Two-layer arrangements

Industry

CPC
H01L2224/45032

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/45032Two-layer arrangements

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and wire bonding method
- Patent number 11,749,634
- Issue date Sep 5, 2023
- Kioxia Corporation
- Kazuya Maruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising chip contact element of two different electrical...
- Patent number 11,056,458
- Issue date Jul 6, 2021
- Infineon Technologies AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device having a shielding against electromag...
- Patent number 10,455,692
- Issue date Oct 22, 2019
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 9,812,421
- Issue date Nov 7, 2017
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged semiconductor device having a shielding against electromag...
- Patent number 9,736,925
- Issue date Aug 15, 2017
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic devices
- Patent number 9,640,506
- Issue date May 2, 2017
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device with bimetallic interface element for wire bonding
- Patent number 9,184,150
- Issue date Nov 10, 2015
- STMicroelectronics S.R.L.
- Giuseppe Cristaldi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ribbon bonding in an electronic package
- Patent number 8,685,789
- Issue date Apr 1, 2014
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ribbon bonding in an electronic package
- Patent number 8,685,791
- Issue date Apr 1, 2014
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with ribbon with metal layers
- Patent number 8,022,558
- Issue date Sep 20, 2011
- Infineon Technologies AG
- Chee Soon Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ribbon bonding in an electronic package
- Patent number 7,745,253
- Issue date Jun 29, 2010
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor module including solid-liquid...
- Patent number 7,670,879
- Issue date Mar 2, 2010
- Fuji Electric Holdings Co., Ltd.
- Kozo Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD
- Publication number 20210210457
- Publication date Jul 8, 2021
- KIOXIA Corporation
- Kazuya MARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING CHIP CONTACT ELEMENT OF TWO DIFFERENT ELECTRICAL...
- Publication number 20200176412
- Publication date Jun 4, 2020
- INFINEON TECHNOLOGIES AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE HAVING A SHIELDING AGAINST ELECTROMAG...
- Publication number 20170325329
- Publication date Nov 9, 2017
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20160315063
- Publication date Oct 27, 2016
- NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
- Tomohiro UNO
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICES
- Publication number 20140291850
- Publication date Oct 2, 2014
- STMicroelectronics S.r. I.
- Federico Giovanni ZIGLIOLI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Bonded System with Coated Copper Conductor
- Publication number 20140197539
- Publication date Jul 17, 2014
- INFINEON TECHNOLOGIES AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIBBON BONDING IN AN ELECTRONIC PACKAGE
- Publication number 20130134577
- Publication date May 30, 2013
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING SEMICONDUCTOR SUBSTRATE AND MEMS DEVICE
- Publication number 20120299128
- Publication date Nov 29, 2012
- PIONEER MICRO TECHNOLOGY CORPORATION
- Naoki Noda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIBBON BONDING IN AN ELECTRONIC PACKAGE
- Publication number 20100214754
- Publication date Aug 26, 2010
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH RIBBON WITH METAL LAYERS
- Publication number 20100207279
- Publication date Aug 19, 2010
- INFINEON TECHNOLOGIES AG
- Chee Soon Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDIUM-SOLDER-COATED COPPER FOIL RIBBON CONDUCTOR AND METHOD OF CON...
- Publication number 20090044966
- Publication date Feb 19, 2009
- SHOWA SHELL SEKIYU K.K.
- Kenichi Tazawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method of semiconductor module
- Publication number 20070197017
- Publication date Aug 23, 2007
- Fuji Electric Holdings Co., Ltd.
- Kozo Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIBBON BONDING IN AN ELECTRONIC PACKAGE
- Publication number 20070141755
- Publication date Jun 21, 2007
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ribbon bonding in an electronic package
- Publication number 20050269694
- Publication date Dec 8, 2005
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ribbon bonding
- Publication number 20040217488
- Publication date Nov 4, 2004
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS

Two-layer arrangements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and wire bonding method

Package comprising chip contact element of two different electrical...

Packaged semiconductor device having a shielding against electromag...

Bonding wire for semiconductor devices

Packaged semiconductor device having a shielding against electromag...

Method for manufacturing electronic devices

Electronic device with bimetallic interface element for wire bonding

Ribbon bonding in an electronic package

Ribbon bonding in an electronic package

Semiconductor package with ribbon with metal layers

Ribbon bonding in an electronic package

Manufacturing method of semiconductor module including solid-liquid...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD

PACKAGE COMPRISING CHIP CONTACT ELEMENT OF TWO DIFFERENT ELECTRICAL...

PACKAGED SEMICONDUCTOR DEVICE HAVING A SHIELDING AGAINST ELECTROMAG...

BONDING WIRE FOR SEMICONDUCTOR DEVICES

METHOD FOR MANUFACTURING ELECTRONIC DEVICES

Bonded System with Coated Copper Conductor

RIBBON BONDING IN AN ELECTRONIC PACKAGE

METHOD OF BONDING SEMICONDUCTOR SUBSTRATE AND MEMS DEVICE

RIBBON BONDING IN AN ELECTRONIC PACKAGE

SEMICONDUCTOR PACKAGE WITH RIBBON WITH METAL LAYERS

INDIUM-SOLDER-COATED COPPER FOIL RIBBON CONDUCTOR AND METHOD OF CON...

Manufacturing method of semiconductor module

RIBBON BONDING IN AN ELECTRONIC PACKAGE

Ribbon bonding in an electronic package

Ribbon bonding