIE BONDING APPARATUS AND DIE BONDING METHOD

SEMICONDUCTOR DEVICE AND METHOD OF FORMING PIP WITH INNER KNOWN GOO...

ELECTRONIC COMPONENT BONDING METHOD

DIE BONDING METHOD AND DIE BONDING STRUCTURE OF LIGHT EMITTING DIOD...

LIGHT EMITTING DIODES AND METHODS OF FABRICATING THE SAME

METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD

MICRO DEVICE STABILIZATION POST

MOUNTED STRUCTURE

CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE

CONDUCTIVE BONDING MATERIAL, METHOD OF MANUFACTURING THE SAME, AND...

CHIP PACKAGE AND METHOD OF FORMING THE SAME

Joint Structure for Substrates and Methods of Forming

POWER SEMICONDUCTOR MODULE

OPTIMIZATION OF COPPER PLATING THROUGH WAFER VIA

PACKAGE STRUCTURE AND THE METHOD TO MANUFACTURE THEREOF

PACKAGE STRUCTURE AND THE METHOD TO FABRICATE THEREOF

SEMICONDUCTOR PACKAGE SUBSTRATE

Semiconductor Device and Method of Forming PIP with Inner Known Goo...

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL

Semiconductor Device and Method of Forming PIP with Inner Known Goo...

ELECTRONIC DEVICE INCLUDING A PACKAGING SUBSTRATE AND AN ELECTRICAL...

SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL

MOUNTABLE INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM