Translational mechanism

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H01L2224/75804

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75804Translational mechanism

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Solder reflow apparatus and method of manufacturing an electronic d...
- Patent number 12,154,882
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Youngja Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for forming a package structure
- Patent number 11,961,817
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai Jun Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and method of fabricating display device using th...
- Patent number 11,798,912
- Issue date Oct 24, 2023
- Samsung Display Co., Ltd.
- Taeyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus, manufacturing system, and semiconducto...
- Patent number 11,776,931
- Issue date Oct 3, 2023
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus to control transfer parameters during transfer of semicon...
- Patent number 11,728,189
- Issue date Aug 15, 2023
- Rohinni, Inc.
- Justin Wendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit film bonding apparatus and method of bonding flexi...
- Patent number 11,515,283
- Issue date Nov 29, 2022
- Samsung Display Co., Ltd.
- Chung-Seok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed handling of ultra-small chips by selective laser bonding...
- Patent number 11,222,862
- Issue date Jan 11, 2022
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus to control transfer parameters during transfer of semicon...
- Patent number 11,062,923
- Issue date Jul 13, 2021
- Rohinni, LLC
- Justin Wendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element bonding apparatus and semiconductor element b...
- Patent number 11,037,901
- Issue date Jun 15, 2021
- Toyota Jidosha Kabushiki Kaisha
- Hideyuki Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting Method of a semiconductor device using a colored auxiliary...
- Patent number 10,786,876
- Issue date Sep 29, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Teppei Kojio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and method of estimating position of landing poin...
- Patent number 10,586,781
- Issue date Mar 10, 2020
- Shinkawa Ltd.
- Shigeru Hayata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic-component mounting apparatus
- Patent number 10,568,245
- Issue date Feb 18, 2020
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for stacking devices in an integrated circuit...
- Patent number 10,515,838
- Issue date Dec 24, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed handling of ultra-small chips by selective laser bonding...
- Patent number 10,490,525
- Issue date Nov 26, 2019
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding machines for bonding semiconductor elements, methods of ope...
- Patent number 10,468,373
- Issue date Nov 5, 2019
- Kulicke and Sofia Industries, Inc.
- Thomas J. Colosimo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 10,388,555
- Issue date Aug 20, 2019
- Shinkawa Ltd.
- Osamu Kakutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding device
- Patent number 10,361,166
- Issue date Jul 23, 2019
- Shinkawa Ltd.
- Osamu Kakutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for contactless transfer and soldering of chip...
- Patent number 10,304,709
- Issue date May 28, 2019
- Nederlandse Organisatie voor toegepast-natuurwetenschappelikj onderzoek TNO
- Rob Jacob Hendriks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for manufacturing semiconductor device
- Patent number 10,090,273
- Issue date Oct 2, 2018
- TOSHIBA MEMORY CORPORATION
- Naoyuki Komuta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Application method of liquid material, application device and program
- Patent number 10,086,573
- Issue date Oct 2, 2018
- Musashi Engineering, Inc.
- Kazumasa Ikushima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electronic-component mounting apparatus
- Patent number 9,968,020
- Issue date May 8, 2018
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding machines for bonding semiconductor elements, methods of ope...
- Patent number 9,929,121
- Issue date Mar 27, 2018
- Kulicke and Soffa Industries, Inc.
- Thomas J. Colosimo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for removing chip
- Patent number 9,881,893
- Issue date Jan 30, 2018
- BOE Technology Group Co., Ltd.
- Guangyuan Cai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonders, methods of operating thermocompression b...
- Patent number 9,847,313
- Issue date Dec 19, 2017
- Kulicke and Soffa Industries, Inc.
- Horst Clauberg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Member bonding apparatus and method
- Patent number 9,809,017
- Issue date Nov 7, 2017
- ORIGIN ELECTRIC COMPANY, LIMITED
- Takuto Yamashita
- G02 - OPTICS
Information Patent Grant
Component mounting method
- Patent number 9,780,514
- Issue date Oct 3, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshihiro Mimura
- G02 - OPTICS
Information Patent Grant
Automatic assembling system
- Patent number 9,750,170
- Issue date Aug 29, 2017
- TE Connectivity Corporation
- Lvhai Hu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method, storage medium, bonding apparatus and bonding system
- Patent number 9,741,595
- Issue date Aug 22, 2017
- Tokyo Electron Limited
- Kenji Sugakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon vias and thermocompression bonding using inkjet-pri...
- Patent number 9,717,145
- Issue date Jul 25, 2017
- The Regents of the University of California
- Vivek Subramanian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Alignment systems and wafer bonding systems and methods
- Patent number 9,646,860
- Issue date May 9, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING APPARATUS AND BONDING METHOD USING THE SAME
- Publication number 20240332249
- Publication date Oct 3, 2024
- SAMSUNG DISPLAY CO., LTD.
- JEONGMIN BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A PACKAGE STRUCTURE
- Publication number 20240222312
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai Jun ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING
- Publication number 20240194634
- Publication date Jun 13, 2024
- ASMPT SINGAPORE PTE. LTD
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING APPARATUS
- Publication number 20240186282
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Sumin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REFLOW APPARATUS
- Publication number 20240128229
- Publication date Apr 18, 2024
- Samsung Electronics Co., LTD
- Byungkeun Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BALL ATTACHING APPARATUS
- Publication number 20240071983
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Bongken YU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
- Publication number 20240047410
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING DEVICE AND ADJUSTMENT METHOD FOR BONDING HEAD
- Publication number 20230197670
- Publication date Jun 22, 2023
- SHINKAWA LTD.
- ALEXANDER Dzhangirov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING DEVICE AND MOUNTING METHOD
- Publication number 20230163096
- Publication date May 25, 2023
- TORAY ENGINEERING CO., LTD.
- Katsumi TERADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR FORMING A PACKAGE STRUCTURE
- Publication number 20220278071
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai Jun ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS TO CONTROL TRANSFER PARAMETERS DURING TRANSFER...
- Publication number 20210343558
- Publication date Nov 4, 2021
- Rohinni, LLC
- Justin Wendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND METHOD OF FABRICATING DISPLAY DEVICE USING TH...
- Publication number 20210305201
- Publication date Sep 30, 2021
- SAMSUNG DISPLAY CO., LTD.
- Taeyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS, MANUFACTURING SYSTEM, AND SEMICONDUCTO...
- Publication number 20210074670
- Publication date Mar 11, 2021
- Kioxia Corporation
- Sho KAWADAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT FILM BONDING APPARATUS AND METHOD OF BONDING FLEXI...
- Publication number 20200373276
- Publication date Nov 26, 2020
- SAMSUNG DISPLAY CO., LTD.
- Chung-Seok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING APPARATUS AND DIE BONDING METHOD
- Publication number 20200243477
- Publication date Jul 30, 2020
- FURUKAWA ELECTRIC CO., LTD.
- Teruyuki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT BONDING APPARATUS AND SEMICONDUCTOR ELEMENT B...
- Publication number 20200235071
- Publication date Jul 23, 2020
- Toyota Jidosha Kabushiki Kaisha
- Hideyuki MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS TO CONTROL TRANSFER PARAMETERS DURING TRANSFER...
- Publication number 20200105551
- Publication date Apr 2, 2020
- Rohinni, LLC.
- Justin Wendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...
- Publication number 20200051948
- Publication date Feb 13, 2020
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...
- Publication number 20190348392
- Publication date Nov 14, 2019
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR STACKING DEVICES IN AN INTEGRATED CIRCUIT...
- Publication number 20190088527
- Publication date Mar 21, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUXILIARY JOINING AGENT AND METHOD FOR PRODUCING THE SAME
- Publication number 20180236613
- Publication date Aug 23, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- Teppei Kojio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, METHODS OF OPE...
- Publication number 20180174997
- Publication date Jun 21, 2018
- KULICKE AND SOFFA INDUSTRIES, INC.
- Thomas J. Colosimo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE BONDING APPARATUS AND DIE BONDING METHOD
- Publication number 20170365578
- Publication date Dec 21, 2017
- FURUKAWA ELECTRIC CO., LTD.
- Teruyuki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC-COMPONENT MOUNTING APPARATUS AND ELECTRONIC-COMPONENT MO...
- Publication number 20170347504
- Publication date Nov 30, 2017
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Card Attachment for Enhanced Robustness of Thermal Performance
- Publication number 20170148758
- Publication date May 25, 2017
- International Business Machines Corporation
- Michael Gaynes
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR REMOVING CHIP
- Publication number 20170110433
- Publication date Apr 20, 2017
- BOE TECHNOLOGY GROUP CO., LTD.
- Guangyuan Cai
- B32 - LAYERED PRODUCTS
Information Patent Application
BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, METHODS OF OPE...
- Publication number 20170062378
- Publication date Mar 2, 2017
- KULICKE AND SOFFA INDUSTRIES, INC.
- Thomas J. Colosimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BONDERS, METHODS OF OPERATING THERMOCOMPRESSION B...
- Publication number 20160315064
- Publication date Oct 27, 2016
- KULICKE AND SOFFA INDUSTRIES, INC.
- Horst Clauberg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THROUGH SILICON VIAS AND THERMOCOMPRESSION BONDING USING INKJET-PRI...
- Publication number 20160148840
- Publication date May 26, 2016
- The Regents of the University of California
- Vivek Subramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANU...
- Publication number 20160079102
- Publication date Mar 17, 2016
- Kabushiki Kaisha Toshiba
- Shinya FUKAYAMA
- G01 - MEASURING TESTING

Translational mechanism

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solder reflow apparatus and method of manufacturing an electronic d...

Apparatus and method for forming a package structure

Bonding apparatus and method of fabricating display device using th...

Substrate bonding apparatus, manufacturing system, and semiconducto...

Apparatus to control transfer parameters during transfer of semicon...

Flexible circuit film bonding apparatus and method of bonding flexi...

High speed handling of ultra-small chips by selective laser bonding...

Apparatus to control transfer parameters during transfer of semicon...

Semiconductor element bonding apparatus and semiconductor element b...

Mounting Method of a semiconductor device using a colored auxiliary...

Bonding apparatus and method of estimating position of landing poin...

Electronic-component mounting apparatus

Method and apparatus for stacking devices in an integrated circuit...

High speed handling of ultra-small chips by selective laser bonding...

Bonding machines for bonding semiconductor elements, methods of ope...

Bonding apparatus and bonding method

Bonding device

Apparatus and method for contactless transfer and soldering of chip...

Apparatus and method for manufacturing semiconductor device

Application method of liquid material, application device and program

Electronic-component mounting apparatus

Bonding machines for bonding semiconductor elements, methods of ope...

Apparatus for removing chip

Thermocompression bonders, methods of operating thermocompression b...

Member bonding apparatus and method

Component mounting method

Automatic assembling system

Bonding method, storage medium, bonding apparatus and bonding system

Through silicon vias and thermocompression bonding using inkjet-pri...

Alignment systems and wafer bonding systems and methods

Patents Applicationslast 30 patents

BONDING APPARATUS AND BONDING METHOD USING THE SAME

METHOD FOR FORMING A PACKAGE STRUCTURE

HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING

DIE BONDING APPARATUS

SOLDER REFLOW APPARATUS

SOLDER BALL ATTACHING APPARATUS

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...

BONDING DEVICE AND ADJUSTMENT METHOD FOR BONDING HEAD

MOUNTING DEVICE AND MOUNTING METHOD

APPARATUS AND METHOD FOR FORMING A PACKAGE STRUCTURE

METHOD AND APPARATUS TO CONTROL TRANSFER PARAMETERS DURING TRANSFER...

BONDING APPARATUS AND METHOD OF FABRICATING DISPLAY DEVICE USING TH...

SUBSTRATE BONDING APPARATUS, MANUFACTURING SYSTEM, AND SEMICONDUCTO...

FLEXIBLE CIRCUIT FILM BONDING APPARATUS AND METHOD OF BONDING FLEXI...

DIE BONDING APPARATUS AND DIE BONDING METHOD

SEMICONDUCTOR ELEMENT BONDING APPARATUS AND SEMICONDUCTOR ELEMENT B...

METHOD AND APPARATUS TO CONTROL TRANSFER PARAMETERS DURING TRANSFER...

High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...

High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...

METHOD AND APPARATUS FOR STACKING DEVICES IN AN INTEGRATED CIRCUIT...

AUXILIARY JOINING AGENT AND METHOD FOR PRODUCING THE SAME

BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, METHODS OF OPE...

DIE BONDING APPARATUS AND DIE BONDING METHOD

ELECTRONIC-COMPONENT MOUNTING APPARATUS AND ELECTRONIC-COMPONENT MO...

Circuit Card Attachment for Enhanced Robustness of Thermal Performance

APPARATUS FOR REMOVING CHIP

BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, METHODS OF OPE...

THERMOCOMPRESSION BONDERS, METHODS OF OPERATING THERMOCOMPRESSION B...

THROUGH SILICON VIAS AND THERMOCOMPRESSION BONDING USING INKJET-PRI...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANU...