Transition between different waveguide types

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H01L2223/6633

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

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H01L2223/6633Transition between different waveguide types

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Patents Grantslast 30 patents

Information Patent Grant
Microwave integrated circuit
- Patent number 12,154,871
- Issue date Nov 26, 2024
- Sumitomo Electric Device Innovations, Inc.
- Kenshi Naito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising a radar semiconductor chip and ass...
- Patent number 12,014,998
- Issue date Jun 18, 2024
- Infineon Technologies AG
- Ernst Seler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for manufacturing display device
- Patent number 11,837,583
- Issue date Dec 5, 2023
- Samsung Display Co., Ltd.
- Euikang Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having multiple dielectric waveguide channe...
- Patent number 11,682,638
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising a radar semiconductor chip and ass...
- Patent number 11,658,135
- Issue date May 23, 2023
- Infineon Technologies AG
- Ernst Seler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with side-radiating wave launcher and waveguide
- Patent number 11,437,706
- Issue date Sep 6, 2022
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave integrated circuit
- Patent number 11,264,341
- Issue date Mar 1, 2022
- Sumitomo Electric Device Innovations, Inc.
- Kenshi Naito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for manufacturing display device
- Patent number 11,171,125
- Issue date Nov 9, 2021
- Samsung Display Co., Ltd.
- Euikang Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF power amplifier pallet
- Patent number 11,075,178
- Issue date Jul 27, 2021
- Ampleon Netherlands B.V.
- Gutta Venkata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna apparatus with integrated antenna array and low loss multi-...
- Patent number 11,049,824
- Issue date Jun 29, 2021
- Viasat, Inc.
- Steven J. Franson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circularly-polarized dielectric waveguide launch for millimeter-wav...
- Patent number 11,011,815
- Issue date May 18, 2021
- Texas Instruments Incorporated
- Hassan Omar Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out transition structure for transmission of mm-Wave signals fr...
- Patent number 10,937,748
- Issue date Mar 2, 2021
- Huawei Technologies Co., Ltd.
- Houssam Kanj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency module
- Patent number 10,861,805
- Issue date Dec 8, 2020
- Fujitsu Limited
- Daijiro Ishibashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable phased array package
- Patent number 10,826,194
- Issue date Nov 3, 2020
- International Business Machines Corporation
- Xiaoxiong Gu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging structure comprising at least one transition forming a co...
- Patent number 10,811,373
- Issue date Oct 20, 2020
- GAPWAVES AB
- Ashraf Uz Zaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable phased array package
- Patent number 10,784,563
- Issue date Sep 22, 2020
- International Business Machines Corporation
- Xiaoxiong Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having multiple dielectric waveguide channe...
- Patent number 10,770,414
- Issue date Sep 8, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless interconnects on flexible cables between computing platforms
- Patent number 10,498,379
- Issue date Dec 3, 2019
- Intel Corporation
- Telesphor Kamgaing
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Transition arrangement comprising a contactless transition or conne...
- Patent number 10,381,317
- Issue date Aug 13, 2019
- Telefonaktiebolaget LM Ericsson (publ)
- Rob Maaskant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waveguide including first and second metal plates and having a slot...
- Patent number 10,056,672
- Issue date Aug 21, 2018
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer including an integrated waveguide for communica...
- Patent number 10,038,232
- Issue date Jul 31, 2018
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including a package substrate having an integrate...
- Patent number 10,033,081
- Issue date Jul 24, 2018
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency semiconductor amplifier
- Patent number 9,985,584
- Issue date May 29, 2018
- Kabushiki Kaisha Toshiba
- Kazutaka Takagi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Waveguide and semiconductor packaging
- Patent number 9,960,204
- Issue date May 1, 2018
- Northrop Grumman Systems Corporation
- Chunbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency semiconductor amplifier
- Patent number 9,929,693
- Issue date Mar 27, 2018
- Kabushiki Kaisha Toshiba
- Kazutaka Takagi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of manufacturing a package for embedding one or more electro...
- Patent number 9,848,500
- Issue date Dec 19, 2017
- Sony Corporation
- Thomas Merkle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, transmission system, method for manufacturing...
- Patent number 9,748,664
- Issue date Aug 29, 2017
- Sony Corporation
- Hirofumi Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coplaner waveguide transition
- Patent number 9,502,382
- Issue date Nov 22, 2016
- Regents of The University of Minnesota
- Young Seek Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waveguide and semiconductor packaging
- Patent number 9,478,458
- Issue date Oct 25, 2016
- Northrop Grumman Systems Corporation
- Chunbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a waveguide including a semi-conducting ju...
- Patent number 9,435,951
- Issue date Sep 6, 2016
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Maryse Fournier
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM, ELECTRONIC DEVICE AND PACKAGE WITH VERTICAL TO HORIZONTAL S...
- Publication number 20240213185
- Publication date Jun 27, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Aditya Nitin Jogalekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE PACKAGE WITH INTEGRAL WAVEGUIDE TRANSITION
- Publication number 20240021971
- Publication date Jan 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Aditya Nitin Jogalekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING MULTIPLE DIELECTRIC WAVEGUIDE CHANNE...
- Publication number 20230268298
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-SHIANG LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP ENHANCED QUAD FLAT NO-LEAD ELECTRONIC DEVICE WITH CONDUCT...
- Publication number 20230044284
- Publication date Feb 9, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rajen Manicon Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROWAVE INTEGRATED CIRCUIT
- Publication number 20220148985
- Publication date May 12, 2022
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Kenshi Naito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE
- Publication number 20220059513
- Publication date Feb 24, 2022
- SAMSUNG DISPLAY CO., LTD.
- Euikang HEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA APPARATUS WITH INTEGRATED ANTENNA ARRAY AND LOW LOSS MULTI-...
- Publication number 20210118828
- Publication date Apr 22, 2021
- ViaSat, Inc.
- STEVEN J. FRANSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT TRANSITION STRUCTURE FOR TRANSMISSION OF mm-WAVE SIGNALS FR...
- Publication number 20210082840
- Publication date Mar 18, 2021
- Huawei Technologies Co., Ltd
- Houssam KANJ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING MULTIPLE DIELECTRIC WAVEGUIDE CHANNE...
- Publication number 20200381377
- Publication date Dec 3, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-SHIANG LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROWAVE INTEGRATED CIRCUIT
- Publication number 20200294941
- Publication date Sep 17, 2020
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Kenshi Naito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH SIDE-RADIATING WAVE LAUNCHER AND WAVEGUIDE
- Publication number 20200280121
- Publication date Sep 3, 2020
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES COMPRISING A RADAR SEMICONDUCTOR CHIP AND ASS...
- Publication number 20200251430
- Publication date Aug 6, 2020
- INFINEON TECHNOLOGIES AG
- Ernst SELER
- G01 - MEASURING TESTING
Information Patent Application
RF Power Amplifier Pallet
- Publication number 20200168571
- Publication date May 28, 2020
- Ampleon Netherlands B.V.
- Gutta Venkata
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
A PACKAGING STRUCTURE COMPRISING AT LEAST ONE TRANSITION FORMING A...
- Publication number 20200043875
- Publication date Feb 6, 2020
- GAPWAVES AB
- Ashraf Uz ZAMAN
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING MULTIPLE DIELECTRIC WAVEGUIDE CHANNE...
- Publication number 20190393171
- Publication date Dec 26, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-SHIANG LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCULARLY-POLARIZED DIELECTRIC WAVEGUIDE LAUNCH FOR MILLIMETER-WAV...
- Publication number 20190334220
- Publication date Oct 31, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Hassan Omar Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190311998
- Publication date Oct 10, 2019
- Fujitsu Limited
- Daijiro Ishibashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCALABLE PHASED ARRAY PACKAGE
- Publication number 20190260109
- Publication date Aug 22, 2019
- International Business Machines Corporation
- Xiaoxiong Gu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SCALABLE PHASED ARRAY PACKAGE
- Publication number 20190260138
- Publication date Aug 22, 2019
- International Business Machines Corporation
- Xiaoxiong Gu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-FREQUENCY AMPLIFIER UNIT AND HIGH-FREQUENCY POWER AMPLIFICATIO...
- Publication number 20190158037
- Publication date May 23, 2019
- MITSUBISHI ELECTRIC CORPORATION
- Hiroyuki NONOMURA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
WAVEGUIDE DEVICE MODULE AND MICROWAVE MODULE
- Publication number 20190140344
- Publication date May 9, 2019
- NIDEC CORPORATION
- Hideki KIRINO
- G01 - MEASURING TESTING
Information Patent Application
A Transition Arrangement Comprising a Contactless Transition or Con...
- Publication number 20190057945
- Publication date Feb 21, 2019
- Telefonaktiebolaget LM Ericsson (publ)
- Rob Maaskant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Extremely High Frequency Electronic Component
- Publication number 20180076155
- Publication date Mar 15, 2018
- DYCONEX AG
- Eckardt Bihler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES HAVING INTEGRATED WAVEGUIDES FOR HIGH SPEED COMM...
- Publication number 20160336282
- Publication date Nov 17, 2016
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-CHIP VERTICAL THREE DIMENSIONAL MICROSTRIP LINE WITH CHARACTERIS...
- Publication number 20150054592
- Publication date Feb 26, 2015
- University of South Carolina
- Barbara S. DEWITT
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Integrated-Circuit Module with Waveguide Transition Element
- Publication number 20140320231
- Publication date Oct 30, 2014
- Ernst Seler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STUBBY PADS FOR CHANNEL CROSS-TALK REDUCTION
- Publication number 20140264907
- Publication date Sep 18, 2014
- Nevin ALTUNYURT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAVEGUIDE AND SEMICONDUCTOR PACKAGING
- Publication number 20140254979
- Publication date Sep 11, 2014
- Northrop Grumman Systems Corporation
- Chunbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Frequency High Isolation Multichip Module Hybrid Package
- Publication number 20140078683
- Publication date Mar 20, 2014
- National Instruments Corporation
- Tamir Moran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE FOR MILLIMETER WAVE SEMICONDUCTOR DIES
- Publication number 20130256850
- Publication date Oct 3, 2013
- International Business Machines Corporation
- Elad Danny
- H01 - BASIC ELECTRIC ELEMENTS

Transition between different waveguide types

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Microwave integrated circuit

Semiconductor devices comprising a radar semiconductor chip and ass...

Display device and method for manufacturing display device

Semiconductor structure having multiple dielectric waveguide channe...

Semiconductor devices comprising a radar semiconductor chip and ass...

Package with side-radiating wave launcher and waveguide

Microwave integrated circuit

Display device and method for manufacturing display device

RF power amplifier pallet

Antenna apparatus with integrated antenna array and low loss multi-...

Circularly-polarized dielectric waveguide launch for millimeter-wav...

Fan-out transition structure for transmission of mm-Wave signals fr...

High frequency module

Scalable phased array package

Packaging structure comprising at least one transition forming a co...

Scalable phased array package

Semiconductor structure having multiple dielectric waveguide channe...

Wireless interconnects on flexible cables between computing platforms

Transition arrangement comprising a contactless transition or conne...

Waveguide including first and second metal plates and having a slot...

Semiconductor wafer including an integrated waveguide for communica...

Package structure including a package substrate having an integrate...

High-frequency semiconductor amplifier

Waveguide and semiconductor packaging

High-frequency semiconductor amplifier

Method of manufacturing a package for embedding one or more electro...

Semiconductor device, transmission system, method for manufacturing...

Coplaner waveguide transition

Waveguide and semiconductor packaging

Method for manufacturing a waveguide including a semi-conducting ju...

Patents Applicationslast 30 patents

SYSTEM, ELECTRONIC DEVICE AND PACKAGE WITH VERTICAL TO HORIZONTAL S...

MICROELECTRONIC DEVICE PACKAGE WITH INTEGRAL WAVEGUIDE TRANSITION

SEMICONDUCTOR STRUCTURE HAVING MULTIPLE DIELECTRIC WAVEGUIDE CHANNE...

FLIP-CHIP ENHANCED QUAD FLAT NO-LEAD ELECTRONIC DEVICE WITH CONDUCT...

MICROWAVE INTEGRATED CIRCUIT

DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE

ANTENNA APPARATUS WITH INTEGRATED ANTENNA ARRAY AND LOW LOSS MULTI-...

FAN-OUT TRANSITION STRUCTURE FOR TRANSMISSION OF mm-WAVE SIGNALS FR...

SEMICONDUCTOR STRUCTURE HAVING MULTIPLE DIELECTRIC WAVEGUIDE CHANNE...

MICROWAVE INTEGRATED CIRCUIT

PACKAGE WITH SIDE-RADIATING WAVE LAUNCHER AND WAVEGUIDE

SEMICONDUCTOR DEVICES COMPRISING A RADAR SEMICONDUCTOR CHIP AND ASS...

RF Power Amplifier Pallet

A PACKAGING STRUCTURE COMPRISING AT LEAST ONE TRANSITION FORMING A...

SEMICONDUCTOR STRUCTURE HAVING MULTIPLE DIELECTRIC WAVEGUIDE CHANNE...

CIRCULARLY-POLARIZED DIELECTRIC WAVEGUIDE LAUNCH FOR MILLIMETER-WAV...

HIGH FREQUENCY MODULE AND METHOD OF MANUFACTURING THE SAME

SCALABLE PHASED ARRAY PACKAGE

SCALABLE PHASED ARRAY PACKAGE

HIGH-FREQUENCY AMPLIFIER UNIT AND HIGH-FREQUENCY POWER AMPLIFICATIO...

WAVEGUIDE DEVICE MODULE AND MICROWAVE MODULE

A Transition Arrangement Comprising a Contactless Transition or Con...

Extremely High Frequency Electronic Component

PACKAGE STRUCTURES HAVING INTEGRATED WAVEGUIDES FOR HIGH SPEED COMM...

ON-CHIP VERTICAL THREE DIMENSIONAL MICROSTRIP LINE WITH CHARACTERIS...

Integrated-Circuit Module with Waveguide Transition Element

STUBBY PADS FOR CHANNEL CROSS-TALK REDUCTION

WAVEGUIDE AND SEMICONDUCTOR PACKAGING

High Frequency High Isolation Multichip Module Hybrid Package

ELECTRONIC PACKAGE FOR MILLIMETER WAVE SEMICONDUCTOR DIES