Tin [Sn] as principal constituent

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H01L2224/13811

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13811Tin [Sn] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Structures for low temperature bonding using nanoparticles
- Patent number 12,027,487
- Issue date Jul 2, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for low temperature bonding using nanoparticles
- Patent number 11,973,056
- Issue date Apr 30, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 11,710,718
- Issue date Jul 25, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,892,246
- Issue date Jan 12, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,886,250
- Issue date Jan 5, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,535,626
- Issue date Jan 14, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of packaging semiconductor devices and packaged semiconduct...
- Patent number 9,806,062
- Issue date Oct 31, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized sealing of interconnect structures in small gaps
- Patent number 9,685,420
- Issue date Jun 20, 2017
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for low stress flip-chip assembly of fine-pitch semiconducto...
- Patent number 8,530,360
- Issue date Sep 10, 2013
- Texas Instruments Incorporated
- Abram M. Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroconductive bonding material, method for bonding conductor, a...
- Patent number 8,418,910
- Issue date Apr 16, 2013
- Fujitsu Limited
- Takatoyo Yamakami
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for low stress flip-chip assembly of fine-pitch semiconducto...
- Patent number 7,898,083
- Issue date Mar 1, 2011
- Texas Instruments Incorporated
- Abram M Castro
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20240312954
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230335531
- Publication date Oct 19, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230132060
- Publication date Apr 27, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures And Methods For Low Temperature Bonding Using Nanoparticles
- Publication number 20210225801
- Publication date Jul 22, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures And Methods For Low Temperature Bonding Using Nanoparticles
- Publication number 20200152598
- Publication date May 14, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCONDUCTIVE BONDING MATERIAL, METHOD FOR BONDING CONDUCTOR, A...
- Publication number 20120211549
- Publication date Aug 23, 2012
- Fujitsu Limited
- Takatoyo YAMAKAMI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Low Stress Flip-Chip Assembly of Fine-Pitch Semiconducto...
- Publication number 20110143502
- Publication date Jun 16, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Abram M. CASTRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW STRESS FLIP-CHIP ASSEMBLY OF FINE-PITCH SEMICONDUCTO...
- Publication number 20100148374
- Publication date Jun 17, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Abram M. CASTRO
- H01 - BASIC ELECTRIC ELEMENTS

Tin [Sn] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Structures for low temperature bonding using nanoparticles

Methods for low temperature bonding using nanoparticles

Structures and methods for low temperature bonding using nanoparticles

Structures and methods for low temperature bonding using nanoparticles

Structures and methods for low temperature bonding using nanoparticles

Structures and methods for low temperature bonding using nanoparticles

Methods of packaging semiconductor devices and packaged semiconduct...

Localized sealing of interconnect structures in small gaps

Method for low stress flip-chip assembly of fine-pitch semiconducto...

Electroconductive bonding material, method for bonding conductor, a...

Method for low stress flip-chip assembly of fine-pitch semiconducto...

Patents Applicationslast 30 patents

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

Structures And Methods For Low Temperature Bonding Using Nanoparticles

Structures And Methods For Low Temperature Bonding Using Nanoparticles

ELECTROCONDUCTIVE BONDING MATERIAL, METHOD FOR BONDING CONDUCTOR, A...

Method for Low Stress Flip-Chip Assembly of Fine-Pitch Semiconducto...

METHOD FOR LOW STRESS FLIP-CHIP ASSEMBLY OF FINE-PITCH SEMICONDUCTO...