Tin (Sn) as principal constituent

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H01L2224/48711

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48711Tin (Sn) as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package-on-package (PoP) structure including stud bulbs
- Patent number 10,510,731
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs
- Patent number 10,157,893
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on-package (PoP) structure including stud bulbs
- Patent number 9,812,427
- Issue date Nov 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic devices
- Patent number 9,640,506
- Issue date May 2, 2017
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package on-Package (PoP) structure including stud bulbs and method
- Patent number 9,502,394
- Issue date Nov 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,337,172
- Issue date May 10, 2016
- Panasonic Corporation
- Shigefumi Dohi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable package by using internal stacking modules
- Patent number 9,245,772
- Issue date Jan 26, 2016
- STATS ChipPAC, Ltd.
- JoungIn Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming the same
- Patent number 8,945,990
- Issue date Feb 3, 2015
- Infineon Technologies AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs and method
- Patent number 8,912,651
- Issue date Dec 16, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a method for manufacturing a chip package
- Patent number 8,815,647
- Issue date Aug 26, 2014
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a stacked structure
- Patent number 8,487,452
- Issue date Jul 16, 2013
- Samsung Electronics Co., Ltd.
- Jin-Yang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate having single patterned metal layer exposing patterned di...
- Patent number 8,367,473
- Issue date Feb 5, 2013
- Advanced Semiconductor Engineering, Inc.
- Shih-Fu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of providing common voltage bus and...
- Patent number 8,309,451
- Issue date Nov 13, 2012
- STATS ChipPAC, Ltd.
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded component substrate, semiconductor package structure using...
- Patent number 8,304,878
- Issue date Nov 6, 2012
- Advanced Semiconductor Engineering, Inc.
- Bernd Karl Appelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 8,156,643
- Issue date Apr 17, 2012
- Infineon Technologies AG
- Manfred Schneegans
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Arrangement for electrically connecting semiconductor circuit arran...
- Patent number 8,030,744
- Issue date Oct 4, 2011
- Infineon Technologies AG
- Thomas Laska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,911,061
- Issue date Mar 22, 2011
- Infineon Technologies AG
- Manfred Schneegans
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Partially patterned lead frames and methods of making and using the...
- Patent number 7,790,500
- Issue date Sep 7, 2010
- Unisem (Mauritius) Holdings Limited
- Mary Jean Ramos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement for electrically connecting semiconductor circuit arran...
- Patent number 7,709,938
- Issue date May 4, 2010
- Infineon Technologies AG
- Thomas Laska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-base circuit board and its manufacturing method
- Patent number 7,709,939
- Issue date May 4, 2010
- Denki Kagaku Kogyo Kabushiki Kaisha
- Naomi Yonemura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device including an insulating film and insulating pi...
- Patent number 7,675,183
- Issue date Mar 9, 2010
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved bonding
- Patent number 6,727,593
- Issue date Apr 27, 2004
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices having metallurgies containing copper-semiconduc...
- Patent number 5,855,993
- Issue date Jan 5, 1999
- International Business Machines Corporation
- Michael John Brady
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20190123027
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20180047709
- Publication date Feb 15, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIN-BASED WIREBOND STRUCTURES
- Publication number 20140367859
- Publication date Dec 18, 2014
- Burton J. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable Package by Using Internal Stacking Modules
- Publication number 20140319702
- Publication date Oct 30, 2014
- JoungIn Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICES
- Publication number 20140291850
- Publication date Oct 2, 2014
- STMicroelectronics S.r. I.
- Federico Giovanni ZIGLIOLI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
NITRIDE SEMICONDUCTOR DEVICE
- Publication number 20140103537
- Publication date Apr 17, 2014
- PANASONIC CORPORATION
- Kazuhiro KAIBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140061669
- Publication date Mar 6, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-In-Packages and Methods of Formation Thereof
- Publication number 20140001615
- Publication date Jan 2, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20130277813
- Publication date Oct 24, 2013
- INFINEON TECHNOLOGIES AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure and Method
- Publication number 20130134588
- Publication date May 30, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Providing Common Voltage Bus and...
- Publication number 20120261817
- Publication date Oct 18, 2012
- STATS ChipPAC, Ltd.
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip Semiconductor Packages and Assembly Thereof
- Publication number 20120074546
- Publication date Mar 29, 2012
- Chooi Mei Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INDUCTOR AND FLIP-CHIP
- Publication number 20120018892
- Publication date Jan 26, 2012
- MEHDI FREDERIK SOLTAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A STACKED STRUCTURE
- Publication number 20120001347
- Publication date Jan 5, 2012
- Samsung Electronics Co., Ltd.
- Jin-Yang LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COMPONENT SUBSTRATE, SEMICONDUCTOR PACKAGE STRUCTURE USING...
- Publication number 20110278713
- Publication date Nov 17, 2011
- Advanced Semiconductor Engineering, Inc.
- Bernd Karl Appelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110107595
- Publication date May 12, 2011
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Partially Patterned Lead Frames and Methods of Making and Using the...
- Publication number 20110057298
- Publication date Mar 10, 2011
- Mary Jean Ramos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable Package By Using Internal Stacking Modules
- Publication number 20110024890
- Publication date Feb 3, 2011
- STATS ChipPAC, Ltd.
- JoungIn YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HAVING SINGLE PATTERNED METAL LAYER EXPOSING PATTERNED DI...
- Publication number 20100314744
- Publication date Dec 16, 2010
- Shih-Fu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRANGEMENT FOR ELECTRICALLY CONNECTING SEMICONDUCTOR CIRCUIT ARRAN...
- Publication number 20100213613
- Publication date Aug 26, 2010
- INFINEON TECHNOLOGIES AG
- Thomas Laska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Providing Common Voltage Bus and...
- Publication number 20090032975
- Publication date Feb 5, 2009
- STATS ChipPAC, Ltd.
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20080315423
- Publication date Dec 25, 2008
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Partially patterned lead frames and methods of making and using the...
- Publication number 20080258278
- Publication date Oct 23, 2008
- Mary Jean Ramos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of semiconductor device
- Publication number 20080237863
- Publication date Oct 2, 2008
- Kabushiki Kaisha Tosiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderability Improvement Method for Leaded Semiconductor Package
- Publication number 20080006937
- Publication date Jan 10, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Akira Matsunami
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Metal-base circuit board and its manufacturing method
- Publication number 20070128772
- Publication date Jun 7, 2007
- DENKI KAGAKU KOGYO KABUSHIKI KAISHA
- Naomi Yonemura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Arrangement for electrically connecting semiconductor circuit arran...
- Publication number 20070001283
- Publication date Jan 4, 2007
- Thomas Laska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of semiconductor device
- Publication number 20060113674
- Publication date Jun 1, 2006
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for low pressure wirebond
- Publication number 20050098605
- Publication date May 12, 2005
- International Business Machines Corporation
- Daniel C. Edelstein
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Preplated leadframe without precious metal
- Publication number 20040183166
- Publication date Sep 23, 2004
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS

Tin (Sn) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package-on-package (PoP) structure including stud bulbs

Package-on-package (PoP) structure including stud bulbs

Package on-package (PoP) structure including stud bulbs

Method for manufacturing electronic devices

Package on-Package (PoP) structure including stud bulbs and method

Semiconductor device

Stackable package by using internal stacking modules

Chip package and method of forming the same

Package-on-package (PoP) structure including stud bulbs and method

Chip package and a method for manufacturing a chip package

Semiconductor package having a stacked structure

Substrate having single patterned metal layer exposing patterned di...

Semiconductor device and method of providing common voltage bus and...

Embedded component substrate, semiconductor package structure using...

Semiconductor device

Arrangement for electrically connecting semiconductor circuit arran...

Semiconductor device

Partially patterned lead frames and methods of making and using the...

Arrangement for electrically connecting semiconductor circuit arran...

Metal-base circuit board and its manufacturing method

Semiconductor device including an insulating film and insulating pi...

Semiconductor device with improved bonding

Electronic devices having metallurgies containing copper-semiconduc...

Patents Applicationslast 30 patents

Package-On-Package (PoP) Structure Including Stud Bulbs

Package-On-Package (PoP) Structure Including Stud Bulbs

TIN-BASED WIREBOND STRUCTURES

Stackable Package by Using Internal Stacking Modules

METHOD FOR MANUFACTURING ELECTRONIC DEVICES

NITRIDE SEMICONDUCTOR DEVICE

CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE

Package-In-Packages and Methods of Formation Thereof

CHIP PACKAGE AND METHOD OF FORMING THE SAME

Package-On-Package (PoP) Structure and Method

Semiconductor Device and Method of Providing Common Voltage Bus and...

Multi-chip Semiconductor Packages and Assembly Thereof

SEMICONDUCTOR DEVICE WITH INDUCTOR AND FLIP-CHIP

SEMICONDUCTOR PACKAGE HAVING A STACKED STRUCTURE

EMBEDDED COMPONENT SUBSTRATE, SEMICONDUCTOR PACKAGE STRUCTURE USING...

SEMICONDUCTOR DEVICE

Partially Patterned Lead Frames and Methods of Making and Using the...

Stackable Package By Using Internal Stacking Modules

SUBSTRATE HAVING SINGLE PATTERNED METAL LAYER EXPOSING PATTERNED DI...

ARRANGEMENT FOR ELECTRICALLY CONNECTING SEMICONDUCTOR CIRCUIT ARRAN...

Semiconductor Device and Method of Providing Common Voltage Bus and...

SEMICONDUCTOR DEVICE

Partially patterned lead frames and methods of making and using the...

Semiconductor device and manufacturing method of semiconductor device

Solderability Improvement Method for Leaded Semiconductor Package

Metal-base circuit board and its manufacturing method

Arrangement for electrically connecting semiconductor circuit arran...

Semiconductor device and manufacturing method of semiconductor device

Apparatus and method for low pressure wirebond

Preplated leadframe without precious metal