Tin (Sn) as principal constituent

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H01L2224/48611

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48611Tin (Sn) as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier systems with control interface and bias circuit
- Patent number 11,451,199
- Issue date Sep 20, 2022
- Skyworks Solutions, Inc.
- David Steven Ripley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including transistor with grading and semic...
- Patent number 10,771,024
- Issue date Sep 8, 2020
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs
- Patent number 10,510,731
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs
- Patent number 10,157,893
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules with bonding pads and related systems, devi...
- Patent number 10,090,812
- Issue date Oct 2, 2018
- Skyworks Solutions, Inc.
- Hardik Bhupendra Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component support and semiconductor device
- Patent number 10,068,821
- Issue date Sep 4, 2018
- Nichia Corporation
- Takeaki Shirase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules with power amplifier and transmission line...
- Patent number 9,887,668
- Issue date Feb 6, 2018
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power amplifier modules with harmonic termination circuit and relat...
- Patent number 9,847,755
- Issue date Dec 19, 2017
- Skyworks Solutions, Inc.
- Weimin Sun
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Package on-package (PoP) structure including stud bulbs
- Patent number 9,812,427
- Issue date Nov 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including tantalum nitride terminated throu...
- Patent number 9,755,592
- Issue date Sep 5, 2017
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power amplifier modules with bifet and harmonic termination and rel...
- Patent number 9,692,357
- Issue date Jun 27, 2017
- Skyworks Solutions, Inc.
- Dinhphuoc Vu Hoang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power amplifier modules including wire bond pad and related systems...
- Patent number 9,660,584
- Issue date May 23, 2017
- Skyworks Solutions, Inc.
- Hardik Bhupendra Modi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for manufacturing electronic devices
- Patent number 9,640,506
- Issue date May 2, 2017
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Power amplifier modules including bipolar transistor with grading a...
- Patent number 9,520,835
- Issue date Dec 13, 2016
- Skyworks Solutions, Inc.
- Tin Myint Ko
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Package on-Package (PoP) structure including stud bulbs and method
- Patent number 9,502,394
- Issue date Nov 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including bipolar transistor with grading a...
- Patent number 9,490,751
- Issue date Nov 8, 2016
- Skyworks Solutions, Inc.
- Tin Myint Ko
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,437,478
- Issue date Sep 6, 2016
- Xintec Inc.
- Yen-Shih Ho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip package
- Patent number 9,425,134
- Issue date Aug 23, 2016
- Xintec Inc.
- Yen-Shih Ho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,355,975
- Issue date May 31, 2016
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,337,172
- Issue date May 10, 2016
- Panasonic Corporation
- Shigefumi Dohi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of forming an etch-back type semiconductor pac...
- Patent number 9,305,868
- Issue date Apr 5, 2016
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable package by using internal stacking modules
- Patent number 9,245,772
- Issue date Jan 26, 2016
- STATS ChipPAC, Ltd.
- JoungIn Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming the same
- Patent number 8,945,990
- Issue date Feb 3, 2015
- Infineon Technologies AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs and method
- Patent number 8,912,651
- Issue date Dec 16, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a method for manufacturing a chip package
- Patent number 8,815,647
- Issue date Aug 26, 2014
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a stacked structure
- Patent number 8,487,452
- Issue date Jul 16, 2013
- Samsung Electronics Co., Ltd.
- Jin-Yang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate having single patterned metal layer exposing patterned di...
- Patent number 8,367,473
- Issue date Feb 5, 2013
- Advanced Semiconductor Engineering, Inc.
- Shih-Fu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming Fo-WLCSP having conducti...
- Patent number 8,343,810
- Issue date Jan 1, 2013
- STATS ChipPAC, Ltd.
- JiHoon Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of providing common voltage bus and...
- Patent number 8,309,451
- Issue date Nov 13, 2012
- STATS ChipPAC, Ltd.
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20190123027
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20180047709
- Publication date Feb 15, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER MODULES WITH BONDING PADS AND RELATED SYSTEMS, DEVI...
- Publication number 20170257070
- Publication date Sep 7, 2017
- SKYWORKS SOLUTIONS, INC.
- Hardik Bhupendra Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIN-BASED WIREBOND STRUCTURES
- Publication number 20140367859
- Publication date Dec 18, 2014
- Burton J. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140332983
- Publication date Nov 13, 2014
- Yen-Shih HO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140332969
- Publication date Nov 13, 2014
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20140332968
- Publication date Nov 13, 2014
- Yen-Shih HO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140332908
- Publication date Nov 13, 2014
- Yen-Shih HO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Stackable Package by Using Internal Stacking Modules
- Publication number 20140319702
- Publication date Oct 30, 2014
- JoungIn Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICES
- Publication number 20140291850
- Publication date Oct 2, 2014
- STMicroelectronics S.r. I.
- Federico Giovanni ZIGLIOLI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
NITRIDE SEMICONDUCTOR DEVICE
- Publication number 20140103537
- Publication date Apr 17, 2014
- PANASONIC CORPORATION
- Kazuhiro KAIBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140061669
- Publication date Mar 6, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT SUPPORT AND SEMICONDUCTOR DEVICE
- Publication number 20140021595
- Publication date Jan 23, 2014
- Takeaki SHIRASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-In-Packages and Methods of Formation Thereof
- Publication number 20140001615
- Publication date Jan 2, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER MODULES INCLUDING RELATED SYSTEMS, DEVICES, AND MET...
- Publication number 20140002188
- Publication date Jan 2, 2014
- SKYWORKS SOLUTIONS, INC.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20130277813
- Publication date Oct 24, 2013
- INFINEON TECHNOLOGIES AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Joint Structure for Substrates and Methods of Forming
- Publication number 20130241083
- Publication date Sep 19, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure and Method
- Publication number 20130134588
- Publication date May 30, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming FO-WLCSP Having Conducti...
- Publication number 20130075919
- Publication date Mar 28, 2013
- STATS ChipPAC, Ltd.
- JiHoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Providing Common Voltage Bus and...
- Publication number 20120261817
- Publication date Oct 18, 2012
- STATS ChipPAC, Ltd.
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip Semiconductor Packages and Assembly Thereof
- Publication number 20120074546
- Publication date Mar 29, 2012
- Chooi Mei Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming FO-WLCSP Having Conducti...
- Publication number 20120038053
- Publication date Feb 16, 2012
- STATS ChipPAC, Ltd.
- JiHoon Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE WITH INDUCTOR AND FLIP-CHIP
- Publication number 20120018892
- Publication date Jan 26, 2012
- MEHDI FREDERIK SOLTAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A STACKED STRUCTURE
- Publication number 20120001347
- Publication date Jan 5, 2012
- Samsung Electronics Co., Ltd.
- Jin-Yang LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE MOLDED CHIP SCALE PACKAGE
- Publication number 20120001322
- Publication date Jan 5, 2012
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COMPONENT SUBSTRATE, SEMICONDUCTOR PACKAGE STRUCTURE USING...
- Publication number 20110278713
- Publication date Nov 17, 2011
- Advanced Semiconductor Engineering, Inc.
- Bernd Karl Appelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ETCH-BACK TYPE SEMICONDUCTOR PACKAGE, SUBSTRATE AND MANUFACTURING M...
- Publication number 20110267789
- Publication date Nov 3, 2011
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110107595
- Publication date May 12, 2011
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable Package By Using Internal Stacking Modules
- Publication number 20110024890
- Publication date Feb 3, 2011
- STATS ChipPAC, Ltd.
- JoungIn YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HAVING SINGLE PATTERNED METAL LAYER EXPOSING PATTERNED DI...
- Publication number 20100314744
- Publication date Dec 16, 2010
- Shih-Fu Huang
- H01 - BASIC ELECTRIC ELEMENTS

Tin (Sn) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power amplifier modules including semiconductor resistor and tantal...

Power amplifier systems with control interface and bias circuit

Power amplifier modules including transistor with grading and semic...

Package-on-package (PoP) structure including stud bulbs

Package-on-package (PoP) structure including stud bulbs

Power amplifier modules with bonding pads and related systems, devi...

Semiconductor component support and semiconductor device

Power amplifier modules with power amplifier and transmission line...

Power amplifier modules with harmonic termination circuit and relat...

Package on-package (PoP) structure including stud bulbs

Power amplifier modules including tantalum nitride terminated throu...

Power amplifier modules with bifet and harmonic termination and rel...

Power amplifier modules including wire bond pad and related systems...

Method for manufacturing electronic devices

Power amplifier modules including bipolar transistor with grading a...

Package on-Package (PoP) structure including stud bulbs and method

Power amplifier modules including bipolar transistor with grading a...

Chip package and method for forming the same

Chip package

Chip package and method for forming the same

Semiconductor device

Manufacturing method of forming an etch-back type semiconductor pac...

Stackable package by using internal stacking modules

Chip package and method of forming the same

Package-on-package (PoP) structure including stud bulbs and method

Chip package and a method for manufacturing a chip package

Semiconductor package having a stacked structure

Substrate having single patterned metal layer exposing patterned di...

Semiconductor device and method of forming Fo-WLCSP having conducti...

Semiconductor device and method of providing common voltage bus and...

Patents Applicationslast 30 patents

Package-On-Package (PoP) Structure Including Stud Bulbs

Package-On-Package (PoP) Structure Including Stud Bulbs

POWER AMPLIFIER MODULES WITH BONDING PADS AND RELATED SYSTEMS, DEVI...

TIN-BASED WIREBOND STRUCTURES

STACKED CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

Stackable Package by Using Internal Stacking Modules

METHOD FOR MANUFACTURING ELECTRONIC DEVICES

NITRIDE SEMICONDUCTOR DEVICE

CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE

SEMICONDUCTOR COMPONENT SUPPORT AND SEMICONDUCTOR DEVICE

Package-In-Packages and Methods of Formation Thereof

POWER AMPLIFIER MODULES INCLUDING RELATED SYSTEMS, DEVICES, AND MET...

CHIP PACKAGE AND METHOD OF FORMING THE SAME

Joint Structure for Substrates and Methods of Forming

Package-On-Package (PoP) Structure and Method

Semiconductor Device and Method of Forming FO-WLCSP Having Conducti...

Semiconductor Device and Method of Providing Common Voltage Bus and...

Multi-chip Semiconductor Packages and Assembly Thereof

Semiconductor Device and Method of Forming FO-WLCSP Having Conducti...

SEMICONDUCTOR DEVICE WITH INDUCTOR AND FLIP-CHIP

SEMICONDUCTOR PACKAGE HAVING A STACKED STRUCTURE

DOUBLE MOLDED CHIP SCALE PACKAGE

EMBEDDED COMPONENT SUBSTRATE, SEMICONDUCTOR PACKAGE STRUCTURE USING...

ETCH-BACK TYPE SEMICONDUCTOR PACKAGE, SUBSTRATE AND MANUFACTURING M...

SEMICONDUCTOR DEVICE

Stackable Package By Using Internal Stacking Modules

SUBSTRATE HAVING SINGLE PATTERNED METAL LAYER EXPOSING PATTERNED DI...