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H01L2224/83096

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83096Transient conditions

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Patents Grantslast 30 patents

Information Patent Grant
Electronic devices formed in a cavity between substrates
- Patent number 11,050,407
- Issue date Jun 29, 2021
- Skyworks Solutions, Inc.
- Atsushi Takano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic devices formed in a cavity between substrates and includ...
- Patent number 10,965,269
- Issue date Mar 30, 2021
- Skyworks Solutions, Inc.
- Atsushi Takano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of manufacturing electronic devices formed in a cavity and...
- Patent number 10,763,820
- Issue date Sep 1, 2020
- SKYWORKS SOLUTIONS, INC.
- Atsushi Takano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of manufacturing electronic devices formed in a cavity
- Patent number 10,439,587
- Issue date Oct 8, 2019
- Skyworks Solutions, Inc.
- Atsushi Takano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate and semiconductor device
- Patent number 7,755,203
- Issue date Jul 13, 2010
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRODUCTION METHOD OF ELECTRONIC APPARATUS, PRODUCTION METHOD OF ELE...
- Publication number 20080202678
- Publication date Aug 28, 2008
- Fujitsu Limited
- Hiroshi KOBAYASHI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Circuit substrate and semiconductor device
- Publication number 20080042300
- Publication date Feb 21, 2008
- FUJITSU LIMITED
- Takao Nishimura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Wafer bonding of damascene-patterned metal/adhesive redistribution...
- Publication number 20070207592
- Publication date Sep 6, 2007
- James Jian-Qiang Lu
- H01 - BASIC ELECTRIC ELEMENTS