to change their surface-physical characteristics or shape

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H01L21/302

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/302to change their surface-physical characteristics or shape

Industries

Patents Grantslast 30 patents

Information Patent Grant
Selective metal removal for conductive interconnects in integrated...
- Patent number 12,176,214
- Issue date Dec 24, 2024
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for etching silicon oxide
- Patent number 12,125,709
- Issue date Oct 22, 2024
- Central Glass Company, Limited
- Shoi Suzuki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Substrate processing apparatus, estimation method of substrate proc...
- Patent number 12,051,587
- Issue date Jul 30, 2024
- Tokyo Electron Limited
- Hiroshi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die sidewall coatings and related methods
- Patent number 12,040,192
- Issue date Jul 16, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for manufacturing semiconductor substrate comprising tempera...
- Patent number 12,014,939
- Issue date Jun 18, 2024
- Kwansei Gakuin Educational Foundation
- Tadaaki Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device structure
- Patent number 12,009,222
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chen Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming source/drain contacts
- Patent number 12,009,363
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shao-Ming Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device, method of manufacturing window, and method of manuf...
- Patent number 12,001,243
- Issue date Jun 4, 2024
- Samsung Display Co., Ltd.
- In-Bae Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing semiconductor device including performing...
- Patent number 11,978,643
- Issue date May 7, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Xiaojie Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dry etching method, method for manufacturing semiconductor element,...
- Patent number 11,972,955
- Issue date Apr 30, 2024
- Resonac Corporation
- Kazuma Matsui
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Methods of manufacturing an integrated circuit having stress tuning...
- Patent number 11,935,842
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor patterning and resulting structures
- Patent number 11,929,254
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Ming Lung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with die including cavities
- Patent number 11,908,699
- Issue date Feb 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backmetal removal methods
- Patent number 11,901,184
- Issue date Feb 13, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for memory and memory
- Patent number 11,895,831
- Issue date Feb 6, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Junchao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with die support structure for thin die
- Patent number 11,894,234
- Issue date Feb 6, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing and packaging
- Patent number 11,894,313
- Issue date Feb 6, 2024
- Texas Instruments Incorporated
- Jane Qian Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a support pattern on a lower electr...
- Patent number 11,875,992
- Issue date Jan 16, 2024
- Samsung Electronics Co., Ltd.
- Hyun-Suk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques and apparatus for anisotropic stress compensation in sub...
- Patent number 11,875,995
- Issue date Jan 16, 2024
- Applied Materials, Inc.
- Scott Falk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overlay mark and method of making
- Patent number 11,876,054
- Issue date Jan 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High brightness LEDs with non-specular nanostructured thin film ref...
- Patent number 11,870,012
- Issue date Jan 9, 2024
- Lumileds LLC
- Venkata Ananth Tamma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlled degradation of a stimuli-responsive polymer film
- Patent number 11,862,473
- Issue date Jan 2, 2024
- Lam Research Corporation
- Stephen M. Sirard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer handling chamber with moisture reduction
- Patent number 11,837,483
- Issue date Dec 5, 2023
- ASM IP Holding B.V.
- Petri Raisanen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable and flexible architectures for integrated circuit (IC) des...
- Patent number 11,837,503
- Issue date Dec 5, 2023
- Alibaba Group Holding Limited
- Wei Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing optoelectric semiconductor component and o...
- Patent number 11,837,844
- Issue date Dec 5, 2023
- OSRAM OLED GmbH
- John Brückner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with air-spacer
- Patent number 11,830,922
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming dice and structure of die
- Patent number 11,810,804
- Issue date Nov 7, 2023
- Vanguard International Semiconductor Corporation
- Hsiu-Mei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for stressing semiconductor substrates
- Patent number 11,764,071
- Issue date Sep 19, 2023
- GlobalWafers Co., Ltd.
- Robert J. Falster
- C30 - CRYSTAL GROWTH
Information Patent Grant
Laser devices using a semipolar plane
- Patent number 11,749,969
- Issue date Sep 5, 2023
- KYOCERA SLD Laser, Inc.
- James W. Raring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for etching silicon oxide
- Patent number 11,715,641
- Issue date Aug 1, 2023
- Central Glass Company, Limited
- Shoi Suzuki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD
- Publication number 20240429056
- Publication date Dec 26, 2024
- NEXPERIA B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, ESTIMATION METHOD OF SUBSTRATE PROC...
- Publication number 20240355617
- Publication date Oct 24, 2024
- TOKYO ELECTRON LIMITED
- Hiroshi Nakamura
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
METHOD FOR FORMING SOURCE/DRAIN CONTACTS
- Publication number 20240332298
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Shao-Ming Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SIDEWALL COATINGS AND RELATED METHODS
- Publication number 20240332025
- Publication date Oct 3, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Channel Manufacturing Method
- Publication number 20240312943
- Publication date Sep 19, 2024
- SEIKO EPSON CORPORATION
- Junichi OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE, METHOD OF MANUFACTURING WINDOW, AND METHOD OF MANUF...
- Publication number 20240295904
- Publication date Sep 5, 2024
- SAMSUNG DISPLAY CO., LTD.
- IN-BAE KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TRANSISTOR DEVICE HAVING A GATE SETBACK FROM A GATE DIELECTRIC
- Publication number 20240258373
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ta-Yuan Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCHOTTKY DIODE AND METHOD OF FABRICATION THEREOF
- Publication number 20240258439
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Wei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC RANDOM ACCESS MEMORY AND FORMING METHOD THEREFOR
- Publication number 20240244833
- Publication date Jul 18, 2024
- ICLEAGUE TECHNOLOGY CO., LTD.
- Wenyu HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH DIE INCLUDING CAVITIES AND RELATED METHODS
- Publication number 20240203744
- Publication date Jun 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRECISION OXIDATION CONTROL BY ION IMPLANTATION
- Publication number 20240203743
- Publication date Jun 20, 2024
- Applied Materials, Inc.
- Supakit Charnvanichborikarn
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING COMMON BODY BIAS REGION
- Publication number 20240178213
- Publication date May 30, 2024
- Samsung Electronics Co., Ltd.
- Changyeon Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Patterning and Resulting Structures
- Publication number 20240177995
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Ming Lung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING AND PACKAGING
- Publication number 20240128199
- Publication date Apr 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jane Qian Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240128120
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING A SUPPORT PATTERN ON A LOWER ELECTR...
- Publication number 20240120196
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- Hyun-Suk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240006238
- Publication date Jan 4, 2024
- SK HYNIX INC.
- Seiyon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF OPTIMIZING LASER CUTTING OF WAFERS FOR PRODUCING INTEGRAT...
- Publication number 20230415269
- Publication date Dec 28, 2023
- Skyworks Solutions, Inc.
- Juan Arturo Jerez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230411322
- Publication date Dec 21, 2023
- KIOXIA Corporation
- Hiroaki ASHIDATE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Air-Spacer
- Publication number 20230387247
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Wei-Yang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND METHOD OF MANUFACTURING SAME
- Publication number 20230282686
- Publication date Sep 7, 2023
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Yasuyo YOTSUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING STACKED ELEMENTS AND METHODS O...
- Publication number 20230275021
- Publication date Aug 31, 2023
- Samsung Electronics Co., Ltd.
- BYOUNGHAK HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR ETCHING SILICON OXIDE
- Publication number 20230274944
- Publication date Aug 31, 2023
- Central Glass Company, Limited
- Shoi SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC VAPOR JET PRINTING SYSTEM
- Publication number 20230269994
- Publication date Aug 24, 2023
- UNIVERSAL DISPLAY CORPORATION
- William E. QUINN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20230223275
- Publication date Jul 13, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Xiaojie LI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Hall Effect Prism Sensor
- Publication number 20230110624
- Publication date Apr 13, 2023
- Lexmark International, Inc.
- John Douglas Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hall Effect Prism Sensor
- Publication number 20230114075
- Publication date Apr 13, 2023
- Lexmark International, Inc.
- John Douglas Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Patterning and Resulting Structures
- Publication number 20230108424
- Publication date Apr 6, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Ming Lung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD OF ETCHING APPARATUS
- Publication number 20220359173
- Publication date Nov 10, 2022
- WINBOND ELECTRONICS CORP.
- Shih-Chieh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SIDEWALL COATINGS AND RELATED METHODS
- Publication number 20220351977
- Publication date Nov 3, 2022
- Semiconductor Components Industries, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS

to change their surface-physical characteristics or shape

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Selective metal removal for conductive interconnects in integrated...

Method and device for etching silicon oxide

Substrate processing apparatus, estimation method of substrate proc...

Die sidewall coatings and related methods

Device for manufacturing semiconductor substrate comprising tempera...

Method for forming semiconductor device structure

Method for forming source/drain contacts

Display device, method of manufacturing window, and method of manuf...

Method for manufacturing semiconductor device including performing...

Dry etching method, method for manufacturing semiconductor element,...

Methods of manufacturing an integrated circuit having stress tuning...

Semiconductor patterning and resulting structures

Semiconductor packages with die including cavities

Backmetal removal methods

Manufacturing method for memory and memory

Semiconductor packages with die support structure for thin die

Substrate processing and packaging

Semiconductor devices including a support pattern on a lower electr...

Techniques and apparatus for anisotropic stress compensation in sub...

Overlay mark and method of making

High brightness LEDs with non-specular nanostructured thin film ref...

Controlled degradation of a stimuli-responsive polymer film

Wafer handling chamber with moisture reduction

Scalable and flexible architectures for integrated circuit (IC) des...

Method for manufacturing optoelectric semiconductor component and o...

Semiconductor device with air-spacer

Method of forming dice and structure of die

Apparatus for stressing semiconductor substrates

Laser devices using a semipolar plane

Method and device for etching silicon oxide

Patents Applicationslast 30 patents

SEMICONDUCTOR DIE PACKAGE AND METHOD

SUBSTRATE PROCESSING APPARATUS, ESTIMATION METHOD OF SUBSTRATE PROC...

METHOD FOR FORMING SOURCE/DRAIN CONTACTS

DIE SIDEWALL COATINGS AND RELATED METHODS

Channel Manufacturing Method

DISPLAY DEVICE, METHOD OF MANUFACTURING WINDOW, AND METHOD OF MANUF...

TRANSISTOR DEVICE HAVING A GATE SETBACK FROM A GATE DIELECTRIC

SCHOTTKY DIODE AND METHOD OF FABRICATION THEREOF

DYNAMIC RANDOM ACCESS MEMORY AND FORMING METHOD THEREFOR

SEMICONDUCTOR PACKAGES WITH DIE INCLUDING CAVITIES AND RELATED METHODS

METHOD FOR PRECISION OXIDATION CONTROL BY ION IMPLANTATION

SEMICONDUCTOR DEVICE INCLUDING COMMON BODY BIAS REGION

Semiconductor Patterning and Resulting Structures

SUBSTRATE PROCESSING AND PACKAGING

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICES INCLUDING A SUPPORT PATTERN ON A LOWER ELECTR...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

METHOD OF OPTIMIZING LASER CUTTING OF WAFERS FOR PRODUCING INTEGRAT...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor Device with Air-Spacer

CAPACITOR AND METHOD OF MANUFACTURING SAME

INTEGRATED CIRCUIT DEVICES INCLUDING STACKED ELEMENTS AND METHODS O...

METHOD AND DEVICE FOR ETCHING SILICON OXIDE

ORGANIC VAPOR JET PRINTING SYSTEM

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Hall Effect Prism Sensor

Hall Effect Prism Sensor

Semiconductor Patterning and Resulting Structures

ETCHING METHOD OF ETCHING APPARATUS

DIE SIDEWALL COATINGS AND RELATED METHODS