Treatments characterised by their effect

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H05K2203/11

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/11Treatments characterised by their effect

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Connection method for chip and circuit board, and circuit board ass...
- Patent number 12,232,266
- Issue date Feb 18, 2025
- INTELLIMICRO MEDICAL CO., LTD.
- Yu-chong Tai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of fabricating the same
- Patent number 12,232,273
- Issue date Feb 18, 2025
- LG Innotek Co., Ltd
- Yun Mi Bae
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Etching device and etching method using the same
- Patent number 12,217,978
- Issue date Feb 4, 2025
- Samsung Display Co., Ltd.
- Wonje Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Droplet actuator fabrication apparatus, systems, and related methods
- Patent number 12,201,980
- Issue date Jan 21, 2025
- Abbott Laboratories
- Andrew Fischer
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Oxygen and humidity control in storage device
- Patent number 12,193,164
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shen-Min Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 12,160,949
- Issue date Dec 3, 2024
- FUJIFILM Corporation
- Genya Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing shielded printed wiring board and shielded...
- Patent number 12,150,239
- Issue date Nov 19, 2024
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Sirou Yamauchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Circuit board and method for producing circuit board
- Patent number 12,133,328
- Issue date Oct 29, 2024
- Murata Manufacturing Co., Ltd.
- Tomoki Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic-copper composite, ceramic circuit board, power module, and...
- Patent number 12,109,640
- Issue date Oct 8, 2024
- DENKA COMPANY LIMITED
- Akimasa Yuasa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
System and method for creating orthogonal solder interconnects
- Patent number 12,108,542
- Issue date Oct 1, 2024
- Raytheon Company
- Justin A. Kasemodel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semi-automatic corrosion box of copper clad laminate
- Patent number 12,101,892
- Issue date Sep 24, 2024
- Dalian University of Technology
- Shengming Li
- B32 - LAYERED PRODUCTS
Information Patent Grant
Layered device for pressure treatment and method
- Patent number 12,089,344
- Issue date Sep 10, 2024
- Canatu Oy
- Ilkka Varjos
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Insulated circuit board
- Patent number 12,089,342
- Issue date Sep 10, 2024
- Mitsubishi Materials Corporation
- Akira Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for printing a conductive pillar with high precision
- Patent number 12,089,343
- Issue date Sep 10, 2024
- Reophotonics, Ltd.
- Michael Zenou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of manufacturing circuit board and circuit board assembly
- Patent number 12,063,752
- Issue date Aug 13, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Wen-Zhu Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for a printed wiring board
- Patent number 12,058,812
- Issue date Aug 6, 2024
- Sumitomo Electric Industries, Ltd.
- Takuto Hidani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for printing silver nanowire harness network structure by us...
- Patent number 12,053,995
- Issue date Aug 6, 2024
- XI'AN JIAOTONG UNIVERSITY
- Jianlei Cui
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Inks containing metal precursors nanoparticles
- Patent number 12,054,626
- Issue date Aug 6, 2024
- Singapore Asahi Chemical & Solder Ind. Pte. Ltd
- Michael Grouchko
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Pressure sintering device and method for manufacturing an electroni...
- Patent number 12,046,576
- Issue date Jul 23, 2024
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated component carrier with a thermoplastic structure
- Patent number 12,048,089
- Issue date Jul 23, 2024
- AT&SAustria Technologie & Systemtechnik
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with low-solvent fiber-free dielectric layer
- Patent number 12,041,730
- Issue date Jul 16, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Seok Kim Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for soldering an electronic component to a circuit board by...
- Patent number 12,028,987
- Issue date Jul 2, 2024
- PAC Tech-Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Support pin for supporting a substrate in a placement area of a pla...
- Patent number 12,028,983
- Issue date Jul 2, 2024
- ASMPT GMBH & CO. KG
- Martin Neusser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Overmoulded printed electronic parts and methods for the manufactur...
- Patent number 12,017,392
- Issue date Jun 25, 2024
- National Research Council of Canada
- Paul Arthur Trudeau
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Base material for printed circuit board and method of manufacturing...
- Patent number 12,016,132
- Issue date Jun 18, 2024
- Sumitomo Electric Industries, Ltd.
- Kayo Hashizume
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for controlling powder bed density for 3D printing
- Patent number 11,998,982
- Issue date Jun 4, 2024
- Desktop Metal, Inc.
- George Hudelson
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 12,004,304
- Issue date Jun 4, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Shimizu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Molecular ink and method for printing resistive film coatings
- Patent number 11,999,864
- Issue date Jun 4, 2024
- LIQUID X PRINTED METALS, INC.
- Robert Swisher
- G01 - MEASURING TESTING
Information Patent Grant
Boron nitride nanotube coated substrates for sintering of metallic...
- Patent number 11,993,719
- Issue date May 28, 2024
- National Research Council of Canada
- Chantal Paquet
- C01 - INORGANIC CHEMISTRY

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250056721
- Publication date Feb 13, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Cheng-Jia LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS FOR ELEC...
- Publication number 20250056731
- Publication date Feb 13, 2025
- Jan FRANCK
- B22 - CASTING POWDER METALLURGY
Information Patent Application
ARCHITECTED LIQUID METAL NETWORKS AND PROCESSES OF MAKING AND USING...
- Publication number 20250040041
- Publication date Jan 30, 2025
- Government of the United States as Represented by the Secretary of the Air Force
- Carl J. Thrasher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Manufacturing Shielded Printed Wiring Board and Shielded...
- Publication number 20250031298
- Publication date Jan 23, 2025
- Tatsuta Electric Wire & Cable Co., Ltd.
- Sirou YAMAUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR POWER ENTITY AND METHOD FOR PRODUCING SUCH ENTITY BY...
- Publication number 20250022840
- Publication date Jan 16, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Lasse Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board
- Publication number 20240422920
- Publication date Dec 19, 2024
- Avary Holding (Shenzhen) Co., Limited.
- WEN-ZHU WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE WET CHANNELS FOR WATER DRAINAGE PPLICATIONS
- Publication number 20240421104
- Publication date Dec 19, 2024
- SAUDI ARABIANOIL COMPANY
- Dong Kyu Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER THIN-FILM FPCB AND HEATER
- Publication number 20240414852
- Publication date Dec 12, 2024
- Seoul National University R&DB Foundation
- Seung Hwan KO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINTERING PASTE, METHOD FOR ELECTRICALLY CONDUCTIVE, MATERIALLY BON...
- Publication number 20240381539
- Publication date Nov 14, 2024
- MAHLE International GmbH
- Matthias Tuerpe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING THERMAL INTERFACE MATERIAL
- Publication number 20240381523
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Wanjae JU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Soldering an Electronic Component to a Circuit Board by...
- Publication number 20240373563
- Publication date Nov 7, 2024
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE FOR ELECTRONIC CONTROL DEVICE, AND METHOD FOR MANU...
- Publication number 20240357736
- Publication date Oct 24, 2024
- Hitachi Astemo, Ltd.
- Takanori SEKIGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND MANUFACTURING METHOD THEREFOR
- Publication number 20240357739
- Publication date Oct 24, 2024
- TOPPAN Holdings Inc.
- Tomoyuki Ishii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CURABLE ADHESIVE COMPOSITION, FILMY ADHESIVE, METHOD FOR PRODUCING...
- Publication number 20240352287
- Publication date Oct 24, 2024
- Resonac Corporation
- Masashi OHKOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD
- Publication number 20240341039
- Publication date Oct 10, 2024
- Resonac Corporation
- Kei TOGASAKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MECHATRONIC CURTAIN FOR A PROCESS CHAMBER FOR CARRYING OUT THERMAL...
- Publication number 20240318915
- Publication date Sep 26, 2024
- REHM THERMAL SYSTEMS GMBH
- Paul WILD
- F27 - FURNACES KILNS OVENS RETORTS
Information Patent Application
DONOR PLATE, DEPOSITION DEVICE AND DEPOSITION METHOD
- Publication number 20240314935
- Publication date Sep 19, 2024
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Rob Jacob HENDRIKS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULAR PRINTED CIRCUIT BOARD ASSEMBLY AND METHOD TO OPERATE THE SAME
- Publication number 20240306318
- Publication date Sep 12, 2024
- e-con Systems India Private Limited
- SATHIYA NARAYANAN L
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board And Method For Soldering A Chip Housing In A...
- Publication number 20240292514
- Publication date Aug 29, 2024
- LISA DRAXLMAIER GMBH
- Andreas Brinkmann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method For Manufacturing Electrical Devices
- Publication number 20240282517
- Publication date Aug 22, 2024
- Hutchinson Technology Incorporated
- Collin M. Grove
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PCB STACK WITH EMBEDDED COMPONENT PACKAGE AND SINTERED VIAS
- Publication number 20240276637
- Publication date Aug 15, 2024
- Microchip Technology Caldicot Limited
- George Taylor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FABRICATING FUNCTIONAL CIRCUITS ON 3D FREEFORM SURFACES VIA INTENSE...
- Publication number 20240276648
- Publication date Aug 15, 2024
- The Penn State Research Foundation
- Ning Yi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATING SUBSTRATE, ELECTRICAL WIRING SUBSTRATE, THERMAL PRINT HE...
- Publication number 20240268018
- Publication date Aug 8, 2024
- Rohm Co., Ltd.
- Goro Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESS APPARATUS AND PRESSING METHOD THEREOF
- Publication number 20240268035
- Publication date Aug 8, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jae Uk CHO
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
ORGANIC SUBSTRATE-BASED WEARABLE PLATFORM AND METHODS FOR ON-BODY S...
- Publication number 20240268037
- Publication date Aug 8, 2024
- Takaroa Corporation, Inc.
- Ethan M. Devine
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTOELECTRONIC ASSEMBLY AND METHOD FOR THE PRODUCTION OF SAME
- Publication number 20240260186
- Publication date Aug 1, 2024
- ams-OSRAM International GmbH
- Thomas KIPPES
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND ANTENNA DEVICE COMPRISING SAME
- Publication number 20240260175
- Publication date Aug 1, 2024
- LG Innotek Co., Ltd.
- In Jae LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD, APPARATUS AND SYSTEM FOR PROCESSING A COMPOSITE WASTE SOURCE
- Publication number 20240247335
- Publication date Jul 25, 2024
- NewSouth Innovations Pty Limited
- Veena Sahajwalla
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE
- Publication number 20240251509
- Publication date Jul 25, 2024
- InnoLux Corporation
- Yu-Chia HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for coating and forming novel material layer structure of hi...
- Publication number 20240244763
- Publication date Jul 18, 2024
- LongKai LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Treatments characterised by their effect

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Connection method for chip and circuit board, and circuit board ass...

Printed circuit board and method of fabricating the same

Etching device and etching method using the same

Droplet actuator fabrication apparatus, systems, and related methods

Oxygen and humidity control in storage device

Wiring board and method for manufacturing wiring board

Method for manufacturing shielded printed wiring board and shielded...

Hermetic metallized via with improved reliability

Circuit board and method for producing circuit board

Ceramic-copper composite, ceramic circuit board, power module, and...

System and method for creating orthogonal solder interconnects

Semi-automatic corrosion box of copper clad laminate

Layered device for pressure treatment and method

Insulated circuit board

Methods for printing a conductive pillar with high precision

Methods of manufacturing circuit board and circuit board assembly

Substrate for a printed wiring board

Method for printing silver nanowire harness network structure by us...

Inks containing metal precursors nanoparticles

Pressure sintering device and method for manufacturing an electroni...

Laminated component carrier with a thermoplastic structure

Component carrier with low-solvent fiber-free dielectric layer

Method for soldering an electronic component to a circuit board by...

Support pin for supporting a substrate in a placement area of a pla...

Overmoulded printed electronic parts and methods for the manufactur...

Base material for printed circuit board and method of manufacturing...

System and method for controlling powder bed density for 3D printing

Method for manufacturing printed wiring board

Molecular ink and method for printing resistive film coatings

Boron nitride nanotube coated substrates for sintering of metallic...

Patents Applicationslast 30 patents

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

DEVICE AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS FOR ELEC...

ARCHITECTED LIQUID METAL NETWORKS AND PROCESSES OF MAKING AND USING...

Method for Manufacturing Shielded Printed Wiring Board and Shielded...

SEMICONDUCTOR POWER ENTITY AND METHOD FOR PRODUCING SUCH ENTITY BY...

Circuit board

SELECTIVE WET CHANNELS FOR WATER DRAINAGE PPLICATIONS

METHOD FOR MANUFACTURING MULTILAYER THIN-FILM FPCB AND HEATER

SINTERING PASTE, METHOD FOR ELECTRICALLY CONDUCTIVE, MATERIALLY BON...

ELECTRONIC DEVICE INCLUDING THERMAL INTERFACE MATERIAL

Method for Soldering an Electronic Component to a Circuit Board by...

WIRING SUBSTRATE FOR ELECTRONIC CONTROL DEVICE, AND METHOD FOR MANU...

WIRING BOARD AND MANUFACTURING METHOD THEREFOR

CURABLE ADHESIVE COMPOSITION, FILMY ADHESIVE, METHOD FOR PRODUCING...

METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD

MECHATRONIC CURTAIN FOR A PROCESS CHAMBER FOR CARRYING OUT THERMAL...

DONOR PLATE, DEPOSITION DEVICE AND DEPOSITION METHOD

MODULAR PRINTED CIRCUIT BOARD ASSEMBLY AND METHOD TO OPERATE THE SAME

Printed Circuit Board And Method For Soldering A Chip Housing In A...

Method For Manufacturing Electrical Devices

PCB STACK WITH EMBEDDED COMPONENT PACKAGE AND SINTERED VIAS

FABRICATING FUNCTIONAL CIRCUITS ON 3D FREEFORM SURFACES VIA INTENSE...

INSULATING SUBSTRATE, ELECTRICAL WIRING SUBSTRATE, THERMAL PRINT HE...

PRESS APPARATUS AND PRESSING METHOD THEREOF

ORGANIC SUBSTRATE-BASED WEARABLE PLATFORM AND METHODS FOR ON-BODY S...

OPTOELECTRONIC ASSEMBLY AND METHOD FOR THE PRODUCTION OF SAME

CIRCUIT BOARD AND ANTENNA DEVICE COMPRISING SAME

METHOD, APPARATUS AND SYSTEM FOR PROCESSING A COMPOSITE WASTE SOURCE

METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE

Method for coating and forming novel material layer structure of hi...