Tin [Sn] as principal constituent

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H01L2224/13311

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13311Tin [Sn] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 12,119,321
- Issue date Oct 15, 2024
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,996,401
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,640,958
- Issue date May 2, 2023
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 11,450,639
- Issue date Sep 20, 2022
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,004,838
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 10,910,335
- Issue date Feb 2, 2021
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flux, solder paste, and method for forming solder bump
- Patent number 10,836,000
- Issue date Nov 17, 2020
- Tamura Corporation
- Masanori Shibasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic element and electronic device comprising the same
- Patent number 10,825,787
- Issue date Nov 3, 2020
- Innolux Corporation
- Wei-Cheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Engineered polymer-based electronic materials
- Patent number 10,682,732
- Issue date Jun 16, 2020
- Alpha Assembly Solutions Inc.
- Ramakrishna Hosur Venkatagiriyappa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 10,622,325
- Issue date Apr 14, 2020
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal particle and articles formed therefrom
- Patent number 10,507,551
- Issue date Dec 17, 2019
- Napra Co., Ltd
- Shigenobu Sekine
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Metal particle and electroconductive paste formed therefrom
- Patent number 10,478,924
- Issue date Nov 19, 2019
- Napra Co., Ltd
- Shigenobu Sekine
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Resin fluxed solder paste, and mount structure
- Patent number 10,440,834
- Issue date Oct 8, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hirohisa Hino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive particle, and connection material, connection structure,...
- Patent number 10,412,838
- Issue date Sep 10, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Arata Kishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu core ball, solder paste, formed solder, Cu core column, and sold...
- Patent number 10,322,472
- Issue date Jun 18, 2019
- Senju Metal Industry Co., Ltd.
- Takahiro Hattori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Conductive connecting member and manufacturing method of same
- Patent number 10,177,079
- Issue date Jan 8, 2019
- Furukawa Electric Co., Ltd.
- Hideo Nishikubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 10,170,440
- Issue date Jan 1, 2019
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 10,068,887
- Issue date Sep 4, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal particles having intermetallic compound nano-composite struct...
- Patent number 10,016,848
- Issue date Jul 10, 2018
- Napra Co., Ltd
- Shigenobu Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste, joining method using the same and joined structure
- Patent number 10,010,980
- Issue date Jul 3, 2018
- MURATA MANUFACTURING CO., LTD.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetic intermetallic compound interconnect
- Patent number 9,847,308
- Issue date Dec 19, 2017
- Intel Corporation
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip bonding alloys
- Patent number 9,847,310
- Issue date Dec 19, 2017
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming pillar bumps on semiconductor wafers
- Patent number 9,831,201
- Issue date Nov 28, 2017
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip using top post-passivation technology and b...
- Patent number 9,612,615
- Issue date Apr 4, 2017
- QUALCOMM Incorporated
- Mou-Shiung Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Component built-in board and method of manufacturing the same, and...
- Patent number 9,591,767
- Issue date Mar 7, 2017
- Fujikura Ltd.
- Kazuhisa Itoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component-mounted structure, IC card and COF package
- Patent number 9,516,749
- Issue date Dec 6, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshiyuki Wada
- G02 - OPTICS
Information Patent Grant
Semiconductor device and method of making bumpless flipchip interco...
- Patent number 9,240,331
- Issue date Jan 19, 2016
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Junction and electrical connection
- Patent number 9,142,518
- Issue date Sep 22, 2015
- Napra Co., Ltd
- Shigenobu Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste, joining method using the same and joined structure
- Patent number 9,044,816
- Issue date Jun 2, 2015
- MURATA MANUFACTURING CO., LTD.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FLUX, SUBSTRATE AND MANUFACTURING METHOD, AND DEVICE
- Publication number 20240282737
- Publication date Aug 22, 2024
- BOE MLED TECHNOLOGY CO., LTD.
- Liang Sun
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN
- Publication number 20230253395
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN
- Publication number 20210249399
- Publication date Aug 12, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF
- Publication number 20190109111
- Publication date Apr 11, 2019
- EPISTAR CORPORATION
- Shih-An LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming the Same
- Publication number 20180374836
- Publication date Dec 27, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PARTICLE AND ELECTROCONDUCTIVE PASTE FORMED THEREFROM
- Publication number 20180311771
- Publication date Nov 1, 2018
- NAPRA CO., LTD.
- Shigenobu SEKINE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL PARTICLE AND ARTICLES FORMED THEREFROM
- Publication number 20180290243
- Publication date Oct 11, 2018
- NAPRA CO., LTD.
- Shigenobu SEKINE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE PARTICLE, AND CONNECTION MATERIAL, CONNECTION STRUCTURE,...
- Publication number 20170347463
- Publication date Nov 30, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- ARATA KISHI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METAL PARTICLE, PASTE, FORMED ARTICLE, AND LAMINATED ARTICLE
- Publication number 20170282302
- Publication date Oct 5, 2017
- NAPRA CO., LTD.
- Shigenobu SEKINE
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CHIP ARRANGEMENT, CHIP CARD ARRANGEMENT AND METHOD FOR MANUFACTURIN...
- Publication number 20140328032
- Publication date Nov 6, 2014
- INFINEON TECHNOLOGIES AG
- Frank Pueschner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND...
- Publication number 20140268574
- Publication date Sep 18, 2014
- FUJIKURA LTD.
- Kazuhisa Itoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making Bumpless Flipchip Interco...
- Publication number 20140175661
- Publication date Jun 26, 2014
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20140145327
- Publication date May 29, 2014
- Samsung Electronics Co., Ltd.
- Hyung-Jun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP QFN STRUCTURE USING ETCHED LEAD FRAME
- Publication number 20130001757
- Publication date Jan 3, 2013
- Tessera. Inc.
- Chok Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME
- Publication number 20130001775
- Publication date Jan 3, 2013
- Hideo Nishikubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor die having fine pitch electrical interconnects
- Publication number 20120248607
- Publication date Oct 4, 2012
- Vertical Circuits, Inc.
- Keith Lake Barrie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH PLANK STACK OF SEMICONDUCTOR DIES
- Publication number 20120211878
- Publication date Aug 23, 2012
- Oracle International Corporation
- Darko R. Popovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ASSEMBLING TWO INTEGRATED CIRCUITS AND CORRESPONDING STRU...
- Publication number 20120153475
- Publication date Jun 21, 2012
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Paste, Joining Method Using the Same and Joined Structure
- Publication number 20120156512
- Publication date Jun 21, 2012
- Murata Manufacturing Co., Ltd.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Optical display package and the method thereof
- Publication number 20070241435
- Publication date Oct 18, 2007
- Wintek Corporation
- Chih-Yuan Wang
- G02 - OPTICS
Information Patent Application
In-situ alloyed solders, articles made thereby, and processes of ma...
- Publication number 20050284918
- Publication date Dec 29, 2005
- Edward L. Martin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Tin [Sn] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and a method of manufacturing thereof

Packaged die and RDL with bonding structures therebetween

Packaged die and RDL with bonding structures therebetween

Semiconductor device and a method of manufacturing thereof

Sintering materials and attachment methods using same

Packaged die and RDL with bonding structures therebetween

Semiconductor device and a method of manufacturing thereof

Flux, solder paste, and method for forming solder bump

Electronic element and electronic device comprising the same

Engineered polymer-based electronic materials

Semiconductor device and a method of manufacturing thereof

Metal particle and articles formed therefrom

Metal particle and electroconductive paste formed therefrom

Resin fluxed solder paste, and mount structure

Conductive particle, and connection material, connection structure,...

Cu core ball, solder paste, formed solder, Cu core column, and sold...

Conductive connecting member and manufacturing method of same

Semiconductor device and a method of manufacturing thereof

Semiconductor packages and methods of forming the same

Metal particles having intermetallic compound nano-composite struct...

Solder paste, joining method using the same and joined structure

Magnetic intermetallic compound interconnect

Flip chip bonding alloys

Methods for forming pillar bumps on semiconductor wafers

Integrated circuit chip using top post-passivation technology and b...

Component built-in board and method of manufacturing the same, and...

Electronic component-mounted structure, IC card and COF package

Semiconductor device and method of making bumpless flipchip interco...

Junction and electrical connection

Solder paste, joining method using the same and joined structure

Patents Applicationslast 30 patents

FLUX, SUBSTRATE AND MANUFACTURING METHOD, AND DEVICE

PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN

PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF

Semiconductor Packages and Methods of Forming the Same

METAL PARTICLE AND ELECTROCONDUCTIVE PASTE FORMED THEREFROM

METAL PARTICLE AND ARTICLES FORMED THEREFROM

CONDUCTIVE PARTICLE, AND CONNECTION MATERIAL, CONNECTION STRUCTURE,...

METAL PARTICLE, PASTE, FORMED ARTICLE, AND LAMINATED ARTICLE

CHIP ARRANGEMENT, CHIP CARD ARRANGEMENT AND METHOD FOR MANUFACTURIN...

COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND...

Semiconductor Device and Method of Making Bumpless Flipchip Interco...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

FLIP-CHIP QFN STRUCTURE USING ETCHED LEAD FRAME

CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME

Semiconductor die having fine pitch electrical interconnects

CHIP PACKAGE WITH PLANK STACK OF SEMICONDUCTOR DIES

METHOD OF ASSEMBLING TWO INTEGRATED CIRCUITS AND CORRESPONDING STRU...

Solder Paste, Joining Method Using the Same and Joined Structure

Optical display package and the method thereof

In-situ alloyed solders, articles made thereby, and processes of ma...