Ultrasonic bonding

Industry

CPC
H01L2224/84205

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/84205Ultrasonic bonding

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device comprising a composite material clip
- Patent number 10,971,457
- Issue date Apr 6, 2021
- Infineon Technologies AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode terminal, semiconductor device, and power conversion appa...
- Patent number 10,714,447
- Issue date Jul 14, 2020
- Mitsubishi Electric Corporation
- Rei Yoneyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and conductive member for semiconductor module...
- Patent number 10,475,667
- Issue date Nov 12, 2019
- Mitsubishi Electric Corporation
- Masakazu Tani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,199,347
- Issue date Feb 5, 2019
- Fuji Electric Co., Ltd.
- Tomohiro Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module comprising fluid cooling channel and method of ma...
- Patent number 10,037,972
- Issue date Jul 31, 2018
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and method of manufacturing power module
- Patent number 9,673,118
- Issue date Jun 6, 2017
- Mitsubishi Electric Corporation
- Masaki Taya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,401,319
- Issue date Jul 26, 2016
- Mitsubishi Electric Corporation
- Takuya Oga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 9,379,049
- Issue date Jun 28, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hiroki Ikeuchi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Monolithic power converter package
- Patent number 9,041,175
- Issue date May 26, 2015
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic Power Converter Package with Through Substrate vias
- Patent number 8,901,742
- Issue date Dec 2, 2014
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic bonding systems and methods of using the same
- Patent number 8,746,537
- Issue date Jun 10, 2014
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power MOSFET having selectively silvered pads for clip and bond wir...
- Patent number 8,653,667
- Issue date Feb 18, 2014
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power MOSFET having selectively silvered pads for clip and bond wir...
- Patent number 8,586,480
- Issue date Nov 19, 2013
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for interconnecting electrical device to a module
- Patent number 8,567,049
- Issue date Oct 29, 2013
- Raytheon Company
- Keith V. Guinn
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device attached to island having protrusion
- Patent number 8,399,970
- Issue date Mar 19, 2013
- ON Semiconductor Trading, Ltd.
- Hiroyoshi Urushihata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,378,467
- Issue date Feb 19, 2013
- Panasonic Corporation
- Chie Fujioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,378,468
- Issue date Feb 19, 2013
- Panasonic Corporation
- Chie Fujioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with welded leads and method of manufacturing...
- Patent number 8,299,620
- Issue date Oct 30, 2012
- Renesas Electronics Corporation
- Takekazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method
- Patent number 8,134,838
- Issue date Mar 13, 2012
- Infineon Technologies AG
- Mark Essert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module having a multi-layer conductor for reducing its r...
- Patent number 8,039,973
- Issue date Oct 18, 2011
- Valeo Etudes Electroniques
- Jean-Michel Morelle
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Metal foil interconnection of electrical devices
- Patent number 8,009,439
- Issue date Aug 30, 2011
- Raytheon Company
- Keith V. Guinn
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 7,863,107
- Issue date Jan 4, 2011
- Renesas Electronics Corporation
- Hideaki Tamimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a coupling conductor having a concav...
- Patent number 7,839,003
- Issue date Nov 23, 2010
- Panasonic Corporation
- Mitsuhiro Hamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic bonding equipment for manufacturing semiconductor device...
- Patent number 7,804,160
- Issue date Sep 28, 2010
- Kabushiki Kaisha Toshiba
- Masataka Nanba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 7,667,307
- Issue date Feb 23, 2010
- Renesas Technology Corp.
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including gate wiring, main electrodes and con...
- Patent number 7,576,392
- Issue date Aug 18, 2009
- Kabushiki Kaisha Toshiba
- Takahiro Kawano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,364,950
- Issue date Apr 29, 2008
- Kabushiki Kaisha Toshiba
- Norihide Funato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,253,507
- Issue date Aug 7, 2007
- Kabushiki Kaisha Toshiba
- Shigeo Kouzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a plurality of semiconductor elements eac...
- Patent number 7,230,273
- Issue date Jun 12, 2007
- Matsushita Electric Industrial Co., Ltd.
- Makoto Kitabatake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,230,322
- Issue date Jun 12, 2007
- Kabushiki Kaisha Toshiba
- Norihide Funato
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240105560
- Publication date Mar 28, 2024
- ROHM CO., LTD.
- Yasuhiro TAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...
- Publication number 20230114535
- Publication date Apr 13, 2023
- STMicroelectronics S.r.l
- Matteo DE SANTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20230078615
- Publication date Mar 16, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Yasuaki YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES
- Publication number 20220320032
- Publication date Oct 6, 2022
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE COMPRISING A SEMICONDUCTOR AND COMPRISING A SH...
- Publication number 20220302072
- Publication date Sep 22, 2022
- DANFOSS SILICON POWER GMBH
- André Bastos Abibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING A COMPOSITE MATERIAL CLIP
- Publication number 20190333874
- Publication date Oct 31, 2019
- INFINEON TECHNOLOGIES AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic module comprising fluid cooling channel and method of ma...
- Publication number 20160322333
- Publication date Nov 3, 2016
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME
- Publication number 20140048584
- Publication date Feb 20, 2014
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power MOSFET Having Selectively Silvered Pads for Clip and Bond Wir...
- Publication number 20140042624
- Publication date Feb 13, 2014
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130307130
- Publication date Nov 21, 2013
- MITSUBISHI ELECTRIC CORPORATION
- Takuya Oga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Monolithic Power Converter Package with Through Substrate Vias
- Publication number 20130256905
- Publication date Oct 3, 2013
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Monolithic Power Converter Package
- Publication number 20130257524
- Publication date Oct 3, 2013
- INTERNATIONAL RECTIFIER CORPORATION (EL SEGUNDO, CA)
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20130207252
- Publication date Aug 15, 2013
- RENESAS ELECTRONICS CORPORATION
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Small-Outline Package for a Power Transistor
- Publication number 20130049079
- Publication date Feb 28, 2013
- INTERNATIONAL RECTIFIER CORPORATION
- Jorge Munoz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20130009300
- Publication date Jan 10, 2013
- Renesas Electronics Corporation
- Yuichi Yato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120034742
- Publication date Feb 9, 2012
- Renesas Electronics Corporation
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110316135
- Publication date Dec 29, 2011
- ON SEMICONDUCTOR TRADING, LTD.
- Hiroyoshi URUSHIHATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal foil interconnection of electrical devices
- Publication number 20110278350
- Publication date Nov 17, 2011
- Keith V. Guinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110163431
- Publication date Jul 7, 2011
- PANASONIC CORPORATION
- Chie Fujioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110163392
- Publication date Jul 7, 2011
- PANASONIC CORPORATION
- Chie Fujioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20110073921
- Publication date Mar 31, 2011
- Renesas Electronics Corporation
- Hideaki TAMIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC BONDING EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20100323476
- Publication date Dec 23, 2010
- KABUSHIKI KAISHA TOSHIBA
- Masataka Nanba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100105174
- Publication date Apr 29, 2010
- RENESAS TECHNOLOGY CORP.
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD
- Publication number 20100014269
- Publication date Jan 21, 2010
- INFINEON TECHNOLOGIES AG
- Mark Essert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20090218676
- Publication date Sep 3, 2009
- RENESAS TECHNOLOGY CORP.
- Kuniharu MUTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND ULTRASONIC BONDING...
- Publication number 20090209065
- Publication date Aug 20, 2009
- Hideo NISHIUCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Module and a Method of Assembling Such a Module
- Publication number 20090179336
- Publication date Jul 16, 2009
- VALEO ETUDES ELECTRONIQUES
- Jean-Michel Morelle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20090152697
- Publication date Jun 18, 2009
- RENESAS TECHNOLOGY CORP.
- Hideaki Tamimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal foil interconnection of electrical devices
- Publication number 20090140427
- Publication date Jun 4, 2009
- Raytheon Company
- Keith V. Guinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20090079006
- Publication date Mar 26, 2009
- Kabushiki Kaisha Toshiba
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS

Ultrasonic bonding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device comprising a composite material clip

Electrode terminal, semiconductor device, and power conversion appa...

Semiconductor module and conductive member for semiconductor module...

Semiconductor device

Electronic module comprising fluid cooling channel and method of ma...

Power module and method of manufacturing power module

Semiconductor device

Semiconductor apparatus

Monolithic power converter package

Monolithic Power Converter Package with Through Substrate vias

Ultrasonic bonding systems and methods of using the same

Power MOSFET having selectively silvered pads for clip and bond wir...

Power MOSFET having selectively silvered pads for clip and bond wir...

Method for interconnecting electrical device to a module

Semiconductor device attached to island having protrusion

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device with welded leads and method of manufacturing...

Semiconductor module and method

Electronic module having a multi-layer conductor for reducing its r...

Metal foil interconnection of electrical devices

Semiconductor device and manufacturing method of the same

Semiconductor device including a coupling conductor having a concav...

Ultrasonic bonding equipment for manufacturing semiconductor device...

Semiconductor device

Semiconductor device including gate wiring, main electrodes and con...

Semiconductor device and method of manufacturing the same

Semiconductor device

Semiconductor device with a plurality of semiconductor elements eac...

Semiconductor device and method of manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES

SEMICONDUCTOR MODULE COMPRISING A SEMICONDUCTOR AND COMPRISING A SH...

SEMICONDUCTOR DEVICE COMPRISING A COMPOSITE MATERIAL CLIP

Electronic module comprising fluid cooling channel and method of ma...

ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME

Power MOSFET Having Selectively Silvered Pads for Clip and Bond Wir...

SEMICONDUCTOR DEVICE

Monolithic Power Converter Package with Through Substrate Vias

Monolithic Power Converter Package

Semiconductor Device

Small-Outline Package for a Power Transistor

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Metal foil interconnection of electrical devices

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

ULTRASONIC BONDING EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR DEVICE...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE AND METHOD

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND ULTRASONIC BONDING...

Electronic Module and a Method of Assembling Such a Module

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Metal foil interconnection of electrical devices

SEMICONDUCTOR APPARATUS