Ultrasonic bonding

Industry

CPC
H01L2224/80205

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/80205Ultrasonic bonding

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding apparatus and method of fabricating display device using th...
- Patent number 11,798,912
- Issue date Oct 24, 2023
- Samsung Display Co., Ltd.
- Taeyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,557,641
- Issue date Jan 17, 2023
- Samsung Display Co., Ltd.
- Byeong Beom Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing process for separating logic and memory array
- Patent number 10,930,607
- Issue date Feb 23, 2021
- Western Digital Technologies, Inc.
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die encapsulation in oxide bonded wafer stack
- Patent number 10,784,234
- Issue date Sep 22, 2020
- Raytheon Company
- John J. Drab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including a reinforcing member
- Patent number 10,573,852
- Issue date Feb 25, 2020
- Samsung Display Co., Ltd.
- Byoung Yong Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Manufacturing process for separating logic and memory array
- Patent number 10,522,489
- Issue date Dec 31, 2019
- Western Digital Technologies, Inc.
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for direct bonding with self-alignment using ultrasound
- Patent number 10,438,921
- Issue date Oct 8, 2019
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Frank Fournel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die encapsulation in oxide bonded wafer stack
- Patent number 10,242,967
- Issue date Mar 26, 2019
- Raytheon Company
- John J. Drab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jointed body, method for manufacturing same and jointed member
- Patent number 9,821,406
- Issue date Nov 21, 2017
- Kabushiki Kaisha Toyota Chuo Kenkyusho
- Tadashi Oshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for integration of through substrate vias
- Patent number 8,969,200
- Issue date Mar 3, 2015
- The Research Foundation of State University of New York
- Jeremiah Hebding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding of chips on wafers
- Patent number 8,927,335
- Issue date Jan 6, 2015
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for thin die-to-wafer bonding
- Patent number 8,697,542
- Issue date Apr 15, 2014
- The Research Foundation of State University of New York
- Daniel Pascual
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HYBRID BONDING WITH SONIC ENERGY
- Publication number 20240222316
- Publication date Jul 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Pawel Mrozek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240162126
- Publication date May 16, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE
- Publication number 20230225055
- Publication date Jul 13, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING ELEMENT ARRAY, OPTICAL PRINTER HEAD INCLUDING LIGHT-...
- Publication number 20230113637
- Publication date Apr 13, 2023
- KYOCERA CORPORATION
- Takanori WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing Display Device and Display Device Manufact...
- Publication number 20220045039
- Publication date Feb 10, 2022
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Yosuke TSUKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND METHOD OF FABRICATING DISPLAY DEVICE USING TH...
- Publication number 20210305201
- Publication date Sep 30, 2021
- SAMSUNG DISPLAY CO., LTD.
- Taeyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20210265446
- Publication date Aug 26, 2021
- SAMSUNG DISPLAY CO., LTD.
- Byeong Beom KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING PROCESS FOR SEPARATING LOGIC AND MEMORY ARRAY
- Publication number 20200126936
- Publication date Apr 23, 2020
- Western Digital Technologies, Inc.
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING PROCESS FOR SEPARATING LOGIC AND MEMORY ARRAY
- Publication number 20200006268
- Publication date Jan 2, 2020
- Western Digital Technologies, Inc.
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ENCAPSULATION IN OXIDE BONDED WAFER STACK
- Publication number 20190221547
- Publication date Jul 18, 2019
- Raytheon Company
- John J. Drab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE INCLUDING A REINFORCING MEMBER
- Publication number 20190181388
- Publication date Jun 13, 2019
- SAMSUNG DISPLAY CO., LTD.
- Byoung Yong KIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
METHOD FOR DIRECT BONDING WITH SELF-ALIGNMENT USING ULTRASOUND
- Publication number 20180218997
- Publication date Aug 2, 2018
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Frank FOURNEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE, BONDING DEVICE FOR ELEC...
- Publication number 20140111919
- Publication date Apr 24, 2014
- SEIKO EPSON CORPORATION
- Hideo Miyasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR INTEGRATION OF THROUGH SUBSTRATE VIAS
- Publication number 20130270711
- Publication date Oct 17, 2013
- THE RESEARCH FOUNDATION OF STATE UNIVERSITY OF NEW YORK
- Jeremiah HEBDING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR THIN DIE-TO-WAFER BONDING
- Publication number 20130273691
- Publication date Oct 17, 2013
- THE RESEARCH FOUNDATION OF STATE UNIVERSITY OF NEW YORK
- Daniel PASCUAL
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR BONDING OF CHIPS ON WAFERS
- Publication number 20120184069
- Publication date Jul 19, 2012
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING EXTERNAL PADS ON A SEMICONDUCTOR DEVICE, AND SE...
- Publication number 20100140774
- Publication date Jun 10, 2010
- STMicroelectronics S.A.
- Sebastien Pruvost
- H01 - BASIC ELECTRIC ELEMENTS

Ultrasonic bonding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding apparatus and method of fabricating display device using th...

Display device

Manufacturing process for separating logic and memory array

Die encapsulation in oxide bonded wafer stack

Display device including a reinforcing member

Manufacturing process for separating logic and memory array

Method for direct bonding with self-alignment using ultrasound

Die encapsulation in oxide bonded wafer stack

Jointed body, method for manufacturing same and jointed member

Apparatus and method for integration of through substrate vias

Method for bonding of chips on wafers

Method for thin die-to-wafer bonding

Patents Applicationslast 30 patents

HYBRID BONDING WITH SONIC ENERGY

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC MODULE

LIGHT-EMITTING ELEMENT ARRAY, OPTICAL PRINTER HEAD INCLUDING LIGHT-...

Method for Manufacturing Display Device and Display Device Manufact...

BONDING APPARATUS AND METHOD OF FABRICATING DISPLAY DEVICE USING TH...

DISPLAY DEVICE

MANUFACTURING PROCESS FOR SEPARATING LOGIC AND MEMORY ARRAY

MANUFACTURING PROCESS FOR SEPARATING LOGIC AND MEMORY ARRAY

DIE ENCAPSULATION IN OXIDE BONDED WAFER STACK

DISPLAY DEVICE INCLUDING A REINFORCING MEMBER

METHOD FOR DIRECT BONDING WITH SELF-ALIGNMENT USING ULTRASOUND

METHOD FOR MANUFACTURING ELECTRONIC DEVICE, BONDING DEVICE FOR ELEC...

APPARATUS AND METHOD FOR INTEGRATION OF THROUGH SUBSTRATE VIAS

APPARATUS AND METHOD FOR THIN DIE-TO-WAFER BONDING

METHOD FOR BONDING OF CHIPS ON WAFERS

METHOD OF PRODUCING EXTERNAL PADS ON A SEMICONDUCTOR DEVICE, AND SE...