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CPC
H05K2203/01

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/01Tools for processing Objects used during processing

Industries

Patents Grantslast 30 patents

Information Patent Grant
Metal pattern forming method
- Patent number 12,185,472
- Issue date Dec 31, 2024
- FUJIFILM Corporation
- Eijiro Iwase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing substrate with sensor
- Patent number 12,167,542
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Manabu Nakagawasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Screen loading system
- Patent number 12,162,264
- Issue date Dec 10, 2024
- ASMPT SMT SINGAPORE PTE. LTD.
- Christopher Sheppard
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Systems and methods for additive manufacturing passive resistor-cap...
- Patent number 12,133,336
- Issue date Oct 29, 2024
- Nano Dimension Technologies, LTD.
- Daniel Sokol
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterned article including electrically conductive elements
- Patent number 12,133,327
- Issue date Oct 29, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Maintaining the shape of a circuit board
- Patent number 12,127,334
- Issue date Oct 22, 2024
- Dis Tech America, LLC
- Heng-Kit Too
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Barrier for preventing SMD components from drifting
- Patent number 12,127,350
- Issue date Oct 22, 2024
- ZKW GROUP GMBH
- Christoph Haiden
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for transferring micro device on curved surface and apparatu...
- Patent number 12,127,349
- Issue date Oct 22, 2024
- Korea Institute of Machinery & Materials
- Bongkyun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing substrate and manufacturing method thereof and probe card
- Patent number 12,108,543
- Issue date Oct 1, 2024
- Hermes Testing Solutions Inc.
- Chiao-Pei Chen
- G01 - MEASURING TESTING
Information Patent Grant
System and method for creating orthogonal solder interconnects
- Patent number 12,108,542
- Issue date Oct 1, 2024
- Raytheon Company
- Justin A. Kasemodel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of dispensing a metallic nanoparticle composition from a no...
- Patent number 12,101,893
- Issue date Sep 24, 2024
- XTPL S.A.
- Mateusz Zając
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Semi-automatic corrosion box of copper clad laminate
- Patent number 12,101,892
- Issue date Sep 24, 2024
- Dalian University of Technology
- Shengming Li
- B32 - LAYERED PRODUCTS
Information Patent Grant
System and method for manufacturing composite substrate
- Patent number 12,082,348
- Issue date Sep 3, 2024
- Doosan Corporation
- Sungmoon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing cured film, method for manufacturing elect...
- Patent number 12,077,677
- Issue date Sep 3, 2024
- Sekisui Chemical Co., Ltd.
- Mitsuru Tanikawa
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method for manufacturing microelectrode film
- Patent number 12,063,749
- Issue date Aug 13, 2024
- BOE Technology Group Co., Ltd.
- Fan Li
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Inkjet printer with substrate height position control
- Patent number 12,049,078
- Issue date Jul 30, 2024
- Kateeva, Inc.
- Digby Pun
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Dispensing patterns including lines and dots at high speeds
- Patent number 12,052,828
- Issue date Jul 30, 2024
- nScrypt, Inc.
- Kenneth H. Church
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sintering device and method for manufacturing an electroni...
- Patent number 12,046,576
- Issue date Jul 23, 2024
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned conductive article
- Patent number 12,048,092
- Issue date Jul 23, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier comprising at least two components
- Patent number 12,041,721
- Issue date Jul 16, 2024
- AT&S(Chongqing) Company Limited
- Dominik Wilding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-demand method of making PCB pallets using additive manufacturing
- Patent number 12,041,723
- Issue date Jul 16, 2024
- JABIL INC.
- Luke Rodgers
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Device including semiconductor chips and method for producing such...
- Patent number 12,027,481
- Issue date Jul 2, 2024
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guided transport path correction
- Patent number 12,028,991
- Issue date Jul 2, 2024
- Kateeva, Inc.
- Eliyahu Vronsky
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Transfer printing high-precision devices
- Patent number 12,016,131
- Issue date Jun 18, 2024
- X Display Company Technology Limited
- Matthew Alexander Meitl
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Electrowetting assisted selective printing
- Patent number 12,011,759
- Issue date Jun 18, 2024
- United States of America as represented by the Secretary of the Air Force
- Christopher E Tabor
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
System and method for controlling powder bed density for 3D printing
- Patent number 11,998,982
- Issue date Jun 4, 2024
- Desktop Metal, Inc.
- George Hudelson
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Short or near short etch rework
- Patent number 12,004,307
- Issue date Jun 4, 2024
- International Business Machines Corporation
- Colin Edward Masterson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density organic bridge device and method
- Patent number 12,002,762
- Issue date Jun 4, 2024
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printer for applying a conductive pattern to a surface
- Patent number 11,969,992
- Issue date Apr 30, 2024
- HEMPEL A/S
- Josep Palasi Bargallo
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Mounting device and control method for same
- Patent number 11,968,785
- Issue date Apr 23, 2024
- FUJI CORPORATION
- Hidetoshi Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING AN ANGULAR POSITION SENSOR
- Publication number 20250040057
- Publication date Jan 30, 2025
- BAUMUELLER NUERNBERG GMBH
- Johannes PIRLING
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERNED ARTICLE INCLUDING ELECTRICALLY CONDUCTIVE ELEMENTS
- Publication number 20250016916
- Publication date Jan 9, 2025
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ESTABLISHING AN ELECTRICAL CONNECTION AND/OR COMMUNICATI...
- Publication number 20250008664
- Publication date Jan 2, 2025
- SIEMENS AKTIENGESELLSCHAFT
- Jens JÄHNICKE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT-FORMING METHOD AND CIRCUIT-FORMING APPARATUS
- Publication number 20240422916
- Publication date Dec 19, 2024
- FUJI CORPORATION
- Kenji TSUKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD INSPECTION DEVICE AND BOARD INSPECTION METHOD
- Publication number 20240414905
- Publication date Dec 12, 2024
- CKD CORPORATION
- Kazuyoshi Kikuchi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BONDING MODULE AND A BONDING DEVICE
- Publication number 20240409355
- Publication date Dec 12, 2024
- ALL RING TECH CO., LTD.
- Chuen-Fa SHIH
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
BONDING METHOD AND A BONDING APPARATUS FOR IMPLEMENTING THE BONDING...
- Publication number 20240409354
- Publication date Dec 12, 2024
- ALL RING TECH CO., LTD.
- Chuen-Fa SHIH
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
METHOD OF SEGMENTED ELECTROPLATING GOLD FINGER
- Publication number 20240397631
- Publication date Nov 28, 2024
- Gold Circuit Electronics Ltd.
- Chen-Tse Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRESS PAD
- Publication number 20240391201
- Publication date Nov 28, 2024
- Hueck Rheinische GmbH
- Rolf Espe
- B30 - PRESSES
Information Patent Application
SYSTEM AND METHOD FOR FORMING BOARD MULTI-LAYERS OF MULTILAYER PRIN...
- Publication number 20240397634
- Publication date Nov 28, 2024
- FIND HOW ENTERPRISE CO. LTD.
- Kuo-Ching Yeh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE HAVING ELECTRONIC COMPONENT MOUNTED IN A CAVITY OF A CORE...
- Publication number 20240373561
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Jung Won PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, DISPLAY APPARATUS, AND MANUFACTURING METHOD FOR CIRC...
- Publication number 20240365478
- Publication date Oct 31, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Guoteng LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...
- Publication number 20240355767
- Publication date Oct 24, 2024
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INKJET PRINTER WITH SUBSTRATE HEIGHT POSITION CONTROL
- Publication number 20240343049
- Publication date Oct 17, 2024
- Kateeva, Inc.
- Digby Pun
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Component Carrier Method of Manufacturing the Component Carrier and...
- Publication number 20240334617
- Publication date Oct 3, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Hans PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD
- Publication number 20240321762
- Publication date Sep 26, 2024
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DONOR PLATE, DEPOSITION DEVICE AND DEPOSITION METHOD
- Publication number 20240314935
- Publication date Sep 19, 2024
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Rob Jacob HENDRIKS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD LAYER BUILD-UP PROCESS WITH ENHANCED POSITIONING PREC...
- Publication number 20240314942
- Publication date Sep 19, 2024
- Chia-Ming LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLATING APPARATUS
- Publication number 20240314936
- Publication date Sep 19, 2024
- EBARA CORPORATION
- Tsubasa ISHII
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GUIDED TRANSPORT PATH CORRECTION
- Publication number 20240314941
- Publication date Sep 19, 2024
- Kateeva, Inc.
- Eliyahu Vronsky
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
SOLDER-PRINTING STENCIL AND METHOD OF PRINTING SOLDER PASTE
- Publication number 20240306307
- Publication date Sep 12, 2024
- Shenzhen china Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Zhuhui LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERNED CONDUCTIVE ARTICLE
- Publication number 20240306290
- Publication date Sep 12, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER PRINTING HIGH-PRECISION DEVICES
- Publication number 20240292543
- Publication date Aug 29, 2024
- X Display Company Technology Limited
- Matthew Alexander Meitl
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
REMOVABLE LID FOR FLIP CHIP-BALL GRID ARRAY (FC-BGA) PACKAGES
- Publication number 20240284603
- Publication date Aug 22, 2024
- MELLANOX TECHNOLOGIES, LTD.
- Eitan Ariel Caplan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20240284601
- Publication date Aug 22, 2024
- FUJIFILM CORPORATION
- Norihide SHIMOHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY SOLDERING APPARATUS AND CIRCUIT BOARD ASSEMB...
- Publication number 20240269759
- Publication date Aug 15, 2024
- Honor Device Co., Ltd.
- Jianqiang GUO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FABRICATING FUNCTIONAL CIRCUITS ON 3D FREEFORM SURFACES VIA INTENSE...
- Publication number 20240276648
- Publication date Aug 15, 2024
- The Penn State Research Foundation
- Ning Yi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BASE BOARD FLOATING ARM
- Publication number 20240276647
- Publication date Aug 15, 2024
- Sheng Chuan Technology Co., Ltd.
- Hsin-Jung Peng
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240268034
- Publication date Aug 8, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jesang Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLY SHEET
- Publication number 20240244756
- Publication date Jul 18, 2024
- Nitto Denko Corporation
- Chihiro WATANABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Tools for processing Objects used during processing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Metal pattern forming method

Method for manufacturing substrate with sensor

Screen loading system

Systems and methods for additive manufacturing passive resistor-cap...

Patterned article including electrically conductive elements

Maintaining the shape of a circuit board

Barrier for preventing SMD components from drifting

Method for transferring micro device on curved surface and apparatu...

Testing substrate and manufacturing method thereof and probe card

System and method for creating orthogonal solder interconnects

Methods of dispensing a metallic nanoparticle composition from a no...

Semi-automatic corrosion box of copper clad laminate

System and method for manufacturing composite substrate

Method for manufacturing cured film, method for manufacturing elect...

Method for manufacturing microelectrode film

Inkjet printer with substrate height position control

Dispensing patterns including lines and dots at high speeds

Pressure sintering device and method for manufacturing an electroni...

Patterned conductive article

Component carrier comprising at least two components

On-demand method of making PCB pallets using additive manufacturing

Device including semiconductor chips and method for producing such...

Guided transport path correction

Transfer printing high-precision devices

Electrowetting assisted selective printing

System and method for controlling powder bed density for 3D printing

Short or near short etch rework

High density organic bridge device and method

Printer for applying a conductive pattern to a surface

Mounting device and control method for same

Patents Applicationslast 30 patents

METHOD FOR PRODUCING AN ANGULAR POSITION SENSOR

PATTERNED ARTICLE INCLUDING ELECTRICALLY CONDUCTIVE ELEMENTS

METHOD FOR ESTABLISHING AN ELECTRICAL CONNECTION AND/OR COMMUNICATI...

CIRCUIT-FORMING METHOD AND CIRCUIT-FORMING APPARATUS

BOARD INSPECTION DEVICE AND BOARD INSPECTION METHOD

BONDING MODULE AND A BONDING DEVICE

BONDING METHOD AND A BONDING APPARATUS FOR IMPLEMENTING THE BONDING...

METHOD OF SEGMENTED ELECTROPLATING GOLD FINGER

PRESS PAD

SYSTEM AND METHOD FOR FORMING BOARD MULTI-LAYERS OF MULTILAYER PRIN...

SUBSTRATE HAVING ELECTRONIC COMPONENT MOUNTED IN A CAVITY OF A CORE...

CIRCUIT BOARD, DISPLAY APPARATUS, AND MANUFACTURING METHOD FOR CIRC...

DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...

INKJET PRINTER WITH SUBSTRATE HEIGHT POSITION CONTROL

Component Carrier Method of Manufacturing the Component Carrier and...

HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD

DONOR PLATE, DEPOSITION DEVICE AND DEPOSITION METHOD

CIRCUIT BOARD LAYER BUILD-UP PROCESS WITH ENHANCED POSITIONING PREC...

PLATING APPARATUS

GUIDED TRANSPORT PATH CORRECTION

SOLDER-PRINTING STENCIL AND METHOD OF PRINTING SOLDER PASTE

PATTERNED CONDUCTIVE ARTICLE

TRANSFER PRINTING HIGH-PRECISION DEVICES

REMOVABLE LID FOR FLIP CHIP-BALL GRID ARRAY (FC-BGA) PACKAGES

MANUFACTURING METHOD OF ELECTRONIC DEVICE

CIRCUIT BOARD ASSEMBLY SOLDERING APPARATUS AND CIRCUIT BOARD ASSEMB...

FABRICATING FUNCTIONAL CIRCUITS ON 3D FREEFORM SURFACES VIA INTENSE...

BASE BOARD FLOATING ARM

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

ASSEMBLY SHEET