Titanium (Ti) as principal constituent

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H01L2224/48766

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48766Titanium (Ti) as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and inspection device
- Patent number 12,040,303
- Issue date Jul 16, 2024
- Kabushiki Kaisha Toshiba
- Mitsuaki Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with metal film and method for manufacturing s...
- Patent number 10,157,865
- Issue date Dec 18, 2018
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including a semiconductor chip and wires
- Patent number 9,305,876
- Issue date Apr 5, 2016
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Submount, encapsulated semiconductor element, and methods of manufa...
- Patent number 9,263,411
- Issue date Feb 16, 2016
- Advanced Photonics, Inc.
- Xueliang Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement, semiconductor module, and method for con...
- Patent number 9,196,562
- Issue date Nov 24, 2015
- Infineon Technologies AG
- Dirk Siepe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with pads of enhanced moisture blocking ability
- Patent number 8,906,705
- Issue date Dec 9, 2014
- Fujitsu Semiconductor Limited
- Kaoru Saigoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing electronic device having contact elements with a spec...
- Patent number 8,871,630
- Issue date Oct 28, 2014
- Infineon Technologies AG
- Ralf Otremba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package and a method for manufacturing a chip package
- Patent number 8,815,647
- Issue date Aug 26, 2014
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having copper interconnect for bonding
- Patent number 8,759,970
- Issue date Jun 24, 2014
- Round Rock Research, LLC
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor chip having two metal layers on one face
- Patent number 8,643,176
- Issue date Feb 4, 2014
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IGBT power semiconductor package having a conductive clip
- Patent number 8,354,733
- Issue date Jan 15, 2013
- International Rectifier Corporation
- Hsueh-Rong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale surface mounted semiconductor device package and process...
- Patent number 8,294,254
- Issue date Oct 23, 2012
- Alpha and Omega Semiconductor Incorporated
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having contact elements with a specified cross se...
- Patent number 8,227,908
- Issue date Jul 24, 2012
- Infineon Technologies AG
- Ralf Otremba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip scale surface mounted semiconductor device package and process...
- Patent number 8,222,078
- Issue date Jul 17, 2012
- Alpha and Omega Semiconductor Incorporated
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having improved contact interface reliability...
- Patent number 8,193,624
- Issue date Jun 5, 2012
- Amkor Technology, Inc.
- Eun Sook Sohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module arrangement
- Patent number 8,164,176
- Issue date Apr 24, 2012
- Infineon Technologies AG
- Dirk Siepe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with pads of enhanced moisture blocking ability
- Patent number 8,076,780
- Issue date Dec 13, 2011
- Fujitsu Semiconductor Limited
- Kaoru Saigoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure having dummy plugs and/or patterns formed therea...
- Patent number 8,030,781
- Issue date Oct 4, 2011
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element and electrical apparatus
- Patent number 7,964,911
- Issue date Jun 21, 2011
- Panasonic Corporation
- Makoto Kitabatake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wirebond structure and method to connect to a microelectronic die
- Patent number 7,855,103
- Issue date Dec 21, 2010
- Intel Corporation
- Robert J. Gleixner
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 7,829,476
- Issue date Nov 9, 2010
- Fujitsu Semiconductor Limited
- Kouichi Nagai
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor element and electrical apparatus
- Patent number 7,791,308
- Issue date Sep 7, 2010
- Panasonic Corporation
- Makoto Kitabatake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-base circuit board and its manufacturing method
- Patent number 7,709,939
- Issue date May 4, 2010
- Denki Kagaku Kogyo Kabushiki Kaisha
- Naomi Yonemura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bond pad structure for wire bonding
- Patent number 7,592,710
- Issue date Sep 22, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Chiu Hsia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and semiconductor device having copper interconnect for bonding
- Patent number 7,592,246
- Issue date Sep 22, 2009
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect
- Patent number 7,569,934
- Issue date Aug 4, 2009
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating board on chip (BOC) semiconductor package wi...
- Patent number 7,537,966
- Issue date May 26, 2009
- Micron Technology, Inc.
- Mike Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect
- Patent number 7,511,363
- Issue date Mar 31, 2009
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect
- Patent number 7,489,041
- Issue date Feb 10, 2009
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor package with circuit side poly...
- Patent number 7,479,413
- Issue date Jan 20, 2009
- Micron Technology, Inc.
- Mike Connell
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND INSPECTION DEVICE
- Publication number 20210296279
- Publication date Sep 23, 2021
- Kabushiki Kaisha Toshiba
- Mitsuaki KATO
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A MULTI-CHANNEL AND A RELATED ELECTRON...
- Publication number 20140252640
- Publication date Sep 11, 2014
- Samsung Electronics Co., Ltd.
- Min-Keun Kwak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Including a Semiconductor Chip and Wires
- Publication number 20140218885
- Publication date Aug 7, 2014
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDS AND LIGHT EMITTER DEVICES AND RELATED METHODS
- Publication number 20140070235
- Publication date Mar 13, 2014
- Peter Scott Andrews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140061669
- Publication date Mar 6, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module Including a Discrete Device Mounted on a DCB Substrate
- Publication number 20130161801
- Publication date Jun 27, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Package with Conductive Clip
- Publication number 20130140602
- Publication date Jun 6, 2013
- International Rectifier Corporation
- Hsueh-Rong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Chip Having Two Metal Layers on One Face
- Publication number 20130027113
- Publication date Jan 31, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including a Contact Clip Having Protrusions an...
- Publication number 20130009295
- Publication date Jan 10, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING THEREOF
- Publication number 20120286293
- Publication date Nov 15, 2012
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
IGBT Power Semiconductor Package Having a Conductive Clip
- Publication number 20120223415
- Publication date Sep 6, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Hsueh-Rong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS, METHOD FOR MANUFACTURING THE SAME AND ELEC...
- Publication number 20120217660
- Publication date Aug 30, 2012
- FUJITSU LIMITED
- Motoaki TANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGE AND PROCESS...
- Publication number 20120161307
- Publication date Jun 28, 2012
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PADS OF ENHANCED MOISTURE BLOCKING ABILITY
- Publication number 20120056322
- Publication date Mar 8, 2012
- FUJITSU SEMICONDUCTOR LIMITED
- Kaoru Saigoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Arrangement, Semiconductor Module, and Method for Con...
- Publication number 20110316160
- Publication date Dec 29, 2011
- INFINEON TECHNOLOGIES AG
- Dirk Siepe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20110049675
- Publication date Mar 3, 2011
- FUJITSU MICROELECTRONICS LIMITED
- Kouichi NAGAI
- G01 - MEASURING TESTING
Information Patent Application
CHIP SCALE SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGE AND PROCESS...
- Publication number 20110018116
- Publication date Jan 27, 2011
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND ELECTRICAL APPARATUS
- Publication number 20100148244
- Publication date Jun 17, 2010
- Matsushita Electric Industrial Co., Ltd.
- Makoto Kitabatake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND ELECTRICAL APPARATUS
- Publication number 20100148718
- Publication date Jun 17, 2010
- Matsushita Electric Industrial Co., Ltd.
- Makoto Kitabatake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE HAVING DUMMY PLUGS AND/OR PATTERNS FORMED THEREA...
- Publication number 20100072632
- Publication date Mar 25, 2010
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING THEREOF
- Publication number 20100001291
- Publication date Jan 7, 2010
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD AND SEMICONDUCTOR DEVICE HAVING COPPER INTERCONNECT FOR BONDING
- Publication number 20090309222
- Publication date Dec 17, 2009
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20090243038
- Publication date Oct 1, 2009
- Fujitsu Microelectronics Limited
- Kouichi NAGAI
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE WITH PADS OF ENHANCED MOISTURE BLOCKING ABILITY
- Publication number 20090008783
- Publication date Jan 8, 2009
- Fujitsu Limited
- Kaoru Saigoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIREBOND STRUCTURE AND METHOD TO CONNECT TO A MICROELECTRONIC DIE
- Publication number 20080227285
- Publication date Sep 18, 2008
- ROBERT J. GLEIXNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor arrangement, semiconductor module, and method for con...
- Publication number 20080093729
- Publication date Apr 24, 2008
- Dirk Siepe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond pad structure for wire bonding
- Publication number 20070205508
- Publication date Sep 6, 2007
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Chiu Hsia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-base circuit board and its manufacturing method
- Publication number 20070128772
- Publication date Jun 7, 2007
- DENKI KAGAKU KOGYO KABUSHIKI KAISHA
- Naomi Yonemura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dummy structures extending from seal ring into active circuit area...
- Publication number 20070018331
- Publication date Jan 25, 2007
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating board on chip (BOC) semiconductor package wi...
- Publication number 20060292752
- Publication date Dec 28, 2006
- Mike Connell
- H01 - BASIC ELECTRIC ELEMENTS

Titanium (Ti) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and inspection device

Semiconductor device with metal film and method for manufacturing s...

Device including a semiconductor chip and wires

Submount, encapsulated semiconductor element, and methods of manufa...

Semiconductor arrangement, semiconductor module, and method for con...

Semiconductor device with pads of enhanced moisture blocking ability

Manufacturing electronic device having contact elements with a spec...

Chip package and a method for manufacturing a chip package

Semiconductor device having copper interconnect for bonding

Power semiconductor chip having two metal layers on one face

IGBT power semiconductor package having a conductive clip

Chip scale surface mounted semiconductor device package and process...

Electronic device having contact elements with a specified cross se...

Chip scale surface mounted semiconductor device package and process...

Semiconductor device having improved contact interface reliability...

Semiconductor module arrangement

Semiconductor device with pads of enhanced moisture blocking ability

Bond pad structure having dummy plugs and/or patterns formed therea...

Semiconductor element and electrical apparatus

Wirebond structure and method to connect to a microelectronic die

Method of manufacturing semiconductor device and semiconductor device

Semiconductor element and electrical apparatus

Metal-base circuit board and its manufacturing method

Bond pad structure for wire bonding

Method and semiconductor device having copper interconnect for bonding

Copper interconnect

Method for fabricating board on chip (BOC) semiconductor package wi...

Copper interconnect

Copper interconnect

Method for fabricating semiconductor package with circuit side poly...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND INSPECTION DEVICE

SEMICONDUCTOR PACKAGE HAVING A MULTI-CHANNEL AND A RELATED ELECTRON...

Device Including a Semiconductor Chip and Wires

WIRE BONDS AND LIGHT EMITTER DEVICES AND RELATED METHODS

CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE

Module Including a Discrete Device Mounted on a DCB Substrate

Power Semiconductor Package with Conductive Clip

Power Semiconductor Chip Having Two Metal Layers on One Face

Semiconductor Device Including a Contact Clip Having Protrusions an...

ELECTRONIC DEVICE AND MANUFACTURING THEREOF

IGBT Power Semiconductor Package Having a Conductive Clip

SEMICONDUCTOR APPARATUS, METHOD FOR MANUFACTURING THE SAME AND ELEC...

CHIP SCALE SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGE AND PROCESS...

SEMICONDUCTOR DEVICE WITH PADS OF ENHANCED MOISTURE BLOCKING ABILITY

Semiconductor Arrangement, Semiconductor Module, and Method for Con...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

CHIP SCALE SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGE AND PROCESS...

SEMICONDUCTOR ELEMENT AND ELECTRICAL APPARATUS

SEMICONDUCTOR ELEMENT AND ELECTRICAL APPARATUS

BOND PAD STRUCTURE HAVING DUMMY PLUGS AND/OR PATTERNS FORMED THEREA...

ELECTRONIC DEVICE AND MANUFACTURING THEREOF

METHOD AND SEMICONDUCTOR DEVICE HAVING COPPER INTERCONNECT FOR BONDING

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH PADS OF ENHANCED MOISTURE BLOCKING ABILITY

WIREBOND STRUCTURE AND METHOD TO CONNECT TO A MICROELECTRONIC DIE

Semiconductor arrangement, semiconductor module, and method for con...

Bond pad structure for wire bonding

Metal-base circuit board and its manufacturing method

Dummy structures extending from seal ring into active circuit area...

Method for fabricating board on chip (BOC) semiconductor package wi...