Titanium (Ti) as principal constituent

Industry

CPC
H01L2224/85466

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85466Titanium (Ti) as principal constituent

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Light emitting device and light emitting module
- Patent number 10,297,716
- Issue date May 21, 2019
- LG Innotek Co., Ltd
- Shuhei Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic wireless transmission device
- Patent number 9,768,518
- Issue date Sep 19, 2017
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean-Charles Souriau
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Submount, encapsulated semiconductor element, and methods of manufa...
- Patent number 9,263,411
- Issue date Feb 16, 2016
- Advanced Photonics, Inc.
- Xueliang Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-base circuit board and its manufacturing method
- Patent number 7,709,939
- Issue date May 4, 2010
- Denki Kagaku Kogyo Kabushiki Kaisha
- Naomi Yonemura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for bonding inner leads to bond pads without bumps and struc...
- Patent number 6,656,772
- Issue date Dec 2, 2003
- Industrial Technology Research Institute
- Yuan-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered lead frame for semiconductor package
- Patent number 6,153,924
- Issue date Nov 28, 2000
- Micron Technology, Inc.
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered lead frame for semiconductor packages
- Patent number 6,002,165
- Issue date Dec 14, 1999
- Micron Technology, Inc.
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device sealed with molded resin
- Patent number 5,717,232
- Issue date Feb 10, 1998
- Kabushiki Kaisha Toshiba
- Kazuhiko Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming custom planar metal bonding pad connectors for s...
- Patent number 5,445,994
- Issue date Aug 29, 1995
- Micron Technology, Inc.
- Terry L. Gilton
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230178518
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Raehyung DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A MULTI-CHANNEL AND A RELATED ELECTRON...
- Publication number 20140252640
- Publication date Sep 11, 2014
- Samsung Electronics Co., Ltd.
- Min-Keun Kwak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC WIRELESS TRANSMISSION DEVICE
- Publication number 20130293428
- Publication date Nov 7, 2013
- COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE. ALT.
- Jean-Charles SOURIAU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090215259
- Publication date Aug 27, 2009
- PETARI INCORPORATION
- Kye Nam LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20080122079
- Publication date May 29, 2008
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Bo-Wei Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20070296081
- Publication date Dec 27, 2007
- Kye Nam Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-base circuit board and its manufacturing method
- Publication number 20070128772
- Publication date Jun 7, 2007
- DENKI KAGAKU KOGYO KABUSHIKI KAISHA
- Naomi Yonemura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for bonding inner leads to bond pads without bumps and struc...
- Publication number 20030098513
- Publication date May 29, 2003
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Yuan-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS

Titanium (Ti) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Light emitting device and light emitting module

Microelectronic wireless transmission device

Submount, encapsulated semiconductor element, and methods of manufa...

Metal-base circuit board and its manufacturing method

Method for bonding inner leads to bond pads without bumps and struc...

Multilayered lead frame for semiconductor package

Multilayered lead frame for semiconductor packages

Semiconductor device sealed with molded resin

Method for forming custom planar metal bonding pad connectors for s...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE HAVING A MULTI-CHANNEL AND A RELATED ELECTRON...

MICROELECTRONIC WIRELESS TRANSMISSION DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Metal-base circuit board and its manufacturing method

Method for bonding inner leads to bond pads without bumps and struc...