to modify their internal properties

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CPC
H01L21/322

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/322to modify their internal properties

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for enhancing stability of N-type semiconductor through oxyg...
- Patent number 12,191,159
- Issue date Jan 7, 2025
- Tianjin University
- Liqiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a semiconductor superlattices with different non-...
- Patent number 12,191,160
- Issue date Jan 7, 2025
- ATOMERA INCORPORATED
- Keith Doran Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shutter disk
- Patent number 12,148,629
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Kang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gallium Nitride high-electron mobility transistors with p-type laye...
- Patent number 12,142,674
- Issue date Nov 12, 2024
- Wolfspeed, Inc.
- Saptharishi Sriram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon wafer and manufacturing method of the same
- Patent number 12,142,645
- Issue date Nov 12, 2024
- Sumco Corporation
- Kazuhisa Torigoe
- C30 - CRYSTAL GROWTH
Information Patent Grant
Methods for forming trench structures in substrates
- Patent number 12,125,714
- Issue date Oct 22, 2024
- Applied Materials, Inc.
- Taichou Papo Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a substrate for a front-facing image sensor
- Patent number 12,100,727
- Issue date Sep 24, 2024
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered polysilicon and oxygen-doped polysilicon design for R...
- Patent number 12,074,036
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 12,074,213
- Issue date Aug 27, 2024
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 12,062,582
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Chao Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming thereof
- Patent number 12,020,950
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- I-Sheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RFSOI semiconductor structures including a nitrogen-doped charge-tr...
- Patent number 11,984,477
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing silicon single crystal wafer and silicon s...
- Patent number 11,959,191
- Issue date Apr 16, 2024
- Shin-Etsu Handotai Co., Ltd.
- Wei Feng Qu
- C30 - CRYSTAL GROWTH
Information Patent Grant
Methods and devices related to radio frequency devices
- Patent number 11,948,802
- Issue date Apr 2, 2024
- Infineon Technologies Dresden GmbH & Co. KG
- Hans Taddiken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 11,948,847
- Issue date Apr 2, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Radio frequency silicon on insulator structure with superior perfor...
- Patent number 11,942,360
- Issue date Mar 26, 2024
- GlobalWafers Co., Ltd.
- Michael R. Seacrist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor epitaxial wafer and method of producing semiconductor...
- Patent number 11,935,745
- Issue date Mar 19, 2024
- Sumco Corporation
- Ryosuke Okuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a porous portion in a substrate
- Patent number 11,901,194
- Issue date Feb 13, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Shay Reboh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon on insulator (SOI) device and forming method thereof
- Patent number 11,888,025
- Issue date Jan 30, 2024
- United Microelectronics Corp.
- Po-Yu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency silicon on insulator wafer platform with superior p...
- Patent number 11,887,885
- Issue date Jan 30, 2024
- GlobalWafers Co., Ltd.
- Michael R. Seacrist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques and apparatus for anisotropic stress compensation in sub...
- Patent number 11,875,995
- Issue date Jan 16, 2024
- Applied Materials, Inc.
- Scott Falk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High brightness LEDs with non-specular nanostructured thin film ref...
- Patent number 11,870,012
- Issue date Jan 9, 2024
- Lumileds LLC
- Venkata Ananth Tamma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shutter disk
- Patent number 11,862,480
- Issue date Jan 2, 2024
- Applied Materials, Inc.
- Kang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 11,824,095
- Issue date Nov 21, 2023
- Fuji Electric Co., Ltd.
- Takashi Yoshimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal mitigation die using back side etch
- Patent number 11,817,365
- Issue date Nov 14, 2023
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for stressing semiconductor substrates
- Patent number 11,764,071
- Issue date Sep 19, 2023
- GlobalWafers Co., Ltd.
- Robert J. Falster
- C30 - CRYSTAL GROWTH
Information Patent Grant
Epitaxial wafer manufacturing method and epitaxial wafer
- Patent number RE49657
- Issue date Sep 12, 2023
- Sumco Corporation
- Takuro Iwanaga
Information Patent Grant
Exposure apparatus, exposure method, and method for manufacturing s...
- Patent number 11,747,737
- Issue date Sep 5, 2023
- Canon Kabushiki Kaisha
- Kazuhiro Takahashi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Vertical power semiconductor device including a field stop region h...
- Patent number 11,742,384
- Issue date Aug 29, 2023
- Infineon Technologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon wafer and manufacturing method of the same
- Patent number 11,695,048
- Issue date Jul 4, 2023
- Sumco Corporation
- Kazuhisa Torigoe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MAKING MEMORY DEVICE INCLUDING A SUPERLATTICE GETTERING...
- Publication number 20250014896
- Publication date Jan 9, 2025
- ATOMERA INCORPORATED
- HIDEKI TAKEUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR A FRONT-FACING IMAGE SENSOR
- Publication number 20250015122
- Publication date Jan 9, 2025
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL WAFER AND PRODUCTION METHOD THEREFOR
- Publication number 20240395563
- Publication date Nov 28, 2024
- Shin-Etsu Handotai Co., Ltd.
- Atsushi SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE HAVING GATE DIELECTRIC LAYER
- Publication number 20240395564
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW CAPACITANCE AND LOW RESISTANCE DEVICES
- Publication number 20240339527
- Publication date Oct 10, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Judson R. HOLT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD OF BONDED WAFER
- Publication number 20240304457
- Publication date Sep 12, 2024
- Disco Corporation
- Hayato TANAKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PRODUCING SEMICONDUCTOR EPITAXIAL WAFER, SEMICONDUCTOR EP...
- Publication number 20240297201
- Publication date Sep 5, 2024
- SUMCO CORPORATION
- Takeshi Kadono
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESSING METHOD OF BONDED WAFER
- Publication number 20240297052
- Publication date Sep 5, 2024
- Disco Corporation
- Hayato TANAKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PRODUCING SEMICONDUCTOR EPITAXIAL WAFER, SEMICONDUCTOR EP...
- Publication number 20240282801
- Publication date Aug 22, 2024
- SUMCO CORPORATION
- Takeshi KADONO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SILICON CARBIDE EPITAXIAL SUBSTRATE AND METHOD OF MANUFACTURING SIL...
- Publication number 20240274434
- Publication date Aug 15, 2024
- Sumitomo Electric Industries, Ltd.
- Hiroki NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RFSOI SEMICONDUCTOR STRUCTURES INCLUDING A NITROGEN-DOPED CHARGE-TR...
- Publication number 20240274659
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ENHANCING STABILITY OF N-TYPE SEMICONDUCTOR THROUGH OXYG...
- Publication number 20240266187
- Publication date Aug 8, 2024
- TIANJIN UNIVERSITY
- Liqiang LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SiC EPITAXIAL WAFER AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240222125
- Publication date Jul 4, 2024
- Resonac Corporation
- Yoshikazu Umeta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20240162102
- Publication date May 16, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS AND DEVICES RELATED TO RADIO FREQUENCY DEVICES
- Publication number 20240145253
- Publication date May 2, 2024
- Infineon Technologies Dresden GmbH & Co., KG
- Hans Taddiken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON ON INSULATOR DEVICE
- Publication number 20240128317
- Publication date Apr 18, 2024
- UNITED MICROELECTRONICS CORP.
- Po-Yu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20240120245
- Publication date Apr 11, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Shutter Disk
- Publication number 20240087913
- Publication date Mar 14, 2024
- Applied Materials, Inc.
- Kang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING GROUP III NITRIDE SEMICONDUCTOR SUBSTRATE
- Publication number 20240071756
- Publication date Feb 29, 2024
- SUMCO CORPORATION
- Koji MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT SUBSTRATE MADE OF SILICON SUITABLE FOR RADIOFREQUENCY APPLI...
- Publication number 20240071755
- Publication date Feb 29, 2024
- SOITEC
- Oleg Kononchuk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES SEMICONDUCTOR DEVICES
- Publication number 20240071775
- Publication date Feb 29, 2024
- Semiconductor Components Industries, LLC
- David LYSACEK
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD FOR PRODUCING AN EPITAXIAL WAFER
- Publication number 20240063027
- Publication date Feb 22, 2024
- Shin-Etsu Handotai Co., Ltd.
- Katsuyoshi SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20240047535
- Publication date Feb 8, 2024
- Fuji Electric Co., Ltd.
- Takashi YOSHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A SEMICONDUCTOR STRUCTURE COMPRISING AN INTERF...
- Publication number 20240030033
- Publication date Jan 25, 2024
- Gweltaz Gaudin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20230402511
- Publication date Dec 14, 2023
- Fuji Electric Co., Ltd.
- Motoyoshi KUBOUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATES AND METHODS OF PRODUCING THE SAME
- Publication number 20230395376
- Publication date Dec 7, 2023
- IMEC vzw
- Bertrand Parvais
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20230378003
- Publication date Nov 23, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Li-Chao YIN
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Vertical Power Semiconductor Device and Manufacturing Method
- Publication number 20230352531
- Publication date Nov 2, 2023
- INFINEON TECHNOLOGIES AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE
- Publication number 20230335410
- Publication date Oct 19, 2023
- Mitsubishi Electric Corporation
- Akira KIYOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GETTERING LAYER FORMING DEVICE AND PROCESSING APPARATUS
- Publication number 20230321781
- Publication date Oct 12, 2023
- Disco Corporation
- Fumiteru TASHINO
- B24 - GRINDING POLISHING

to modify their internal properties

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for enhancing stability of N-type semiconductor through oxyg...

Method for making a semiconductor superlattices with different non-...

Shutter disk

Gallium Nitride high-electron mobility transistors with p-type laye...

Silicon wafer and manufacturing method of the same

Methods for forming trench structures in substrates

Method for manufacturing a substrate for a front-facing image sensor

Multi-layered polysilicon and oxygen-doped polysilicon design for R...

Methods and devices for fabricating and assembling printable semico...

Method of manufacturing semiconductor devices

Semiconductor structure and method for forming thereof

RFSOI semiconductor structures including a nitrogen-doped charge-tr...

Method for manufacturing silicon single crystal wafer and silicon s...

Methods and devices related to radio frequency devices

Bonded structures

Radio frequency silicon on insulator structure with superior perfor...

Semiconductor epitaxial wafer and method of producing semiconductor...

Method of forming a porous portion in a substrate

Silicon on insulator (SOI) device and forming method thereof

Radio frequency silicon on insulator wafer platform with superior p...

Techniques and apparatus for anisotropic stress compensation in sub...

High brightness LEDs with non-specular nanostructured thin film ref...

Shutter disk

Semiconductor device and semiconductor device manufacturing method

Thermal mitigation die using back side etch

Apparatus for stressing semiconductor substrates

Epitaxial wafer manufacturing method and epitaxial wafer

Exposure apparatus, exposure method, and method for manufacturing s...

Vertical power semiconductor device including a field stop region h...

Silicon wafer and manufacturing method of the same

Patents Applicationslast 30 patents

METHOD FOR MAKING MEMORY DEVICE INCLUDING A SUPERLATTICE GETTERING...

STRUCTURE FOR A FRONT-FACING IMAGE SENSOR

EPITAXIAL WAFER AND PRODUCTION METHOD THEREFOR

SEMICONDUCTOR DEVICE STRUCTURE HAVING GATE DIELECTRIC LAYER

LOW CAPACITANCE AND LOW RESISTANCE DEVICES

PROCESSING METHOD OF BONDED WAFER

METHOD OF PRODUCING SEMICONDUCTOR EPITAXIAL WAFER, SEMICONDUCTOR EP...

PROCESSING METHOD OF BONDED WAFER

METHOD OF PRODUCING SEMICONDUCTOR EPITAXIAL WAFER, SEMICONDUCTOR EP...

SILICON CARBIDE EPITAXIAL SUBSTRATE AND METHOD OF MANUFACTURING SIL...

RFSOI SEMICONDUCTOR STRUCTURES INCLUDING A NITROGEN-DOPED CHARGE-TR...

METHOD FOR ENHANCING STABILITY OF N-TYPE SEMICONDUCTOR THROUGH OXYG...

SiC EPITAXIAL WAFER AND METHOD FOR MANUFACTURING THE SAME

BONDED STRUCTURES

METHODS AND DEVICES RELATED TO RADIO FREQUENCY DEVICES

SILICON ON INSULATOR DEVICE

BONDED STRUCTURES

Shutter Disk

METHOD FOR MANUFACTURING GROUP III NITRIDE SEMICONDUCTOR SUBSTRATE

SUPPORT SUBSTRATE MADE OF SILICON SUITABLE FOR RADIOFREQUENCY APPLI...

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES SEMICONDUCTOR DEVICES

METHOD FOR PRODUCING AN EPITAXIAL WAFER

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

METHOD FOR PRODUCING A SEMICONDUCTOR STRUCTURE COMPRISING AN INTERF...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR SUBSTRATES AND METHODS OF PRODUCING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES

Vertical Power Semiconductor Device and Manufacturing Method

SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE

GETTERING LAYER FORMING DEVICE AND PROCESSING APPARATUS