to form insulating layers thereon

Industry

CPC
H01L21/31

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/31to form insulating layers thereon

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,230,534
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compound, polymer, pattern forming material, pattern forming method...
- Patent number 12,228,860
- Issue date Feb 18, 2025
- Kioxia Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bath systems and methods thereof
- Patent number 12,226,796
- Issue date Feb 18, 2025
- Tokyo Electron Limited
- B08 - CLEANING
Information Patent Grant
Composition and method for silicon nitride CMP
- Patent number 12,227,673
- Issue date Feb 18, 2025
- CMC MATERIALS LLC
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Etching apparatus
- Patent number 12,230,505
- Issue date Feb 18, 2025
- Tokyo Electron Limited
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal structure
- Patent number 12,230,566
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,230,567
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching method and plasma etching apparatus
- Patent number 12,230,504
- Issue date Feb 18, 2025
- Kioxia Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Area selective organic material removal
- Patent number 12,230,506
- Issue date Feb 18, 2025
- ASM IP Holding B.V.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structuring method
- Patent number 12,230,508
- Issue date Feb 18, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus for manufacturing semiconductor device
- Patent number 12,224,187
- Issue date Feb 11, 2025
- Kioxia Corporation
- Makoto Aida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage device
- Patent number 12,224,213
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Hsin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of running an etch process in higher selectivity to mask and...
- Patent number 12,224,177
- Issue date Feb 11, 2025
- American Air Liquide, Inc.
- Xiangyu Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing vias with pulsing plasma
- Patent number 12,224,178
- Issue date Feb 11, 2025
- NANYA TECHNOLOGY CORPORATION
- Zhi-Xuan Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 12,224,214
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Seongkeun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and manufacturing methods of the same
- Patent number 12,225,725
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- So Hyeon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure
- Patent number 12,222,653
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Hui Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for FinFet fabrication and structure thereof
- Patent number 12,224,210
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Han-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with backside air gap dielectric
- Patent number 12,224,212
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 12,224,183
- Issue date Feb 11, 2025
- Chipbond Technology Corporation
- Shrane-Ning Jenq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming an oxide volume within a fin
- Patent number 12,224,202
- Issue date Feb 11, 2025
- Intel Corporation
- Cheng-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of metal grid, thin film sensor and manufactur...
- Patent number 12,224,234
- Issue date Feb 11, 2025
- BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
- Hu Meng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,224,325
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,224,327
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
HEMT and fabricating method of the same
- Patent number 12,224,338
- Issue date Feb 11, 2025
- United Microelectronics Corp.
- Huai-Tzu Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal silicide structures for advanced integrated circuit stru...
- Patent number 12,225,740
- Issue date Feb 11, 2025
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a via and a metal wiring for a semiconducto...
- Patent number 12,224,237
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the semiconductor...
- Patent number 12,218,247
- Issue date Feb 4, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing system, method of manufacturing a semic...
- Patent number 12,217,962
- Issue date Feb 4, 2025
- Kioxia Corporation
- Shingo Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching method using perfluoropropyl carbinol
- Patent number 12,217,970
- Issue date Feb 4, 2025
- Ajou University Industry-Academic Cooperation Foundation
- Chang-Koo Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF ETCHING OXYGEN-CONTAINING FEATURES AT LOW TEMPERATURES
- Publication number 20250054770
- Publication date Feb 13, 2025
- Applied Materials, Inc.
- Jiajing Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20250054783
- Publication date Feb 13, 2025
- TOKYO ELECTRON LIMITED
- Tatsuya NAGAMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING VARIATIONS IN MASK TOPOGRAPHY
- Publication number 20250054769
- Publication date Feb 13, 2025
- LAM RESEARCH CORPORATION
- Hsu-Cheng HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DOPING CARBON IN THIN FILM ON WAFER
- Publication number 20250054771
- Publication date Feb 13, 2025
- HPSP Co., Ltd.
- Sung Kil CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD
- Publication number 20250054731
- Publication date Feb 13, 2025
- ULVAC, Inc.
- Kazuhiko Tonari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY ARRAYS AND METHODS USED IN FORMING A MEMORY ARRAY COMPRISING...
- Publication number 20250056800
- Publication date Feb 13, 2025
- Lodestar Licensing Group LLC
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PHOTORESIST COMPOSITION AND METHOD OF FORMING PATTERN...
- Publication number 20250054758
- Publication date Feb 13, 2025
- Samsung SDI Co., Ltd.
- Dong Wan RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING WAFER EDGE DEFECTS
- Publication number 20250054807
- Publication date Feb 13, 2025
- WINBOND ELECTRONICS CORP.
- Cheng-Hsiang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY SELF-ALIGNED VIA WITH GRAPHENE CAP
- Publication number 20250054809
- Publication date Feb 13, 2025
- TOKYO ELECTRON LIMITED
- Kandabara Tapily
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS WITH IMPLANTED ALIGNMENT MARK AND METHODS OF MANUFACTURIN...
- Publication number 20250046730
- Publication date Feb 6, 2025
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIAMOND-LIKE CARBON GAP FILL
- Publication number 20250046599
- Publication date Feb 6, 2025
- Applied Materials, Inc.
- Jialiang WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ETCHING METHOD
- Publication number 20250046615
- Publication date Feb 6, 2025
- TOKYO ELECTRON LIMITED
- Takahiro YOKOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH CONDUCTIVE PASSIVATION LAYERS AND METHOD OF FORMING THE SAME D...
- Publication number 20250046618
- Publication date Feb 6, 2025
- Xiangyu GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD
- Publication number 20250046620
- Publication date Feb 6, 2025
- Hitachi High-Tech Corporation
- Kenta NAKAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A POWER FINFET, AND POWER FINFET
- Publication number 20250048670
- Publication date Feb 6, 2025
- ROBERT BOSCH GmbH
- Daniel Krebs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A POWER FINFET, AND POWER FINFET
- Publication number 20250048674
- Publication date Feb 6, 2025
- ROBERT BOSCH GmbH
- Daniel Krebs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20250048703
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20250046616
- Publication date Feb 6, 2025
- SCREEN Holdings Co., Ltd.
- Linh Da HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS
- Publication number 20250046619
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Guifu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED PATTERNING WITH COLORED BLOCKING AND STRUCTURES RESULT...
- Publication number 20250046713
- Publication date Feb 6, 2025
- Intel Corporation
- Mohit K. HARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS WITH HEATED FILTER AND OPERATION METHOD OF THE SAME
- Publication number 20250046584
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Lun LU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DOPED DIAMOND-LIKE CARBON
- Publication number 20250046610
- Publication date Feb 6, 2025
- Applied Materials, Inc.
- Jialiang WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
NEUTRAL STRESS DIAMOND-LIKE CARBON
- Publication number 20250046611
- Publication date Feb 6, 2025
- Applied Materials, Inc.
- Jialiang WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR LATERAL ETCH WITH BOTTOM PASSIVATION
- Publication number 20250046617
- Publication date Feb 6, 2025
- TOKYO ELECTRON LIMITED
- Adam Pranda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250048666
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pin-Chu LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250040222
- Publication date Jan 30, 2025
- RENESAS ELECTRONICS CORPORATION
- Yu NAGAHAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL-RESISTANT PROTECTIVE FILM-FORMING COMPOSITION HAVING CATEC...
- Publication number 20250034427
- Publication date Jan 30, 2025
- NISSAN CHEMICAL CORPORATION
- Shun KUBODERA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR MANUFAC...
- Publication number 20250038005
- Publication date Jan 30, 2025
- Hitachi High-Tech Corporation
- Yoshihide YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING SAME
- Publication number 20250040224
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCHING PROCESSES
- Publication number 20250037970
- Publication date Jan 30, 2025
- ASM IP HOLDING B.V.
- Tom E. Blomberg
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

to form insulating layers thereon

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method of manufacture

Compound, polymer, pattern forming material, pattern forming method...

Bath systems and methods thereof

Composition and method for silicon nitride CMP

Etching apparatus

Metal-insulator-metal structure

Semiconductor structure and manufacturing method thereof

Plasma etching method and plasma etching apparatus

Area selective organic material removal

Substrate structuring method

Substrate processing apparatus for manufacturing semiconductor device

High voltage device

Method of running an etch process in higher selectivity to mask and...

Method of manufacturing vias with pulsing plasma

Method of fabricating a semiconductor device

Semiconductor devices and manufacturing methods of the same

Method for forming semiconductor structure

Method for FinFet fabrication and structure thereof

Semiconductor devices with backside air gap dielectric

Method of manufacturing semiconductor device

Forming an oxide volume within a fin

Manufacturing method of metal grid, thin film sensor and manufactur...

Semiconductor device and manufacturing method thereof

Semiconductor device and method

HEMT and fabricating method of the same

Dual metal silicide structures for advanced integrated circuit stru...

Method of manufacturing a via and a metal wiring for a semiconducto...

Semiconductor device and manufacturing method of the semiconductor...

Semiconductor manufacturing system, method of manufacturing a semic...

Plasma etching method using perfluoropropyl carbinol

Patents Applicationslast 30 patents

METHODS OF ETCHING OXYGEN-CONTAINING FEATURES AT LOW TEMPERATURES

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

METHOD FOR REDUCING VARIATIONS IN MASK TOPOGRAPHY

METHOD FOR DOPING CARBON IN THIN FILM ON WAFER

ETCHING METHOD

MEMORY ARRAYS AND METHODS USED IN FORMING A MEMORY ARRAY COMPRISING...

SEMICONDUCTOR PHOTORESIST COMPOSITION AND METHOD OF FORMING PATTERN...

METHOD FOR REDUCING WAFER EDGE DEFECTS

FULLY SELF-ALIGNED VIA WITH GRAPHENE CAP

APPARATUS WITH IMPLANTED ALIGNMENT MARK AND METHODS OF MANUFACTURIN...

DIAMOND-LIKE CARBON GAP FILL

ETCHING METHOD

HIGH CONDUCTIVE PASSIVATION LAYERS AND METHOD OF FORMING THE SAME D...

PLASMA PROCESSING METHOD

METHOD FOR PRODUCING A POWER FINFET, AND POWER FINFET

METHOD FOR PRODUCING A POWER FINFET, AND POWER FINFET

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

SUBSTRATE PROCESSING METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS

SELF-ALIGNED PATTERNING WITH COLORED BLOCKING AND STRUCTURES RESULT...

APPARATUS WITH HEATED FILTER AND OPERATION METHOD OF THE SAME

DOPED DIAMOND-LIKE CARBON

NEUTRAL STRESS DIAMOND-LIKE CARBON

METHOD FOR LATERAL ETCH WITH BOTTOM PASSIVATION

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

CHEMICAL-RESISTANT PROTECTIVE FILM-FORMING COMPOSITION HAVING CATEC...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR MANUFAC...

INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING SAME

ATOMIC LAYER ETCHING PROCESSES