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H05K2203/07

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

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H05K2203/07Treatments involving liquids

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Component carrier with partially metallized hole using anti-plating...
- Patent number 12,295,108
- Issue date May 6, 2025
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Jiangfeng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic-cladded copper plate and method for manufacturing ceramic-c...
- Patent number 12,284,766
- Issue date Apr 22, 2025
- BYD Company Limited
- Wei Zhou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring circuit board and producing method thereof
- Patent number 12,279,367
- Issue date Apr 15, 2025
- Nitto Denko Corporation
- Rihito Fukushima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for forming engineered thermal paths of printed circuit boa...
- Patent number 12,262,464
- Issue date Mar 25, 2025
- Matthew D. Neely
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper-clad laminate plate and printed wiring board
- Patent number 12,262,469
- Issue date Mar 25, 2025
- Mitsui Mining & Smelting Co., Ltd.
- Daisuke Nakajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selectively applied protective layer on exposed materials of electr...
- Patent number 12,262,478
- Issue date Mar 25, 2025
- Intel Corporation
- Jin Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and wiring board manufacturing method
- Patent number 12,250,773
- Issue date Mar 11, 2025
- Shinko Electric Industries Co., Ltd.
- Toshiaki Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of preparing a high density interconnect printed circuit boa...
- Patent number 12,245,383
- Issue date Mar 4, 2025
- Atotech Deutschland GmbH & Co. KG
- Bert Reents
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 12,238,852
- Issue date Feb 25, 2025
- Avary Holding (Shenzhen) Co., Limited.
- Ying Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,232,268
- Issue date Feb 18, 2025
- Ibiden Co., Ltd.
- Hirotaka Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for electrochemical process
- Patent number 12,227,866
- Issue date Feb 18, 2025
- Yuming Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Etching device and etching method using the same
- Patent number 12,217,978
- Issue date Feb 4, 2025
- Samsung Display Co., Ltd.
- Wonje Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 12,177,978
- Issue date Dec 24, 2024
- Toppan Printing Co., Ltd.
- Jun Onohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit board and method of manufacturing flexible...
- Patent number 12,177,977
- Issue date Dec 24, 2024
- Sumitomo Electric Industries, Ltd.
- Koji Nitta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board having a wiring pattern that has a multi-layer structure
- Patent number 12,160,954
- Issue date Dec 3, 2024
- Shinko Electric Industries Co., Ltd.
- Yusuke Gozu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plasma treatments for flexures of hard disk drives
- Patent number 12,129,567
- Issue date Oct 29, 2024
- Hutchinson Technology Incorporated
- Kurt F. Fischer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Patterned article including electrically conductive elements
- Patent number 12,133,327
- Issue date Oct 29, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring structure, method for manufacturing same, and semiconductor...
- Patent number 12,114,437
- Issue date Oct 8, 2024
- Resonac Corporation
- Masaya Toba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 12,107,327
- Issue date Oct 1, 2024
- Dai Nippon Printing Co., Ltd.
- Koichi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic substrate manufacturing method
- Patent number 12,108,540
- Issue date Oct 1, 2024
- AMOSENSE CO., LTD.
- Kyung Whan Woo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semi-automatic corrosion box of copper clad laminate
- Patent number 12,101,892
- Issue date Sep 24, 2024
- Dalian University of Technology
- Shengming Li
- B32 - LAYERED PRODUCTS
Information Patent Grant
Laminate and preparing method thereof
- Patent number 12,091,767
- Issue date Sep 17, 2024
- Microcosm Technology Co., Ltd.
- Bo-Hung Lai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electromagnetic wave transmission board comprising an inner board w...
- Patent number 12,074,357
- Issue date Aug 27, 2024
- BOARDTEK ELECTRONICS CORPORATION
- Chung-Hsing Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder paste stencil with aperture wall coating
- Patent number 12,069,810
- Issue date Aug 20, 2024
- SanDisk Technologies, Inc.
- Fakhrozi Bin Che Ani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated film structure and method for manufacturing laminated fil...
- Patent number 12,069,809
- Issue date Aug 20, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kazuya Shimada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturing sequences for high density interconnect printed circu...
- Patent number 12,063,751
- Issue date Aug 13, 2024
- Atotech Deutschland GmbH & Co. KG
- Akif Özkök
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 12,063,750
- Issue date Aug 13, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Ying-Qiu Zheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of manufacturing circuit board and circuit board assembly
- Patent number 12,063,752
- Issue date Aug 13, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Wen-Zhu Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 12,057,670
- Issue date Aug 6, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Hsuan Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for a printed wiring board
- Patent number 12,058,812
- Issue date Aug 6, 2024
- Sumitomo Electric Industries, Ltd.
- Takuto Hidani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE
- Publication number 20250151195
- Publication date May 8, 2025
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stamping Surface Profile in Design Layer and Using Patterned Electr...
- Publication number 20250137159
- Publication date May 1, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Heinrich TRISCHLER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Stamping Surface Profile in Design Layer and Filling an Indentation...
- Publication number 20250142736
- Publication date May 1, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Heinrich TRISCHLER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE PRODUCTION METHOD, WIRING SUBSTRATE, RETICLE, AND...
- Publication number 20250142731
- Publication date May 1, 2025
- Resonac Corporation
- Kei TOGASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A CIRCUIT BOARD STRUCTURE
- Publication number 20250133665
- Publication date Apr 24, 2025
- TRIPOD (WUXI) ELECTRONIC CO., LTD.
- CHI SUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20250120010
- Publication date Apr 10, 2025
- Shinko Electric Industries Co., Ltd.
- Tatsuki Sumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250089171
- Publication date Mar 13, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seung Min Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECTING MOTION OF DROPLETS USING DIFFERENTIAL WETTING
- Publication number 20250065326
- Publication date Feb 27, 2025
- Volta Labs, Inc.
- Udayan Umapathi
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
MANUFACTURING METHOD FOR CONDUCTIVE SUBSTRATE
- Publication number 20250056733
- Publication date Feb 13, 2025
- FUJIFILM CORPORATION
- Akira ICHIKI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIRING SUBSTRATE
- Publication number 20250048562
- Publication date Feb 6, 2025
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ARCHITECTED LIQUID METAL NETWORKS AND PROCESSES OF MAKING AND USING...
- Publication number 20250040041
- Publication date Jan 30, 2025
- Government of the United States as Represented by the Secretary of the Air Force
- Carl J. Thrasher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD TO MAKE THIN FILM ELECTRICALLY-CONDUCTIVE PATTERN
- Publication number 20250040055
- Publication date Jan 30, 2025
- James S. Honan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ARTICLE WITH CATALYTIC INK AND ELECTRICALLY-CONDUCTIVE PATTERN
- Publication number 20250040044
- Publication date Jan 30, 2025
- James S. Honan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROVIDING ARTICLE WITH ELECTRICALLY-CONDUCTIVE PATTERN
- Publication number 20250040056
- Publication date Jan 30, 2025
- Danielle A. Farmer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250016921
- Publication date Jan 9, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sang Ho JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED ARTICLE INCLUDING ELECTRICALLY CONDUCTIVE ELEMENTS
- Publication number 20250016916
- Publication date Jan 9, 2025
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240431031
- Publication date Dec 26, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING METHOD AND PACKAGING DEVICE FOR PCBA BOARD
- Publication number 20240431033
- Publication date Dec 26, 2024
- KONIG ELECTRONIC TECHNOLOGY CO., LTD
- Jianxiao ZHU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DESIGN OF A RECYCLABLE ELECTRONIC DEVICE
- Publication number 20240431037
- Publication date Dec 26, 2024
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Stephan HARKEMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board
- Publication number 20240422920
- Publication date Dec 19, 2024
- Avary Holding (Shenzhen) Co., Limited.
- WEN-ZHU WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT-FORMING METHOD AND CIRCUIT-FORMING APPARATUS
- Publication number 20240422916
- Publication date Dec 19, 2024
- FUJI CORPORATION
- Kenji TSUKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20240421471
- Publication date Dec 19, 2024
- DAI NIPPON PRINTING CO., LTD.
- Koichi SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240407086
- Publication date Dec 5, 2024
- Sumitomo Electric Industries, Ltd.
- Yukie TSUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SELECTIVE METALLISATION OF INORGANIC DIELECTRICS OR SEMI...
- Publication number 20240407107
- Publication date Dec 5, 2024
- Valstybinis Moksliniu Tyrimu Institutas Fiziniu Ir Technologijos Mokslu Centras
- Karolis RATAUTAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE WIRING CIRCUIT BOARD
- Publication number 20240397609
- Publication date Nov 28, 2024
- Nitto Denko Corporation
- Tomoaki TANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF SEGMENTED ELECTROPLATING GOLD FINGER
- Publication number 20240397631
- Publication date Nov 28, 2024
- Gold Circuit Electronics Ltd.
- Chen-Tse Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR...
- Publication number 20240397635
- Publication date Nov 28, 2024
- Resonac Corporation
- Masaya TOBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, DISPLAY APPARATUS, AND MANUFACTURING METHOD FOR CIRC...
- Publication number 20240365478
- Publication date Oct 31, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Guoteng LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE MULTILA...
- Publication number 20240349427
- Publication date Oct 17, 2024
- TOPPAN Holdings Inc.
- Takehisa TAKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240349430
- Publication date Oct 17, 2024
- IBIDEN CO., LTD.
- Kentaro WADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Treatments involving liquids

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Component carrier with partially metallized hole using anti-plating...

Ceramic-cladded copper plate and method for manufacturing ceramic-c...

Wiring circuit board and producing method thereof

Methods for forming engineered thermal paths of printed circuit boa...

Copper-clad laminate plate and printed wiring board

Selectively applied protective layer on exposed materials of electr...

Wiring board and wiring board manufacturing method

Method of preparing a high density interconnect printed circuit boa...

Circuit board and method for manufacturing the same

Wiring substrate and method for manufacturing wiring substrate

Systems and methods for electrochemical process

Etching device and etching method using the same

Circuit board

Flexible printed circuit board and method of manufacturing flexible...

Wiring board having a wiring pattern that has a multi-layer structure

Plasma treatments for flexures of hard disk drives

Patterned article including electrically conductive elements

Wiring structure, method for manufacturing same, and semiconductor...

Wiring board and method for manufacturing wiring board

Ceramic substrate manufacturing method

Semi-automatic corrosion box of copper clad laminate

Laminate and preparing method thereof

Electromagnetic wave transmission board comprising an inner board w...

Solder paste stencil with aperture wall coating

Laminated film structure and method for manufacturing laminated fil...

Manufacturing sequences for high density interconnect printed circu...

Circuit board and method for manufacturing the same

Methods of manufacturing circuit board and circuit board assembly

Semiconductor package structure and method for manufacturing the same

Substrate for a printed wiring board

Patents Applicationslast 30 patents

WIRING SUBSTRATE

Stamping Surface Profile in Design Layer and Using Patterned Electr...

Stamping Surface Profile in Design Layer and Filling an Indentation...

WIRING SUBSTRATE PRODUCTION METHOD, WIRING SUBSTRATE, RETICLE, AND...

METHOD FOR PRODUCING A CIRCUIT BOARD STRUCTURE

WIRING BOARD

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

DIRECTING MOTION OF DROPLETS USING DIFFERENTIAL WETTING

MANUFACTURING METHOD FOR CONDUCTIVE SUBSTRATE

WIRING SUBSTRATE

ARCHITECTED LIQUID METAL NETWORKS AND PROCESSES OF MAKING AND USING...

METHOD TO MAKE THIN FILM ELECTRICALLY-CONDUCTIVE PATTERN

ARTICLE WITH CATALYTIC INK AND ELECTRICALLY-CONDUCTIVE PATTERN

METHOD OF PROVIDING ARTICLE WITH ELECTRICALLY-CONDUCTIVE PATTERN

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PATTERNED ARTICLE INCLUDING ELECTRICALLY CONDUCTIVE ELEMENTS

PRINTED WIRING BOARD

PACKAGING METHOD AND PACKAGING DEVICE FOR PCBA BOARD

DESIGN OF A RECYCLABLE ELECTRONIC DEVICE

Circuit board

CIRCUIT-FORMING METHOD AND CIRCUIT-FORMING APPARATUS

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

PRINTED CIRCUIT BOARD

METHOD FOR SELECTIVE METALLISATION OF INORGANIC DIELECTRICS OR SEMI...

WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE WIRING CIRCUIT BOARD

METHOD OF SEGMENTED ELECTROPLATING GOLD FINGER

WIRING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR...

CIRCUIT BOARD, DISPLAY APPARATUS, AND MANUFACTURING METHOD FOR CIRC...

MULTILAYER WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE MULTILA...

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME