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CPC
H05K2203/01

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/01Tools for processing Objects used during processing

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic device
- Patent number 12,309,931
- Issue date May 20, 2025
- Innolux Corporation
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board assembly soldering apparatus and circuit board assemb...
- Patent number 12,303,990
- Issue date May 20, 2025
- HONOR DEVICE CO., LTD.
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Temporary carrier and method for manufacturing coreless substrate t...
- Patent number 12,302,508
- Issue date May 13, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing circuits of substrate of display device
- Patent number 12,295,106
- Issue date May 6, 2025
- TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Tong Deng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Determining component height deviations
- Patent number 12,281,892
- Issue date Apr 22, 2025
- ASMPT SMT SINGAPORE PTE. LTD.
- Tom Falcon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of dispensing paste for a printer using a paste dispensing a...
- Patent number 12,275,232
- Issue date Apr 15, 2025
- Applied Materials Italia S.R.L.
- Davide Colla
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Solder-printing stencil and method of printing solder paste
- Patent number 12,274,008
- Issue date Apr 8, 2025
- SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Zhuhui Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for producing an etch resist pattern on a metallic surface
- Patent number 12,270,111
- Issue date Apr 8, 2025
- Kateeva, Inc.
- Nava Shpaisman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal foil with carrier
- Patent number 12,247,280
- Issue date Mar 11, 2025
- Mitsui Mining & Smelting Co., Ltd.
- Yukiko Kitabatake
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
On-demand method of making PCB pallets using additive manufacturing
- Patent number 12,238,868
- Issue date Feb 25, 2025
- JABIL INC.
- Luke Rodgers
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Squeegee holder with an integrated clamp bar
- Patent number 12,226,062
- Issue date Feb 18, 2025
- Transition Automation, Inc.
- Mark J. Curtin
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Doctoring unit for a printing apparatus
- Patent number 12,226,998
- Issue date Feb 18, 2025
- EKRA AUTOMATISIERUNGSSYSTEME GMBH
- Torsten Vegelahn
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Metal pattern forming method
- Patent number 12,185,472
- Issue date Dec 31, 2024
- FUJIFILM Corporation
- Eijiro Iwase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Screen loading system
- Patent number 12,162,264
- Issue date Dec 10, 2024
- ASMPT SMT SINGAPORE PTE. LTD.
- Christopher Sheppard
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method for manufacturing substrate with sensor
- Patent number 12,167,542
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Manabu Nakagawasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for additive manufacturing passive resistor-cap...
- Patent number 12,133,336
- Issue date Oct 29, 2024
- Nano Dimension Technologies, LTD.
- Daniel Sokol
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterned article including electrically conductive elements
- Patent number 12,133,327
- Issue date Oct 29, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Maintaining the shape of a circuit board
- Patent number 12,127,334
- Issue date Oct 22, 2024
- Dis Tech America, LLC
- Heng-Kit Too
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Barrier for preventing SMD components from drifting
- Patent number 12,127,350
- Issue date Oct 22, 2024
- ZKW GROUP GMBH
- Christoph Haiden
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for transferring micro device on curved surface and apparatu...
- Patent number 12,127,349
- Issue date Oct 22, 2024
- Korea Institute of Machinery & Materials
- Bongkyun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing substrate and manufacturing method thereof and probe card
- Patent number 12,108,543
- Issue date Oct 1, 2024
- Hermes Testing Solutions Inc.
- Chiao-Pei Chen
- G01 - MEASURING TESTING
Information Patent Grant
System and method for creating orthogonal solder interconnects
- Patent number 12,108,542
- Issue date Oct 1, 2024
- Raytheon Company
- Justin A. Kasemodel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of dispensing a metallic nanoparticle composition from a no...
- Patent number 12,101,893
- Issue date Sep 24, 2024
- XTPL S.A.
- Mateusz Zając
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Semi-automatic corrosion box of copper clad laminate
- Patent number 12,101,892
- Issue date Sep 24, 2024
- Dalian University of Technology
- Shengming Li
- B32 - LAYERED PRODUCTS
Information Patent Grant
System and method for manufacturing composite substrate
- Patent number 12,082,348
- Issue date Sep 3, 2024
- Doosan Corporation
- Sungmoon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing cured film, method for manufacturing elect...
- Patent number 12,077,677
- Issue date Sep 3, 2024
- Sekisui Chemical Co., Ltd.
- Mitsuru Tanikawa
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method for manufacturing microelectrode film
- Patent number 12,063,749
- Issue date Aug 13, 2024
- BOE Technology Group Co., Ltd.
- Fan Li
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Inkjet printer with substrate height position control
- Patent number 12,049,078
- Issue date Jul 30, 2024
- Kateeva, Inc.
- Digby Pun
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Dispensing patterns including lines and dots at high speeds
- Patent number 12,052,828
- Issue date Jul 30, 2024
- nScrypt, Inc.
- Kenneth H. Church
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sintering device and method for manufacturing an electroni...
- Patent number 12,046,576
- Issue date Jul 23, 2024
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FILM-TYPE CIRCUIT AND METHOD OF CONNECTING PRINTED CIRCUIT BOARDS V...
- Publication number 20250142726
- Publication date May 1, 2025
- DENSO WAVE INCORPORATED
- Natsuki SUGIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stamping Surface Profile in Design Layer and Filling an Indentation...
- Publication number 20250142736
- Publication date May 1, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Heinrich TRISCHLER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE LINE REPAIRING METHOD
- Publication number 20250142732
- Publication date May 1, 2025
- DETEKT TECHNOLOGY INC.
- YUN-YAO CHIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE PRODUCTION METHOD, WIRING SUBSTRATE, RETICLE, AND...
- Publication number 20250142731
- Publication date May 1, 2025
- Resonac Corporation
- Kei TOGASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PRODUCING PRINTED CIRCUIT BOARD AND METHOD OF FORMING ELE...
- Publication number 20250126721
- Publication date Apr 17, 2025
- Elephantech Inc.
- Shinya SHIMIZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CIRCUIT FORMING METHOD AND ELECTRICAL CIRCUIT FORMING AP...
- Publication number 20250113447
- Publication date Apr 3, 2025
- FUJI CORPORATION
- Tasuku TAKEUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250107005
- Publication date Mar 27, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Xiao-Long HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF DISPENSING PASTE FOR A PRINTER USING A PASTE DISPENSING A...
- Publication number 20250100268
- Publication date Mar 27, 2025
- Applied Materials Italia S.R.L.
- Davide COLLA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Component Carrier and Method of Manufacturing the Same
- Publication number 20250098060
- Publication date Mar 20, 2025
- AT&S (Chongqing) Company Limited
- Lei Tang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BALL ATTACH TOOL
- Publication number 20250089179
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Hyeon Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHEET FIXING DEVICE, SHEET PEELING DEVICE, AND SHEET PEELING METHOD
- Publication number 20250065617
- Publication date Feb 27, 2025
- Mitsui Mining and Smelting Co., Ltd.
- Takenori YANAI
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR PRODUCING AN ANGULAR POSITION SENSOR
- Publication number 20250040057
- Publication date Jan 30, 2025
- BAUMUELLER NUERNBERG GMBH
- Johannes PIRLING
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERNED ARTICLE INCLUDING ELECTRICALLY CONDUCTIVE ELEMENTS
- Publication number 20250016916
- Publication date Jan 9, 2025
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ESTABLISHING AN ELECTRICAL CONNECTION AND/OR COMMUNICATI...
- Publication number 20250008664
- Publication date Jan 2, 2025
- SIEMENS AKTIENGESELLSCHAFT
- Jens JÄHNICKE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT-FORMING METHOD AND CIRCUIT-FORMING APPARATUS
- Publication number 20240422916
- Publication date Dec 19, 2024
- FUJI CORPORATION
- Kenji TSUKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD INSPECTION DEVICE AND BOARD INSPECTION METHOD
- Publication number 20240414905
- Publication date Dec 12, 2024
- CKD CORPORATION
- Kazuyoshi Kikuchi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BONDING MODULE AND A BONDING DEVICE
- Publication number 20240409355
- Publication date Dec 12, 2024
- ALL RING TECH CO., LTD.
- Chuen-Fa SHIH
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
BONDING METHOD AND A BONDING APPARATUS FOR IMPLEMENTING THE BONDING...
- Publication number 20240409354
- Publication date Dec 12, 2024
- ALL RING TECH CO., LTD.
- Chuen-Fa SHIH
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
METHOD OF SEGMENTED ELECTROPLATING GOLD FINGER
- Publication number 20240397631
- Publication date Nov 28, 2024
- Gold Circuit Electronics Ltd.
- Chen-Tse Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR FORMING BOARD MULTI-LAYERS OF MULTILAYER PRIN...
- Publication number 20240397634
- Publication date Nov 28, 2024
- FIND HOW ENTERPRISE CO. LTD.
- Kuo-Ching Yeh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRESS PAD
- Publication number 20240391201
- Publication date Nov 28, 2024
- Hueck Rheinische GmbH
- Rolf Espe
- B30 - PRESSES
Information Patent Application
SUBSTRATE HAVING ELECTRONIC COMPONENT MOUNTED IN A CAVITY OF A CORE...
- Publication number 20240373561
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Jung Won PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, DISPLAY APPARATUS, AND MANUFACTURING METHOD FOR CIRC...
- Publication number 20240365478
- Publication date Oct 31, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Guoteng LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...
- Publication number 20240355767
- Publication date Oct 24, 2024
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INKJET PRINTER WITH SUBSTRATE HEIGHT POSITION CONTROL
- Publication number 20240343049
- Publication date Oct 17, 2024
- Kateeva, Inc.
- Digby Pun
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Component Carrier Method of Manufacturing the Component Carrier and...
- Publication number 20240334617
- Publication date Oct 3, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Hans PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD
- Publication number 20240321762
- Publication date Sep 26, 2024
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DONOR PLATE, DEPOSITION DEVICE AND DEPOSITION METHOD
- Publication number 20240314935
- Publication date Sep 19, 2024
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Rob Jacob HENDRIKS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD LAYER BUILD-UP PROCESS WITH ENHANCED POSITIONING PREC...
- Publication number 20240314942
- Publication date Sep 19, 2024
- Chia-Ming LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLATING APPARATUS
- Publication number 20240314936
- Publication date Sep 19, 2024
- EBARA CORPORATION
- Tsubasa ISHII
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Tools for processing Objects used during processing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device

Circuit board assembly soldering apparatus and circuit board assemb...

Temporary carrier and method for manufacturing coreless substrate t...

Method of producing circuits of substrate of display device

Determining component height deviations

Method of dispensing paste for a printer using a paste dispensing a...

Solder-printing stencil and method of printing solder paste

Methods for producing an etch resist pattern on a metallic surface

Metal foil with carrier

On-demand method of making PCB pallets using additive manufacturing

Squeegee holder with an integrated clamp bar

Doctoring unit for a printing apparatus

Metal pattern forming method

Screen loading system

Method for manufacturing substrate with sensor

Systems and methods for additive manufacturing passive resistor-cap...

Patterned article including electrically conductive elements

Maintaining the shape of a circuit board

Barrier for preventing SMD components from drifting

Method for transferring micro device on curved surface and apparatu...

Testing substrate and manufacturing method thereof and probe card

System and method for creating orthogonal solder interconnects

Methods of dispensing a metallic nanoparticle composition from a no...

Semi-automatic corrosion box of copper clad laminate

System and method for manufacturing composite substrate

Method for manufacturing cured film, method for manufacturing elect...

Method for manufacturing microelectrode film

Inkjet printer with substrate height position control

Dispensing patterns including lines and dots at high speeds

Pressure sintering device and method for manufacturing an electroni...

Patents Applicationslast 30 patents

FILM-TYPE CIRCUIT AND METHOD OF CONNECTING PRINTED CIRCUIT BOARDS V...

Stamping Surface Profile in Design Layer and Filling an Indentation...

CONDUCTIVE LINE REPAIRING METHOD

WIRING SUBSTRATE PRODUCTION METHOD, WIRING SUBSTRATE, RETICLE, AND...

METHOD OF PRODUCING PRINTED CIRCUIT BOARD AND METHOD OF FORMING ELE...

ELECTRICAL CIRCUIT FORMING METHOD AND ELECTRICAL CIRCUIT FORMING AP...

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

METHOD OF DISPENSING PASTE FOR A PRINTER USING A PASTE DISPENSING A...

Component Carrier and Method of Manufacturing the Same

BALL ATTACH TOOL

SHEET FIXING DEVICE, SHEET PEELING DEVICE, AND SHEET PEELING METHOD

METHOD FOR PRODUCING AN ANGULAR POSITION SENSOR

PATTERNED ARTICLE INCLUDING ELECTRICALLY CONDUCTIVE ELEMENTS

METHOD FOR ESTABLISHING AN ELECTRICAL CONNECTION AND/OR COMMUNICATI...

CIRCUIT-FORMING METHOD AND CIRCUIT-FORMING APPARATUS

BOARD INSPECTION DEVICE AND BOARD INSPECTION METHOD

BONDING MODULE AND A BONDING DEVICE

BONDING METHOD AND A BONDING APPARATUS FOR IMPLEMENTING THE BONDING...

METHOD OF SEGMENTED ELECTROPLATING GOLD FINGER

SYSTEM AND METHOD FOR FORMING BOARD MULTI-LAYERS OF MULTILAYER PRIN...

PRESS PAD

SUBSTRATE HAVING ELECTRONIC COMPONENT MOUNTED IN A CAVITY OF A CORE...

CIRCUIT BOARD, DISPLAY APPARATUS, AND MANUFACTURING METHOD FOR CIRC...

DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...

INKJET PRINTER WITH SUBSTRATE HEIGHT POSITION CONTROL

Component Carrier Method of Manufacturing the Component Carrier and...

HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD

DONOR PLATE, DEPOSITION DEVICE AND DEPOSITION METHOD

CIRCUIT BOARD LAYER BUILD-UP PROCESS WITH ENHANCED POSITIONING PREC...

PLATING APPARATUS