Treatments characterised by their effect

Industry

CPC
H05K2203/11

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/11Treatments characterised by their effect

Industries

Patents Grantslast 30 patents

Information Patent Grant
System and method for controlling flow of solder in a wave solderin...
- Patent number 12,363,833
- Issue date Jul 15, 2025
- Illinois Tool Works Inc.
- Jonathan M. Dautenhahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing same
- Patent number 12,356,542
- Issue date Jul 8, 2025
- MATERIAL CONCEPT, INC.
- Junichi Koike
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for controlling flow of solder in a wave solderin...
- Patent number 12,356,555
- Issue date Jul 8, 2025
- Illinois Tool Works Inc.
- Jonathan M. Dautenhahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for soldering an electronic component to a circuit board by...
- Patent number 12,349,287
- Issue date Jul 1, 2025
- PAC Tech-Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacture of a curved electronic device using differential heatin...
- Patent number 12,349,272
- Issue date Jul 1, 2025
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Margaretha Maria De Kok
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Metal-containing fabrics and membranes, and method of manufacturing...
- Patent number 12,336,097
- Issue date Jun 17, 2025
- Imperial College Innovations Limited
- Anthony Edward George Cass
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic devices including vent openings and associated methods
- Patent number 12,334,405
- Issue date Jun 17, 2025
- Infineon Technologies AG
- Michael Stadler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with convex shaped post, light emitting device, and m...
- Patent number 12,309,934
- Issue date May 20, 2025
- Nichia Corporation
- Yosuke Noda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing an electronic device
- Patent number 12,295,107
- Issue date May 6, 2025
- Innolux Corporation
- Yu-Chia Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
On-vehicle illumination device and production method therefor
- Patent number 12,292,172
- Issue date May 6, 2025
- Stanley Electric Co., Ltd.
- Reiki Tada
- F21 - LIGHTING
Information Patent Grant
Method for shielding a printed circuit board from electromagnetic i...
- Patent number 12,289,822
- Issue date Apr 29, 2025
- Skyworks Solutions, Inc.
- Cesar Verdugo Muñoz
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Process for localized repair of graphene-coated lamination stacks a...
- Patent number 12,289,839
- Issue date Apr 29, 2025
- Mellanox Technologies, Ltd.
- Elad Mentovich
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Interconnect structure for insertion loss reduction in signal trans...
- Patent number 12,283,488
- Issue date Apr 22, 2025
- Yuan Ze University
- Cheng En Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transparent composite nanowire electrodes
- Patent number 12,284,756
- Issue date Apr 22, 2025
- Massachusetts Institute of Technology
- Jeffrey C. Grossman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Ceramic-cladded copper plate and method for manufacturing ceramic-c...
- Patent number 12,284,766
- Issue date Apr 22, 2025
- BYD Company Limited
- Wei Zhou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for producing an etch resist pattern on a metallic surface
- Patent number 12,270,111
- Issue date Apr 8, 2025
- Kateeva, Inc.
- Nava Shpaisman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Component carrier with embedded semiconductor component and embedde...
- Patent number 12,245,377
- Issue date Mar 4, 2025
- Johannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection method for chip and circuit board, and circuit board ass...
- Patent number 12,232,266
- Issue date Feb 18, 2025
- INTELLIMICRO MEDICAL CO., LTD.
- Yu-chong Tai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of fabricating the same
- Patent number 12,232,273
- Issue date Feb 18, 2025
- LG Innotek Co., Ltd
- Yun Mi Bae
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Etching device and etching method using the same
- Patent number 12,217,978
- Issue date Feb 4, 2025
- Samsung Display Co., Ltd.
- Wonje Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Droplet actuator fabrication apparatus, systems, and related methods
- Patent number 12,201,980
- Issue date Jan 21, 2025
- Abbott Laboratories
- Andrew Fischer
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Oxygen and humidity control in storage device
- Patent number 12,193,164
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shen-Min Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 12,160,949
- Issue date Dec 3, 2024
- FUJIFILM Corporation
- Genya Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing shielded printed wiring board and shielded...
- Patent number 12,150,239
- Issue date Nov 19, 2024
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Sirou Yamauchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Circuit board and method for producing circuit board
- Patent number 12,133,328
- Issue date Oct 29, 2024
- Murata Manufacturing Co., Ltd.
- Tomoki Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic-copper composite, ceramic circuit board, power module, and...
- Patent number 12,109,640
- Issue date Oct 8, 2024
- DENKA COMPANY LIMITED
- Akimasa Yuasa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
System and method for creating orthogonal solder interconnects
- Patent number 12,108,542
- Issue date Oct 1, 2024
- Raytheon Company
- Justin A. Kasemodel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semi-automatic corrosion box of copper clad laminate
- Patent number 12,101,892
- Issue date Sep 24, 2024
- Dalian University of Technology
- Shengming Li
- B32 - LAYERED PRODUCTS
Information Patent Grant
Layered device for pressure treatment and method
- Patent number 12,089,344
- Issue date Sep 10, 2024
- Canatu Oy
- Ilkka Varjos
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
DROPLET ACTUATOR FABRICATION APPARATUS, SYSTEMS, AND RELATED METHODS
- Publication number 20250235864
- Publication date Jul 24, 2025
- Abbott Laboratories
- Andrew Fischer
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE
- Publication number 20250234461
- Publication date Jul 17, 2025
- InnoLux Corporation
- Yu-Chia HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOSENSITIVE MULTILAYER RESIN FILM, PRINTED WIRING BOARD, SEMICON...
- Publication number 20250227853
- Publication date Jul 10, 2025
- Resonac Corporation
- Ryo YUKIOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING CERAMIC SUBSTRATE
- Publication number 20250214324
- Publication date Jul 3, 2025
- Murata Manufacturing Co., Ltd.
- Atsushi KISHIMOTO
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE
- Publication number 20250198008
- Publication date Jun 19, 2025
- Kateeva, Inc.
- Nava Shpaisman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Sintering Methods
- Publication number 20250203784
- Publication date Jun 19, 2025
- Celanese Mercury Holdings Inc.
- Kazutaka Ozawa
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250203776
- Publication date Jun 19, 2025
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE, FILM, THERMOSETTING FILM, AND MANUFACTURING METHOD OF WIR...
- Publication number 20250178313
- Publication date Jun 5, 2025
- FUJIFILM CORPORATION
- Daisuke HAYASHI
- B32 - LAYERED PRODUCTS
Information Patent Application
INTRISICALLY SAFE DESIGNED DEVICES AND METHODS THEREFOR
- Publication number 20250185179
- Publication date Jun 5, 2025
- BlackBerry Limited
- Jason Wayne JANTZI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL-COATED SUBSTRATES, INTERPOSERS, AND METHODS FOR PRODUCTION TH...
- Publication number 20250185156
- Publication date Jun 5, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250168980
- Publication date May 22, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Min Gyu PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER METHOD FOR HIGHER CURRENT ASIC POWER DELIVERY
- Publication number 20250151198
- Publication date May 8, 2025
- Cisco Technology, Inc.
- Joel Richard Goergen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PORTABLE BAKING ASSEMBLY TO CURE THERMAL INTERFACE MATERIAL FOR PRO...
- Publication number 20250151251
- Publication date May 8, 2025
- ZT Group Int’l, Inc. dba ZT Systems
- Sruti Chigullapalli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING ME...
- Publication number 20250142722
- Publication date May 1, 2025
- Resonac Corporation
- Masashi OHKOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR CONTROLLING FLOW OF SOLDER IN A WAVE SOLDERIN...
- Publication number 20250133663
- Publication date Apr 24, 2025
- Illinois Tool Works Inc.
- Jonathan M. Dautenhahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR CONTROLLING FLOW OF SOLDER IN A WAVE SOLDERIN...
- Publication number 20250133664
- Publication date Apr 24, 2025
- Illinois Tool Works Inc.
- Jonathan M. Dautenhahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250126715
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Byung Hak KANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CIRCUIT FORMING METHOD AND ELECTRICAL CIRCUIT FORMING AP...
- Publication number 20250113447
- Publication date Apr 3, 2025
- FUJI CORPORATION
- Tasuku TAKEUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OXYGEN AND HUMIDITY CONTROL IN STORAGE DEVICE
- Publication number 20250081356
- Publication date Mar 6, 2025
- Semiconductor Manufacturing Co., Lid.
- Shen-Min YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250056721
- Publication date Feb 13, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Cheng-Jia LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS FOR ELEC...
- Publication number 20250056731
- Publication date Feb 13, 2025
- Jan FRANCK
- B22 - CASTING POWDER METALLURGY
Information Patent Application
ARCHITECTED LIQUID METAL NETWORKS AND PROCESSES OF MAKING AND USING...
- Publication number 20250040041
- Publication date Jan 30, 2025
- Government of the United States as Represented by the Secretary of the Air Force
- Carl J. Thrasher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Manufacturing Shielded Printed Wiring Board and Shielded...
- Publication number 20250031298
- Publication date Jan 23, 2025
- Tatsuta Electric Wire & Cable Co., Ltd.
- Sirou YAMAUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR POWER ENTITY AND METHOD FOR PRODUCING SUCH ENTITY BY...
- Publication number 20250022840
- Publication date Jan 16, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Lasse Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board
- Publication number 20240422920
- Publication date Dec 19, 2024
- Avary Holding (Shenzhen) Co., Limited.
- WEN-ZHU WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE WET CHANNELS FOR WATER DRAINAGE PPLICATIONS
- Publication number 20240421104
- Publication date Dec 19, 2024
- SAUDI ARABIANOIL COMPANY
- Dong Kyu Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER THIN-FILM FPCB AND HEATER
- Publication number 20240414852
- Publication date Dec 12, 2024
- Seoul National University R&DB Foundation
- Seung Hwan KO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINTERING PASTE, METHOD FOR ELECTRICALLY CONDUCTIVE, MATERIALLY BON...
- Publication number 20240381539
- Publication date Nov 14, 2024
- MAHLE International GmbH
- Matthias Tuerpe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING THERMAL INTERFACE MATERIAL
- Publication number 20240381523
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Wanjae JU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Soldering an Electronic Component to a Circuit Board by...
- Publication number 20240373563
- Publication date Nov 7, 2024
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Treatments characterised by their effect

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

System and method for controlling flow of solder in a wave solderin...

Wiring board and method for manufacturing same

System and method for controlling flow of solder in a wave solderin...

Method for soldering an electronic component to a circuit board by...

Manufacture of a curved electronic device using differential heatin...

Metal-containing fabrics and membranes, and method of manufacturing...

Electronic devices including vent openings and associated methods

Circuit board with convex shaped post, light emitting device, and m...

Method for manufacturing an electronic device

On-vehicle illumination device and production method therefor

Method for shielding a printed circuit board from electromagnetic i...

Process for localized repair of graphene-coated lamination stacks a...

Interconnect structure for insertion loss reduction in signal trans...

Transparent composite nanowire electrodes

Ceramic-cladded copper plate and method for manufacturing ceramic-c...

Methods for producing an etch resist pattern on a metallic surface

Component carrier with embedded semiconductor component and embedde...

Connection method for chip and circuit board, and circuit board ass...

Printed circuit board and method of fabricating the same

Etching device and etching method using the same

Droplet actuator fabrication apparatus, systems, and related methods

Oxygen and humidity control in storage device

Wiring board and method for manufacturing wiring board

Method for manufacturing shielded printed wiring board and shielded...

Hermetic metallized via with improved reliability

Circuit board and method for producing circuit board

Ceramic-copper composite, ceramic circuit board, power module, and...

System and method for creating orthogonal solder interconnects

Semi-automatic corrosion box of copper clad laminate

Layered device for pressure treatment and method

Patents Applicationslast 30 patents

DROPLET ACTUATOR FABRICATION APPARATUS, SYSTEMS, AND RELATED METHODS

METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE

PHOTOSENSITIVE MULTILAYER RESIN FILM, PRINTED WIRING BOARD, SEMICON...

CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING CERAMIC SUBSTRATE

METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE

Sintering Methods

SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

LAMINATE, FILM, THERMOSETTING FILM, AND MANUFACTURING METHOD OF WIR...

INTRISICALLY SAFE DESIGNED DEVICES AND METHODS THEREFOR

METAL-COATED SUBSTRATES, INTERPOSERS, AND METHODS FOR PRODUCTION TH...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

POWER METHOD FOR HIGHER CURRENT ASIC POWER DELIVERY

PORTABLE BAKING ASSEMBLY TO CURE THERMAL INTERFACE MATERIAL FOR PRO...

MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING ME...

SYSTEM AND METHOD FOR CONTROLLING FLOW OF SOLDER IN A WAVE SOLDERIN...

SYSTEM AND METHOD FOR CONTROLLING FLOW OF SOLDER IN A WAVE SOLDERIN...

PRINTED CIRCUIT BOARD

ELECTRICAL CIRCUIT FORMING METHOD AND ELECTRICAL CIRCUIT FORMING AP...

OXYGEN AND HUMIDITY CONTROL IN STORAGE DEVICE

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

DEVICE AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS FOR ELEC...

ARCHITECTED LIQUID METAL NETWORKS AND PROCESSES OF MAKING AND USING...

Method for Manufacturing Shielded Printed Wiring Board and Shielded...

SEMICONDUCTOR POWER ENTITY AND METHOD FOR PRODUCING SUCH ENTITY BY...

Circuit board

SELECTIVE WET CHANNELS FOR WATER DRAINAGE PPLICATIONS

METHOD FOR MANUFACTURING MULTILAYER THIN-FILM FPCB AND HEATER

SINTERING PASTE, METHOD FOR ELECTRICALLY CONDUCTIVE, MATERIALLY BON...

ELECTRONIC DEVICE INCLUDING THERMAL INTERFACE MATERIAL

Method for Soldering an Electronic Component to a Circuit Board by...