Tin (Sn) as principal constituent

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H01L2224/48811

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48811Tin (Sn) as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier systems with control interface and bias circuit
- Patent number 11,451,199
- Issue date Sep 20, 2022
- Skyworks Solutions, Inc.
- David Steven Ripley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including transistor with grading and semic...
- Patent number 10,771,024
- Issue date Sep 8, 2020
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs
- Patent number 10,510,731
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming an embedded SoP fan-out...
- Patent number 10,217,702
- Issue date Feb 26, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs
- Patent number 10,157,893
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules with bonding pads and related systems, devi...
- Patent number 10,090,812
- Issue date Oct 2, 2018
- Skyworks Solutions, Inc.
- Hardik Bhupendra Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules with power amplifier and transmission line...
- Patent number 9,887,668
- Issue date Feb 6, 2018
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power amplifier modules with harmonic termination circuit and relat...
- Patent number 9,847,755
- Issue date Dec 19, 2017
- Skyworks Solutions, Inc.
- Weimin Sun
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Package on-package (PoP) structure including stud bulbs
- Patent number 9,812,427
- Issue date Nov 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including tantalum nitride terminated throu...
- Patent number 9,755,592
- Issue date Sep 5, 2017
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power amplifier modules with bifet and harmonic termination and rel...
- Patent number 9,692,357
- Issue date Jun 27, 2017
- Skyworks Solutions, Inc.
- Dinhphuoc Vu Hoang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power amplifier modules including wire bond pad and related systems...
- Patent number 9,660,584
- Issue date May 23, 2017
- Skyworks Solutions, Inc.
- Hardik Bhupendra Modi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for manufacturing electronic devices
- Patent number 9,640,506
- Issue date May 2, 2017
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Power amplifier modules including bipolar transistor with grading a...
- Patent number 9,520,835
- Issue date Dec 13, 2016
- Skyworks Solutions, Inc.
- Tin Myint Ko
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Package on-Package (PoP) structure including stud bulbs and method
- Patent number 9,502,394
- Issue date Nov 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including bipolar transistor with grading a...
- Patent number 9,490,751
- Issue date Nov 8, 2016
- Skyworks Solutions, Inc.
- Tin Myint Ko
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device and method of forming an embedded SOP fan-out...
- Patent number 9,385,006
- Issue date Jul 5, 2016
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,337,172
- Issue date May 10, 2016
- Panasonic Corporation
- Shigefumi Dohi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming the same
- Patent number 8,945,990
- Issue date Feb 3, 2015
- Infineon Technologies AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs and method
- Patent number 8,912,651
- Issue date Dec 16, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a method for manufacturing a chip package
- Patent number 8,815,647
- Issue date Aug 26, 2014
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device, method for manufacturing the same, and backl...
- Patent number 8,476,662
- Issue date Jul 2, 2013
- LG Innotek Co., Ltd
- Dong Wook Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate having single patterned metal layer exposing patterned di...
- Patent number 8,367,473
- Issue date Feb 5, 2013
- Advanced Semiconductor Engineering, Inc.
- Shih-Fu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded component substrate, semiconductor package structure using...
- Patent number 8,304,878
- Issue date Nov 6, 2012
- Advanced Semiconductor Engineering, Inc.
- Bernd Karl Appelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Partially patterned lead frames and methods of making and using the...
- Patent number 7,790,500
- Issue date Sep 7, 2010
- Unisem (Mauritius) Holdings Limited
- Mary Jean Ramos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including an insulating film and insulating pi...
- Patent number 7,675,183
- Issue date Mar 9, 2010
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved bonding
- Patent number 6,727,593
- Issue date Apr 27, 2004
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pads for integrated circuits having copper interconnect met...
- Patent number 6,329,722
- Issue date Dec 11, 2001
- Texas Instruments Incorporated
- Wei-Yan Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices having metallurgies containing copper-semiconduc...
- Patent number 5,855,993
- Issue date Jan 5, 1999
- International Business Machines Corporation
- Michael John Brady
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20190123027
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20180047709
- Publication date Feb 15, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER MODULES WITH BONDING PADS AND RELATED SYSTEMS, DEVI...
- Publication number 20170257070
- Publication date Sep 7, 2017
- SKYWORKS SOLUTIONS, INC.
- Hardik Bhupendra Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPILLARY BONDING TOOL AND METHOD OF FORMING WIRE BONDS
- Publication number 20140374467
- Publication date Dec 25, 2014
- Jia Lin Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIN-BASED WIREBOND STRUCTURES
- Publication number 20140367859
- Publication date Dec 18, 2014
- Burton J. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICES
- Publication number 20140291850
- Publication date Oct 2, 2014
- STMicroelectronics S.r. I.
- Federico Giovanni ZIGLIOLI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICES AND PROCESSING METHODS
- Publication number 20140110838
- Publication date Apr 24, 2014
- INFINEON TECHNOLOGIES AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE SEMICONDUCTOR DEVICE
- Publication number 20140103537
- Publication date Apr 17, 2014
- PANASONIC CORPORATION
- Kazuhiro KAIBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140061669
- Publication date Mar 6, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-In-Packages and Methods of Formation Thereof
- Publication number 20140001615
- Publication date Jan 2, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER MODULES INCLUDING RELATED SYSTEMS, DEVICES, AND MET...
- Publication number 20140002188
- Publication date Jan 2, 2014
- SKYWORKS SOLUTIONS, INC.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an Embedded SOP Fan-Out...
- Publication number 20130341784
- Publication date Dec 26, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20130277813
- Publication date Oct 24, 2013
- INFINEON TECHNOLOGIES AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure and Method
- Publication number 20130134588
- Publication date May 30, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip Semiconductor Packages and Assembly Thereof
- Publication number 20120074546
- Publication date Mar 29, 2012
- Chooi Mei Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INDUCTOR AND FLIP-CHIP
- Publication number 20120018892
- Publication date Jan 26, 2012
- MEHDI FREDERIK SOLTAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COMPONENT SUBSTRATE, SEMICONDUCTOR PACKAGE STRUCTURE USING...
- Publication number 20110278713
- Publication date Nov 17, 2011
- Advanced Semiconductor Engineering, Inc.
- Bernd Karl Appelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING DEVICE, METHOD FOR MANUFACTURING THE SAME, AND BACKL...
- Publication number 20110194273
- Publication date Aug 11, 2011
- Dong Wook Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Partially Patterned Lead Frames and Methods of Making and Using the...
- Publication number 20110057298
- Publication date Mar 10, 2011
- Mary Jean Ramos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HAVING SINGLE PATTERNED METAL LAYER EXPOSING PATTERNED DI...
- Publication number 20100314744
- Publication date Dec 16, 2010
- Shih-Fu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultra-Thin Semiconductor Package
- Publication number 20090189261
- Publication date Jul 30, 2009
- Lay Yeap Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Partially patterned lead frames and methods of making and using the...
- Publication number 20080258278
- Publication date Oct 23, 2008
- Mary Jean Ramos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of semiconductor device
- Publication number 20080237863
- Publication date Oct 2, 2008
- Kabushiki Kaisha Tosiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderability Improvement Method for Leaded Semiconductor Package
- Publication number 20080006937
- Publication date Jan 10, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Akira Matsunami
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device and manufacturing method of semiconductor device
- Publication number 20060113674
- Publication date Jun 1, 2006
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Preplated leadframe without precious metal
- Publication number 20040183166
- Publication date Sep 23, 2004
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of semiconductor device
- Publication number 20040159951
- Publication date Aug 19, 2004
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of semiconductor device
- Publication number 20020121703
- Publication date Sep 5, 2002
- KABUSHI KAISHA TOSHIBA
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method to produce the same
- Publication number 20020113322
- Publication date Aug 22, 2002
- Shinichi Terashima
- H01 - BASIC ELECTRIC ELEMENTS

Tin (Sn) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power amplifier modules including semiconductor resistor and tantal...

Power amplifier systems with control interface and bias circuit

Power amplifier modules including transistor with grading and semic...

Package-on-package (PoP) structure including stud bulbs

Semiconductor device and method of forming an embedded SoP fan-out...

Package-on-package (PoP) structure including stud bulbs

Power amplifier modules with bonding pads and related systems, devi...

Power amplifier modules with power amplifier and transmission line...

Power amplifier modules with harmonic termination circuit and relat...

Package on-package (PoP) structure including stud bulbs

Power amplifier modules including tantalum nitride terminated throu...

Power amplifier modules with bifet and harmonic termination and rel...

Power amplifier modules including wire bond pad and related systems...

Method for manufacturing electronic devices

Power amplifier modules including bipolar transistor with grading a...

Package on-Package (PoP) structure including stud bulbs and method

Power amplifier modules including bipolar transistor with grading a...

Semiconductor device and method of forming an embedded SOP fan-out...

Semiconductor device

Chip package and method of forming the same

Package-on-package (PoP) structure including stud bulbs and method

Chip package and a method for manufacturing a chip package

Light emitting device, method for manufacturing the same, and backl...

Substrate having single patterned metal layer exposing patterned di...

Embedded component substrate, semiconductor package structure using...

Partially patterned lead frames and methods of making and using the...

Semiconductor device including an insulating film and insulating pi...

Semiconductor device with improved bonding

Bonding pads for integrated circuits having copper interconnect met...

Electronic devices having metallurgies containing copper-semiconduc...

Patents Applicationslast 30 patents

Package-On-Package (PoP) Structure Including Stud Bulbs

Package-On-Package (PoP) Structure Including Stud Bulbs

POWER AMPLIFIER MODULES WITH BONDING PADS AND RELATED SYSTEMS, DEVI...

CAPILLARY BONDING TOOL AND METHOD OF FORMING WIRE BONDS

TIN-BASED WIREBOND STRUCTURES

METHOD FOR MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR DEVICES AND PROCESSING METHODS

NITRIDE SEMICONDUCTOR DEVICE

CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE

Package-In-Packages and Methods of Formation Thereof

POWER AMPLIFIER MODULES INCLUDING RELATED SYSTEMS, DEVICES, AND MET...

Semiconductor Device and Method of Forming an Embedded SOP Fan-Out...

CHIP PACKAGE AND METHOD OF FORMING THE SAME

Package-On-Package (PoP) Structure and Method

Multi-chip Semiconductor Packages and Assembly Thereof

SEMICONDUCTOR DEVICE WITH INDUCTOR AND FLIP-CHIP

EMBEDDED COMPONENT SUBSTRATE, SEMICONDUCTOR PACKAGE STRUCTURE USING...

LIGHT EMITTING DEVICE, METHOD FOR MANUFACTURING THE SAME, AND BACKL...

Partially Patterned Lead Frames and Methods of Making and Using the...

SUBSTRATE HAVING SINGLE PATTERNED METAL LAYER EXPOSING PATTERNED DI...

Ultra-Thin Semiconductor Package

Partially patterned lead frames and methods of making and using the...

Semiconductor device and manufacturing method of semiconductor device

Solderability Improvement Method for Leaded Semiconductor Package

Semiconductor device and manufacturing method of semiconductor device

Preplated leadframe without precious metal

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device and method to produce the same