Tin (Sn) as principal constituent

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CPC
H01L2224/85411

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85411Tin (Sn) as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with pass-through clock traces and associate...
- Patent number 11,855,048
- Issue date Dec 26, 2023
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier systems with control interface and bias circuit
- Patent number 11,451,199
- Issue date Sep 20, 2022
- Skyworks Solutions, Inc.
- David Steven Ripley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including transistor with grading and semic...
- Patent number 10,771,024
- Issue date Sep 8, 2020
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and light emitting module
- Patent number 10,297,716
- Issue date May 21, 2019
- LG Innotek Co., Ltd
- Shuhei Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming an embedded SoP fan-out...
- Patent number 10,217,702
- Issue date Feb 26, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules with bonding pads and related systems, devi...
- Patent number 10,090,812
- Issue date Oct 2, 2018
- Skyworks Solutions, Inc.
- Hardik Bhupendra Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules with power amplifier and transmission line...
- Patent number 9,887,668
- Issue date Feb 6, 2018
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Radio frequency integrated circuit module
- Patent number 9,859,231
- Issue date Jan 2, 2018
- Skyworks Solutions, Inc.
- Weimin Sun
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Power amplifier modules with harmonic termination circuit and relat...
- Patent number 9,847,755
- Issue date Dec 19, 2017
- Skyworks Solutions, Inc.
- Weimin Sun
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power amplifier modules including tantalum nitride terminated throu...
- Patent number 9,755,592
- Issue date Sep 5, 2017
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power amplifier modules with bifet and harmonic termination and rel...
- Patent number 9,692,357
- Issue date Jun 27, 2017
- Skyworks Solutions, Inc.
- Dinhphuoc Vu Hoang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power amplifier modules including wire bond pad and related systems...
- Patent number 9,660,584
- Issue date May 23, 2017
- Skyworks Solutions, Inc.
- Hardik Bhupendra Modi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power amplifier modules including bipolar transistor with grading a...
- Patent number 9,520,835
- Issue date Dec 13, 2016
- Skyworks Solutions, Inc.
- Tin Myint Ko
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power amplifier modules including bipolar transistor with grading a...
- Patent number 9,490,751
- Issue date Nov 8, 2016
- Skyworks Solutions, Inc.
- Tin Myint Ko
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device and method of forming topside and bottom-side...
- Patent number 9,478,486
- Issue date Oct 25, 2016
- STATS ChipPAC Pte. Ltd.
- Sun Mi Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to fabricate a radio frequency integrated circuit
- Patent number 9,472,514
- Issue date Oct 18, 2016
- Skyworks Solutions, Inc.
- Weimin Sun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming an embedded SOP fan-out...
- Patent number 9,385,006
- Issue date Jul 5, 2016
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of using substrate with conductive...
- Patent number 9,368,423
- Issue date Jun 14, 2016
- STATS ChipPAC Pte. Ltd.
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of forming an etch-back type semiconductor pac...
- Patent number 9,305,868
- Issue date Apr 5, 2016
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method for manufacturing the same
- Patent number 9,263,381
- Issue date Feb 16, 2016
- Sumitomo Electric Industries, Ltd
- Jiro Shinkai
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Stackable package by using internal stacking modules
- Patent number 9,245,772
- Issue date Jan 26, 2016
- STATS ChipPAC, Ltd.
- JoungIn Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming wafer-level multi-row et...
- Patent number 8,993,376
- Issue date Mar 31, 2015
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming the same
- Patent number 8,945,990
- Issue date Feb 3, 2015
- Infineon Technologies AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch-back type semiconductor package, substrate and manufacturing m...
- Patent number 8,917,521
- Issue date Dec 23, 2014
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming topside and bottom-side...
- Patent number 8,900,921
- Issue date Dec 2, 2014
- STATS ChipPAC, Ltd.
- Sun Mi Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless package system having external contacts
- Patent number 8,878,361
- Issue date Nov 4, 2014
- Stats Chippac Ltd.
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor packages and assembly thereof
- Patent number 8,836,101
- Issue date Sep 16, 2014
- Infineon Technologies AG
- Chooi Mei Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 8,786,108
- Issue date Jul 22, 2014
- Unimicron Technology Corporation
- Kun-Chen Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for multi-row lead frame and semiconductor package capabl...
- Patent number 8,659,131
- Issue date Feb 25, 2014
- LG Innotek Co., Ltd
- Ji Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATE...
- Publication number 20240178193
- Publication date May 30, 2024
- Lodestar Licensing Group LLC
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230215791
- Publication date Jul 6, 2023
- Samsung Electronics Co., Ltd.
- Jinmo Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER MODULES WITH BONDING PADS AND RELATED SYSTEMS, DEVI...
- Publication number 20170257070
- Publication date Sep 7, 2017
- SKYWORKS SOLUTIONS, INC.
- Hardik Bhupendra Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPILLARY BONDING TOOL AND METHOD OF FORMING WIRE BONDS
- Publication number 20140374467
- Publication date Dec 25, 2014
- Jia Lin Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIN-BASED WIREBOND STRUCTURES
- Publication number 20140367859
- Publication date Dec 18, 2014
- Burton J. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable Package by Using Internal Stacking Modules
- Publication number 20140319702
- Publication date Oct 30, 2014
- JoungIn Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Topside and Bottom-side...
- Publication number 20140239509
- Publication date Aug 28, 2014
- STATS ChipPAC, Ltd.
- Sun Mi Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER MODULES INCLUDING RELATED SYSTEMS, DEVICES, AND MET...
- Publication number 20140002188
- Publication date Jan 2, 2014
- SKYWORKS SOLUTIONS, INC.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an Embedded SOP Fan-Out...
- Publication number 20130341784
- Publication date Dec 26, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130322025
- Publication date Dec 5, 2013
- Sumitomo Electric Industries, Ltd.
- Jiro Shinkai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20130292166
- Publication date Nov 7, 2013
- Masaru Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20130277813
- Publication date Oct 24, 2013
- INFINEON TECHNOLOGIES AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PADS AND METHOD OF MANUFAC...
- Publication number 20120241948
- Publication date Sep 27, 2012
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND PAD SYSTEM AND METHOD
- Publication number 20120222892
- Publication date Sep 6, 2012
- SKYWORKS SOLUTIONS, INC.
- Weimin Sun
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
BOND PACKAGE AND APPROACH THEREFOR
- Publication number 20120162958
- Publication date Jun 28, 2012
- NXP B.V.
- Michael Rother
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE HAVING DIE BONDED TO THE POLYMER SIDE OF...
- Publication number 20120126418
- Publication date May 24, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip Semiconductor Packages and Assembly Thereof
- Publication number 20120074546
- Publication date Mar 29, 2012
- Chooi Mei Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20120049363
- Publication date Mar 1, 2012
- Unimicron Technology Corporation
- Kun-Chen Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Wafer-Level Multi-Row Et...
- Publication number 20120038064
- Publication date Feb 16, 2012
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Vertically Offset Bond o...
- Publication number 20120025373
- Publication date Feb 2, 2012
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INDUCTOR AND FLIP-CHIP
- Publication number 20120018892
- Publication date Jan 26, 2012
- MEHDI FREDERIK SOLTAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS PACKAGE SYSTEM HAVING EXTERNAL CONTACTS
- Publication number 20110285002
- Publication date Nov 24, 2011
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COMPONENT SUBSTRATE, SEMICONDUCTOR PACKAGE STRUCTURE USING...
- Publication number 20110278713
- Publication date Nov 17, 2011
- Advanced Semiconductor Engineering, Inc.
- Bernd Karl Appelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ETCH-BACK TYPE SEMICONDUCTOR PACKAGE, SUBSTRATE AND MANUFACTURING M...
- Publication number 20110267789
- Publication date Nov 3, 2011
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Manufacture Method For Multi-Row Lead Frame and Semic...
- Publication number 20110227208
- Publication date Sep 22, 2011
- Ji Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING VERTICALLY OFFSET BOND O...
- Publication number 20110221058
- Publication date Sep 15, 2011
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Packaging with Metal Frame Pin Grid Array
- Publication number 20110177629
- Publication date Jul 21, 2011
- Chris Karabatsos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe Structure, Advanced Quad Flat No Lead Package Structure U...
- Publication number 20110163430
- Publication date Jul 7, 2011
- Advanced Semiconductor Engineering, Inc.
- Yuyong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING DEVICE STACKING
- Publication number 20110147899
- Publication date Jun 23, 2011
- Frederick Rodriguez Dahilig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20110147057
- Publication date Jun 23, 2011
- IBIDEN CO., LTD.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Tin (Sn) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power amplifier modules including semiconductor resistor and tantal...

Semiconductor packages with pass-through clock traces and associate...

Power amplifier systems with control interface and bias circuit

Power amplifier modules including transistor with grading and semic...

Light emitting device and light emitting module

Semiconductor device and method of forming an embedded SoP fan-out...

Power amplifier modules with bonding pads and related systems, devi...

Power amplifier modules with power amplifier and transmission line...

Radio frequency integrated circuit module

Power amplifier modules with harmonic termination circuit and relat...

Power amplifier modules including tantalum nitride terminated throu...

Power amplifier modules with bifet and harmonic termination and rel...

Power amplifier modules including wire bond pad and related systems...

Power amplifier modules including bipolar transistor with grading a...

Power amplifier modules including bipolar transistor with grading a...

Semiconductor device and method of forming topside and bottom-side...

Methods to fabricate a radio frequency integrated circuit

Semiconductor device and method of forming an embedded SOP fan-out...

Semiconductor device and method of using substrate with conductive...

Manufacturing method of forming an etch-back type semiconductor pac...

Semiconductor module and method for manufacturing the same

Stackable package by using internal stacking modules

Semiconductor device and method of forming wafer-level multi-row et...

Chip package and method of forming the same

Etch-back type semiconductor package, substrate and manufacturing m...

Semiconductor device and method of forming topside and bottom-side...

Leadless package system having external contacts

Multi-chip semiconductor packages and assembly thereof

Package structure

Structure for multi-row lead frame and semiconductor package capabl...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATE...

SEMICONDUCTOR PACKAGE

POWER AMPLIFIER MODULES WITH BONDING PADS AND RELATED SYSTEMS, DEVI...

CAPILLARY BONDING TOOL AND METHOD OF FORMING WIRE BONDS

TIN-BASED WIREBOND STRUCTURES

Stackable Package by Using Internal Stacking Modules

Semiconductor Device and Method of Forming Topside and Bottom-side...

POWER AMPLIFIER MODULES INCLUDING RELATED SYSTEMS, DEVICES, AND MET...

Semiconductor Device and Method of Forming an Embedded SOP Fan-Out...

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

CHIP PACKAGE AND METHOD OF FORMING THE SAME

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PADS AND METHOD OF MANUFAC...

WIRE BOND PAD SYSTEM AND METHOD

BOND PACKAGE AND APPROACH THEREFOR

INTEGRATED CIRCUIT DEVICE HAVING DIE BONDED TO THE POLYMER SIDE OF...

Multi-chip Semiconductor Packages and Assembly Thereof

PACKAGE STRUCTURE

Semiconductor Device and Method of Forming Wafer-Level Multi-Row Et...

Semiconductor Device and Method of Forming Vertically Offset Bond o...

SEMICONDUCTOR DEVICE WITH INDUCTOR AND FLIP-CHIP

LEADLESS PACKAGE SYSTEM HAVING EXTERNAL CONTACTS

EMBEDDED COMPONENT SUBSTRATE, SEMICONDUCTOR PACKAGE STRUCTURE USING...

ETCH-BACK TYPE SEMICONDUCTOR PACKAGE, SUBSTRATE AND MANUFACTURING M...

Structure and Manufacture Method For Multi-Row Lead Frame and Semic...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING VERTICALLY OFFSET BOND O...

Chip Packaging with Metal Frame Pin Grid Array

Leadframe Structure, Advanced Quad Flat No Lead Package Structure U...

INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING DEVICE STACKING

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD