Treatment of the terminal leads as a seperate operation

Industry

CPC
H05K13/0092

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components

Current Industry

H05K13/0092Treatment of the terminal leads as a seperate operation

Industries

Patents Grantslast 30 patents

Information Patent Grant
Metal drop ejecting three-dimensional (3D) object printer
- Patent number 11,737,216
- Issue date Aug 22, 2023
- Xerox Corporation
- Denis Cormier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interchangeable spring pack for an upper die in a lead forming system
- Patent number 10,647,016
- Issue date May 12, 2020
- Fancort Industries, Inc.
- Alex Crudo
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Method for manufacturing electronic component
- Patent number 10,398,069
- Issue date Aug 27, 2019
- Murata Manufacturing Co., Ltd.
- Seiji Goto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
External-leadwire crimping apparatus
- Patent number 10,264,718
- Issue date Apr 16, 2019
- BOE Technology Group Co., Ltd.
- Yusheng Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Board work machine and recognition method
- Patent number 10,178,820
- Issue date Jan 8, 2019
- FUJI CORPORATION
- Kazuya Degura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cleaning apparatus
- Patent number 10,105,737
- Issue date Oct 23, 2018
- Global Unichip Corporation
- Yu-Ting Shih
- B08 - CLEANING
Information Patent Grant
Electrical equipment, integrated circuit's loop thereof and circuit...
- Patent number 9,730,350
- Issue date Aug 8, 2017
- SHENZHEN SIGMA MICROELECTRONICS CO., LTD.
- Lun Lv
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Correction mechanism for pin and correction device
- Patent number 9,549,492
- Issue date Jan 17, 2017
- Hong Fu Precision Industry (ShenZhen) Co., Ltd.
- Bing Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead pin rectifying apparatus and lead pin rectifying method
- Patent number 9,352,381
- Issue date May 31, 2016
- Ricoh Company, Ltd.
- Fumikata Andoh
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Pin regulator for electronic components
- Patent number 8,590,359
- Issue date Nov 26, 2013
- HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
- Hai-Yuan Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for adapting an electronic component for surface mounting
- Patent number 8,316,538
- Issue date Nov 27, 2012
- Thales
- Pierre Bertram
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of handling an electrical component
- Patent number 7,114,248
- Issue date Oct 3, 2006
- Micron Technology, Inc.
- Morley J. Weyerman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of processing a strip of lead frames
- Patent number 7,107,671
- Issue date Sep 19, 2006
- Micron Technology, Inc.
- Morley J. Weyerman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming leads of a semiconductor device
- Patent number 7,077,170
- Issue date Jul 18, 2006
- Renesas Technology Corp.
- Hidetaka Yamasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processing device for an elongated workpiece
- Patent number 6,817,083
- Issue date Nov 16, 2004
- Micron Technology, Inc.
- Morley J. Weyerman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for conditioning leads
- Patent number 6,654,658
- Issue date Nov 25, 2003
- Semiconductor Technologies & Instruments, PTE, Ltd.
- Paul Harris Hasten
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Workpiece moving methods
- Patent number 6,581,277
- Issue date Jun 24, 2003
- Micron Technology, Inc.
- Morley J. Weyerman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Horizontal component retention socket
- Patent number 6,555,746
- Issue date Apr 29, 2003
- Intel Corporation
- Patrick D. Boyd
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Clamping device, tool and method of mounting tools
- Patent number 6,532,783
- Issue date Mar 18, 2003
- FICO B.V.
- Adrianus Wilhelmus van Dalen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plated leadframes with cantilevered leads
- Patent number 6,518,099
- Issue date Feb 11, 2003
- STMicroelectronics S.r.l.
- Andrea Giovanni Cigada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for manufacturing electronic parts
- Patent number 6,435,222
- Issue date Aug 20, 2002
- Seiko Epson Corporation
- Keiichi Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transporter for lead frames and transport assembly
- Patent number 6,435,394
- Issue date Aug 20, 2002
- FICO B.V.
- Johannes Gerhardus Augustinus Zweers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bending die and bending machine using the same
- Patent number 6,412,522
- Issue date Jul 2, 2002
- Oki Electric Industry Co, Ltd.
- Koji Nakasako
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Workpiece moving methods
- Patent number 6,405,430
- Issue date Jun 18, 2002
- Micron Technology, Inc.
- Morley J. Weyerman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plated leadframes with cantilevered leads
- Patent number 6,323,544
- Issue date Nov 27, 2001
- STMicroelectronics S.r.l.
- Andrea Giovanni Cigada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead conditioning system
- Patent number 6,155,311
- Issue date Dec 5, 2000
- Precision Technologies, Inc.
- Shawn Ross Davis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for forming leads and removing tin dust from l...
- Patent number 6,085,804
- Issue date Jul 11, 2000
- Samsung Electronics Co., Ltd.
- Jun Hyuk Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Belt-feed trim and form apparatus
- Patent number 6,029,329
- Issue date Feb 29, 2000
- MicronTechnology, Inc.
- Morley J. Weyerman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead cutting apparatus of electronic component
- Patent number 5,996,458
- Issue date Dec 7, 1999
- NEC Corporation
- Masato Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Forming tool and method
- Patent number 5,979,510
- Issue date Nov 9, 1999
- Micron Technology, Inc.
- Ernest J. Hamilton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR OPERATING A METAL DROP EJECTING THREE-DIMENSIONAL (3D) O...
- Publication number 20230309241
- Publication date Sep 28, 2023
- Xerox Corporation
- Denis Cormier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND SYSTEM FOR OPERATING A METAL DROP EJECTING THREE-DIMENSI...
- Publication number 20220240387
- Publication date Jul 28, 2022
- Xerox Corporation
- Denis Cormier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interchangeable Spring Pack for an Upper Die in a Lead Forming System
- Publication number 20190134842
- Publication date May 9, 2019
- Fancort Industries, Inc.
- Alex Crudo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD WORK MACHINE AND RECOGNITION METHOD
- Publication number 20180184553
- Publication date Jun 28, 2018
- FUJI MACHINE MFG. CO., LTD.
- Kazuya DEGURA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
EXTERNAL-LEADWIRE CRIMPING APPARATUS
- Publication number 20170265341
- Publication date Sep 14, 2017
- BOE TECHNOLOGY GROUP CO., LTD.
- Yusheng Ke
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT AND DEVICE FOR MANUFA...
- Publication number 20160212895
- Publication date Jul 21, 2016
- Murata Manufacturing Co., Ltd.
- Seiji GOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE AND METHOD FOR SEPARATION OF A CRIMPED WIRE TERMINAL FROM A...
- Publication number 20150325969
- Publication date Nov 12, 2015
- Starn Tool & Manufacturing Company
- John Matthew BELOVARAC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORRECTION MECHANISM FOR PIN AND CORRECTION DEVICE
- Publication number 20140007422
- Publication date Jan 9, 2014
- HON HAI PRECISION INDUSTRY CO., LTD.
- BING LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD PIN RECTIFYING APPARATUS AND LEAD PIN RECTIFYING METHOD
- Publication number 20130042663
- Publication date Feb 21, 2013
- RICOH COMPANY, LTD.,
- Fumikata ANDOH
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
Press apparatus and method for manufacturing semiconductor device
- Publication number 20110203082
- Publication date Aug 25, 2011
- RENESAS ELECTRONICS CORPORATION
- Tohru Kumamoto
- B30 - PRESSES
Information Patent Application
PIN REGULATOR FOR ELECTRONIC COMPONENTS
- Publication number 20100313411
- Publication date Dec 16, 2010
- HON HAI JIN PRECISION INDUSTRY(ShenZhen) CO., LTD.
- HAI-YUAN LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR ADAPTING AN ELECTRONIC COMPONENT FOR SURFACE MOUNTING
- Publication number 20100115768
- Publication date May 13, 2010
- THALES
- Pierre Bertram
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Chip holder board
- Publication number 20080035368
- Publication date Feb 14, 2008
- Sen-Sung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of forming leads of a packaged semiconductor device
- Publication number 20060237087
- Publication date Oct 26, 2006
- Renesas Technology Corp.
- Hidetaka Yamasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead forming for a semiconductor device
- Publication number 20050076967
- Publication date Apr 14, 2005
- Renesas Technology Corp.
- Hidetaka Yamasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Processing device for an elongated workpiece
- Publication number 20040020042
- Publication date Feb 5, 2004
- Morley J. Weyerman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of processing a strip of lead frames
- Publication number 20030230179
- Publication date Dec 18, 2003
- Morley J. Weyerman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of handling an electrical component
- Publication number 20030192175
- Publication date Oct 16, 2003
- Morley J. Weyerman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HORIZONTAL COMPONENT RETENTION SOCKET
- Publication number 20030037946
- Publication date Feb 27, 2003
- Patrick D. Boyd
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System and method for conditioning leads
- Publication number 20030009255
- Publication date Jan 9, 2003
- Paul Harris Hasten
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Workpiece moving methods
- Publication number 20020069522
- Publication date Jun 13, 2002
- Morley J. Weyerman
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
CLAMPING DEVICE, TOOL AND METHOD OF MOUNTING TOOLS
- Publication number 20020062874
- Publication date May 30, 2002
- ADRIANUS WILHELMUS VAN DALEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plated leadframes with cantilevered leads
- Publication number 20010041385
- Publication date Nov 15, 2001
- STMicroelectronics S.r.I.
- Andrea Giovanni Cigada
- H01 - BASIC ELECTRIC ELEMENTS

Treatment of the terminal leads as a seperate operation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Metal drop ejecting three-dimensional (3D) object printer

Interchangeable spring pack for an upper die in a lead forming system

Method for manufacturing electronic component

External-leadwire crimping apparatus

Board work machine and recognition method

Cleaning apparatus

Electrical equipment, integrated circuit's loop thereof and circuit...

Correction mechanism for pin and correction device

Lead pin rectifying apparatus and lead pin rectifying method

Pin regulator for electronic components

Method for adapting an electronic component for surface mounting

Method of handling an electrical component

Method of processing a strip of lead frames

Method of forming leads of a semiconductor device

Processing device for an elongated workpiece

System and method for conditioning leads

Workpiece moving methods

Horizontal component retention socket

Clamping device, tool and method of mounting tools

Plated leadframes with cantilevered leads

Method and apparatus for manufacturing electronic parts

Transporter for lead frames and transport assembly

Bending die and bending machine using the same

Workpiece moving methods

Plated leadframes with cantilevered leads

Lead conditioning system

Apparatus and method for forming leads and removing tin dust from l...

Belt-feed trim and form apparatus

Lead cutting apparatus of electronic component

Forming tool and method

Patents Applicationslast 30 patents

METHOD FOR OPERATING A METAL DROP EJECTING THREE-DIMENSIONAL (3D) O...

METHOD AND SYSTEM FOR OPERATING A METAL DROP EJECTING THREE-DIMENSI...

Interchangeable Spring Pack for an Upper Die in a Lead Forming System

BOARD WORK MACHINE AND RECOGNITION METHOD

EXTERNAL-LEADWIRE CRIMPING APPARATUS

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT AND DEVICE FOR MANUFA...

DEVICE AND METHOD FOR SEPARATION OF A CRIMPED WIRE TERMINAL FROM A...

CORRECTION MECHANISM FOR PIN AND CORRECTION DEVICE

LEAD PIN RECTIFYING APPARATUS AND LEAD PIN RECTIFYING METHOD

Press apparatus and method for manufacturing semiconductor device

PIN REGULATOR FOR ELECTRONIC COMPONENTS

METHOD FOR ADAPTING AN ELECTRONIC COMPONENT FOR SURFACE MOUNTING

Chip holder board

Method of forming leads of a packaged semiconductor device

Lead forming for a semiconductor device

Processing device for an elongated workpiece

Method of processing a strip of lead frames

Method of handling an electrical component

HORIZONTAL COMPONENT RETENTION SOCKET

System and method for conditioning leads

Workpiece moving methods

CLAMPING DEVICE, TOOL AND METHOD OF MOUNTING TOOLS

Plated leadframes with cantilevered leads