Transfer and j oin technology

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B81C2203/0785

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C2203/00Forming micro-structural systems

Current Industry

B81C2203/0785Transfer and j oin technology

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for transferring a layer to a substrate
- Patent number 12,214,580
- Issue date Feb 4, 2025
- Imec VZW
- Boshen Liang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor package and method of producing the sensor package
- Patent number 12,180,066
- Issue date Dec 31, 2024
- Sciosense B.V.
- Willem Frederik Adrianus Besling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
SOC PMUT suitable for high-density system integration, array chip,...
- Patent number 12,060,264
- Issue date Aug 13, 2024
- NANJING SHENGXI XINYING TECHNOLOGY CO., LTD
- Hui Li
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device having a metallization structure embedded in a dielectr...
- Patent number 11,932,534
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS tab removal process
- Patent number 11,905,170
- Issue date Feb 20, 2024
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure including scribe line structures and method...
- Patent number 11,767,219
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wei-Cheng Shen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure for MEMS device
- Patent number 11,312,623
- Issue date Apr 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing a MEMS device by first hybrid bonding a CM...
- Patent number 11,279,615
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated packaging devices and methods with backside interconnect...
- Patent number 11,282,760
- Issue date Mar 22, 2022
- OBSIDIAN SENSORS, INC.
- Yaoling Pan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for setting a pressure in a cavern formed with the aid of a...
- Patent number 11,274,038
- Issue date Mar 15, 2022
- Robert Bosch GmbH
- Johannes Classen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of fabricating semiconductor structure
- Patent number 11,097,941
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsien Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integration scheme for microelectromechanical systems (MEMS) device...
- Patent number 11,078,074
- Issue date Aug 3, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device comprising a micro-electro-mechanical system substrate with...
- Patent number 11,040,871
- Issue date Jun 22, 2021
- Invensense, Inc.
- Jongwoo Shin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a system including a first microelectromechani...
- Patent number 11,014,807
- Issue date May 25, 2021
- Robert Bosch GmbH
- Johannes Classen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor package and method of producing the sensor package
- Patent number 11,001,495
- Issue date May 11, 2021
- Sciosense B.V.
- Willem Frederik Adrianus Besling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
High efficiency getter design in vacuum MEMS device
- Patent number 10,875,764
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Jung Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Rough anti-stiction layer for MEMS device
- Patent number 10,759,654
- Issue date Sep 1, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Jui Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure for MEMS device
- Patent number 10,752,497
- Issue date Aug 25, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS package
- Patent number 10,745,269
- Issue date Aug 18, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Nick Renaud-Bezot
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electro-optical device, manufacturing method of electro-optical dev...
- Patent number 10,739,554
- Issue date Aug 11, 2020
- Seiko Epson Corporation
- Manabu Kondo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and method for fabricating the same
- Patent number 10,737,936
- Issue date Aug 11, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wei-Cheng Shen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bulk acoustic wave resonator on a stress isolated platform
- Patent number 10,651,817
- Issue date May 12, 2020
- Texas Instruments Incorporated
- Ting-Ta Yen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro-mechanical device and manufacturing process thereof
- Patent number 10,626,008
- Issue date Apr 21, 2020
- STMicroelectronics S.r.l.
- Lorenzo Baldo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
High efficiency getter design in vacuum MEMS device
- Patent number 10,526,199
- Issue date Jan 7, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Jung Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integration scheme for microelectromechanical systems (MEMS) device...
- Patent number 10,513,429
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Force sensor and manufacture method thereof
- Patent number 10,486,962
- Issue date Nov 26, 2019
- MIRAMEMS SENSING TECHNOLOGY CO., LTD
- Li-Tien Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated packaging devices and methods with backside interconnect...
- Patent number 10,453,766
- Issue date Oct 22, 2019
- OBSIDIAN SENSORS, INC.
- Yaoling Pan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fully wafer-level-packaged MEMS microphone and method for manufactu...
- Patent number 10,306,372
- Issue date May 28, 2019
- Goertek Inc.
- Quanbo Zou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing a MEMS device by first hybrid bonding a CM...
- Patent number 10,294,098
- Issue date May 21, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate structure, semiconductor structure and method for fabrica...
- Patent number 10,273,140
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsien Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING A MICROELECTROMECHANICAL COMPONENT
- Publication number 20240182298
- Publication date Jun 6, 2024
- ROBERT BOSCH GmbH
- Johannes CLASSEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230365403
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- WEI-CHENG SHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SOC PMUT SUITABLE FOR HIGH-DENSITY SYSTEM INTEGRATION, ARRAY CHIP,...
- Publication number 20230060728
- Publication date Mar 2, 2023
- NANJING SHENGXI XINYING TECHNOLOGY CO., LTD
- Hui LI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Transferring a Layer to a Substrate
- Publication number 20220396067
- Publication date Dec 15, 2022
- IMEC vzw
- Boshen Liang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A MEMS DEVICE BY FIRST HYBRID BONDING A CM...
- Publication number 20220204340
- Publication date Jun 30, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS TAB REMOVAL PROCESS
- Publication number 20220185662
- Publication date Jun 16, 2022
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Sensor Package and Method of Producing the Sensor Package
- Publication number 20210229981
- Publication date Jul 29, 2021
- Sciosense B.V.
- Willem Frederik Adrianus Besling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE FOR MEMS DEVICE
- Publication number 20200361767
- Publication date Nov 19, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Chia Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20200346926
- Publication date Nov 5, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- WEI-CHENG SHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED PACKAGING DEVICES AND METHODS WITH BACKSIDE INTERCONNECT...
- Publication number 20200294878
- Publication date Sep 17, 2020
- Obsidian Sensors, Inc.
- Yaoling Pan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR SETTING A PRESSURE IN A CAVERN FORMED WITH THE AID OF A...
- Publication number 20200180947
- Publication date Jun 11, 2020
- ROBERT BOSCH GmbH
- Johannes CLASSEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATION SCHEME FOR MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICE...
- Publication number 20200115222
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Wen CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HIGH EFFICIENCY GETTER DESIGN IN VACUUM MEMS DEVICE
- Publication number 20200102215
- Publication date Apr 2, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Ting-Jung Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FORCE SENSOR AND MANUFACTURE METHOD THEREOF
- Publication number 20200048074
- Publication date Feb 13, 2020
- MiraMEMS Sensing Technology Co., Ltd.
- Li-Tien TSENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL DEVICE AND MANUFACTURING PROCESS THEREOF
- Publication number 20200024132
- Publication date Jan 23, 2020
- STMicroelectronics S.r.l.
- Lorenzo Baldo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for producing a system including a first microelectromechani...
- Publication number 20190382263
- Publication date Dec 19, 2019
- ROBERT BOSCH GmbH
- Johannes CLASSEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR PACKAGE AND METHOD OF PRODUCING THE SENSOR PACKAGE
- Publication number 20190375628
- Publication date Dec 12, 2019
- ams International AG
- Willem Frederik Adrianus BESLING
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FORCE SENSOR AND MANUFACTURE METHOD THEREOF
- Publication number 20190330053
- Publication date Oct 31, 2019
- MiraMEMS Sensing Technology Co., Ltd.
- Li-Tien TSENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE
- Publication number 20190256347
- Publication date Aug 22, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Hsien CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A MEMS DEVICE BY FIRST HYBRID BONDING A CM...
- Publication number 20190241430
- Publication date Aug 8, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Bulk acoustic Wave Resonator on a Stress Isolated Platform
- Publication number 20190207581
- Publication date Jul 4, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Ting-Ta Yen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE COMPRISING A MICRO-ELECTRO-MECHANICAL SYSTEM SUBSTRATE WITH...
- Publication number 20190185317
- Publication date Jun 20, 2019
- InvenSense, Inc.
- Jongwoo Shin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ROUGH ANTI-STICTION LAYER FOR MEMS DEVICE
- Publication number 20190119099
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Jui Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE FOR MEMS DEVICE
- Publication number 20190112183
- Publication date Apr 18, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Chia Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ROUGH ANTI-STICTION LAYER FOR MEMS DEVICE
- Publication number 20180179047
- Publication date Jun 28, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Jui Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRO-OPTICAL DEVICE, MANUFACTURING METHOD OF ELECTRO-OPTICAL DEV...
- Publication number 20180045912
- Publication date Feb 15, 2018
- SEIKO EPSON CORPORATION
- Manabu KONDO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE FOR MEMS DEVICE
- Publication number 20170369308
- Publication date Dec 28, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Chia Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20170341933
- Publication date Nov 30, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- WEI-CHENG SHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Package
- Publication number 20170320726
- Publication date Nov 9, 2017
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL DEVICE AND MANUFACTURING PROCESS THEREOF
- Publication number 20170253477
- Publication date Sep 7, 2017
- STMicroelectronics S.r.l.
- Lorenzo Baldo
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Transfer and j oin technology

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for transferring a layer to a substrate

Sensor package and method of producing the sensor package

SOC PMUT suitable for high-density system integration, array chip,...

MEMS device having a metallization structure embedded in a dielectr...

MEMS tab removal process

Semiconductor structure including scribe line structures and method...

Semiconductor structure for MEMS device

Method for manufacturing a MEMS device by first hybrid bonding a CM...

Integrated packaging devices and methods with backside interconnect...

Method for setting a pressure in a cavern formed with the aid of a...

Method of fabricating semiconductor structure

Integration scheme for microelectromechanical systems (MEMS) device...

Device comprising a micro-electro-mechanical system substrate with...

Method for producing a system including a first microelectromechani...

Sensor package and method of producing the sensor package

High efficiency getter design in vacuum MEMS device

Rough anti-stiction layer for MEMS device

Semiconductor structure for MEMS device

MEMS package

Electro-optical device, manufacturing method of electro-optical dev...

Semiconductor structure and method for fabricating the same

Bulk acoustic wave resonator on a stress isolated platform

Micro-electro-mechanical device and manufacturing process thereof

High efficiency getter design in vacuum MEMS device

Integration scheme for microelectromechanical systems (MEMS) device...

Force sensor and manufacture method thereof

Integrated packaging devices and methods with backside interconnect...

Fully wafer-level-packaged MEMS microphone and method for manufactu...

Method for manufacturing a MEMS device by first hybrid bonding a CM...

Substrate structure, semiconductor structure and method for fabrica...

Patents Applicationslast 30 patents

METHOD FOR PRODUCING A MICROELECTROMECHANICAL COMPONENT

SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME

SOC PMUT SUITABLE FOR HIGH-DENSITY SYSTEM INTEGRATION, ARRAY CHIP,...

Method for Transferring a Layer to a Substrate

METHOD FOR MANUFACTURING A MEMS DEVICE BY FIRST HYBRID BONDING A CM...

MEMS TAB REMOVAL PROCESS

Sensor Package and Method of Producing the Sensor Package

SEMICONDUCTOR STRUCTURE FOR MEMS DEVICE

SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME

INTEGRATED PACKAGING DEVICES AND METHODS WITH BACKSIDE INTERCONNECT...

METHOD FOR SETTING A PRESSURE IN A CAVERN FORMED WITH THE AID OF A...

INTEGRATION SCHEME FOR MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICE...

HIGH EFFICIENCY GETTER DESIGN IN VACUUM MEMS DEVICE

FORCE SENSOR AND MANUFACTURE METHOD THEREOF

MICRO-ELECTRO-MECHANICAL DEVICE AND MANUFACTURING PROCESS THEREOF

Method for producing a system including a first microelectromechani...

SENSOR PACKAGE AND METHOD OF PRODUCING THE SENSOR PACKAGE

FORCE SENSOR AND MANUFACTURE METHOD THEREOF

METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE

METHOD FOR MANUFACTURING A MEMS DEVICE BY FIRST HYBRID BONDING A CM...

Bulk acoustic Wave Resonator on a Stress Isolated Platform

DEVICE COMPRISING A MICRO-ELECTRO-MECHANICAL SYSTEM SUBSTRATE WITH...

ROUGH ANTI-STICTION LAYER FOR MEMS DEVICE

SEMICONDUCTOR STRUCTURE FOR MEMS DEVICE

ROUGH ANTI-STICTION LAYER FOR MEMS DEVICE

ELECTRO-OPTICAL DEVICE, MANUFACTURING METHOD OF ELECTRO-OPTICAL DEV...

SEMICONDUCTOR STRUCTURE FOR MEMS DEVICE

SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME

MEMS Package

MICRO-ELECTRO-MECHANICAL DEVICE AND MANUFACTURING PROCESS THEREOF